LG Electronics 32LM640S/640T-ZA Servicing Precautions, Electrostatically Sensitive ES Devices

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SERVICING PRECAUTIONS

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication.

NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1.Always unplug the receiver AC power cord from the AC power source before;

a.Removing or reinstalling any component, circuit board mod- ule or any other receiver assembly.

b.Disconnecting or reconnecting any receiver electrical plug or other electrical connection.

c.Connecting a test substitute in parallel with an electrolytic capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explo- sion hazard.

2.Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3.Do not spray chemicals on or near this receiver or any of its assemblies.

4.Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength) CAUTION: This is a flammable mixture.

Unless specified otherwise in this service manual, lubrication of contacts in not required.

5.Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6.Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7.Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.

Always remove the test receiver ground lead last.

8.Use with this receiver only the test fixtures specified in this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged eas- ily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component dam- age caused by static by static electricity.

1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alter- natively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent poten- tial shock reasons prior to applying power to the unit under test.

2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or expo- sure of the assembly.

3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4.Use only an anti-static type solder removal device. Some solder removal devices not classified as “anti-static” can generate electrical charges sufficient to damage ES devices.

5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electri- cally shorted together by conductive foam, aluminum foil or comparable conductive material).

7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8.Minimize bodily motions when handling unpackaged replace- ment ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity suf- ficient to damage an ES device.)

General Soldering Guidelines

1.Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2.Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3.Keep the soldering iron tip clean and well tinned.

4.Thoroughly clean the surfaces to be soldered. Use a mall wire- bristle (0.5 inch, or 1.25 cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5.Use the following unsoldering technique

a.Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F)

b.Heat the component lead until the solder melts.

c.Quickly draw the melted solder with an anti-static, suction- type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

6.Use the following soldering technique.

a.Allow the soldering iron tip to reach a normal temperature (500 °F to 600 °F)

b.First, hold the soldering iron tip and solder the strand against the component lead until the solder melts.

c.Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the compo- nent lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d.Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.

Copyright ©

LG Electronics. Inc. All rights reserved.

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LGE Internal Use Only

Only for training and service purposes

 

 

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Contents MODEL 32LM640S/640T 32LM640S/640T-ZASERVICE MANUAL LED LCD TVCONTENTS Only for training and service purposesCopyright LG Electronics. Inc. All rights reservedSAFETY PRECAUTIONS IMPORTANT SAFETY NOTICEBefore returning the receiver to the customer Leakage Current Cold CheckAntenna Cold CheckSERVICING PRECAUTIONS Electrostatically Sensitive ES DevicesIC Remove/Replacement ReplacementSmall-Signal Discrete Transistor Removal/Replacement RemovalSPECIFICATION 4. Model General Specification1. Application range 2. Requirement for TestSymbolrate 4.0Msymbols/s to 7.2Msymbols/ssymbolrate DVB-S2 8PSK / QPSK 2 ~ 45Msymbol/s5. Component Video Input Y, Cb/Pb, Cr/Pr 6. RGB input PC7. HDMI Input 7.1. DTV mode 7.2. PC modeADJUSTMENT INSTRUCTION 3. Automatic Adjustment1. Application Range 2. Designation3.2. MAC address D/L, CI+ key D/L, Widevine key D/L, ESN D/L 3.4. LAN PORT INSPECTIONPING TESTSET PC 3.3. LAN3.7. WIFI MAC ADDRESS CHECK 3.5. Model name & Serial number Download3.6. CI+ Key checking method 3.5.1. Model name & Serial number D/L4. Manual Adjustment 4.1.1. Overview4.1.2. Equipment 4.1.3. Download method4.2. White Balance Adjustment 4.2.4. Adj. Command Protocol4.2.1. Overview 4.2.2. Equipment4.5. Magic Motion Remote control test 4.3. EYE-Q function check4.4. Local Dimming Function Check 4.2.7. LED White balance table4.7. Wi-Fi Test 4.6. 3D function test4.8. LNB voltage and 22KHz tone check 4.9. Option selection per country5. Audio 6. USB S/W DownloadService only4.12. GND and Internal Pressure check BLOCK DIAGRAM SideRear HDMIEXPLODED VIEW IMPORTANT SAFETY NOTICEEAX6430790* LD22* / LC22 EAX6443420* LT22* / LJ22* / LA22* / LB22 NVRAMX-TAL JTAG 10KPlace at JACK SIDE PLACE AT JACK SIDEPLACE AT JACK SIDE 12.5TGASKITSMDUSB1 SMD Gaskit12.5TGASKITSMDUSB3 PLACE AT MAIN SOC SIDE PLACE AT JACK SIDEPLACE AT IC6000 IC701 H5TQ2G63BFR-PBC IC703H5TQ2G63BFR-PBC IC105 LGE2112Copyright 2012 LG Electronics. Inc. All rights reserved FROM LIPS & POWER B/D PowerDETPANELPOWER On-semiRenesas MICOM For DebugMICOM MODEL OPTION Eye Sensor OptionHDMI1 UI HDMI3HDMI4 UI HDMI2RGB/ PC AUDIO/ SPDIF SPDIF OUTPC AUDIO JK3603 SLIM-15F-D-2ESD for MTK JACKCOMMONCVBS 1 PHONE JACK RS232CCOMPONENT 1 PHONE JACK IR & KEY Zener Diode isclose to wafer RGB SensorUSBWIFI +5VUSB FOR USB1USB1 USB2 MAX 1.5ASCART GENDER Full Scart18 Pin Gender2011.10.26 ZigBeeRadio Pulse MREMOTE OPTION ALL MREMOTE OPTIONAR4800 1/16WEthernet Block IC5800 STA380BWGP4MT5369 2011.11.21SCART AUDIO MUTE AUDOUT EU/CHINAHOTELOPTIC6000 A Z4580MTR-E1EARPHONE AMP HEADPHONE AMPOption FOR MTK Option FOR LG1152T/C/S & H/NIM & T2/C TUNEREU & CHINA Vout=0.6*1+R1/R2TU6500 TU6501OptionLNB DVB-S2 LNB Part AllegroDCDCGND and AGND are connected DCDCGND and AGND are connected in pin#27AUDIO OUT JACK OPTCOMMEREXTAMP COMMEREXTAMPJACK FOR COMMERCIAL 12V OUT RS-232C 9 PIN OPTCOMMEREXT12VFOR COMMERCIAL AUDIO OUT OPTCOMMEREXTAMP COMMERCIALOPTIONLVDS 51Pin LVDS OUTPUT Connector 41Pin LVDS OUTPUT ConnectorLVDSHIGHMID 2011.08.11AR7600 LOCAL DIMMINGL/DIMOUT POWER BLOCK THIS IS REVERSE PATTERNLEVEL SHIFTER BLOCK T-ConDon’t Connect Power At VDDI eMMC I/FHYNIXEMMC2GB Just Interal LDO CapacitorPlace Near Micom LOGOLIGHT R8901 10KPage Applicable Model XXLM760S-ZB 2012 LED/LCD TV Engineering guideCONTENT New features Main PCBs Block Diagrams, IIC MapInstruction of new sub ass’ys How to use tool Download Adjust way of new features widevine… Repair guideEPI Interface EPIEmbedded Point-Point Interface FeaturesMerits EPI Interface mini-LVDS vs. EPI HF mini-LVDS TCONComparison What to changeHF mini-LVDS Main PCB for Broadband WIFIxxLM760S-ZB Chassis LD22E PCB P/No EAX64307905MTK5369 Block Diagram LM76 Power loadSide RearJack Interface Main SoC MTKFull Scart18 Pin Gender IC6100R 47옴 GP4 Backend block diagram EPI & T-conR0 옴 GP4 Backend block diagram EPI & T-Con EPI CH1/2/3EPI CH4/5/6 50PinGP4 Backend block diagram LVDS Tx & Local Dimming LVDS Tx BlockDual-link LVDS Output LVDSSEL “H”=JEIDA, “L” or NC=VESA LGDInterconnection PCBsCables xxLM760S-ZACircuit Block Diagram Ass’y Picture Pin Configuration2012Y IR + Soft touch PCB Pinmap KEY1, KEY2 Voltage2012Y IR + Soft Touch LED Lighting Scenario Power LED ScenarioSpec 내용 Manual of Touch Sensitivity Introductions of GP4 Sensor Touch ICTouch Key Threshold Level Ta = 25ºC Touch EEPROM Register change with USB port Addr ValueIntroductions of 12Y RF ass’y + Magic Remote control 1. System ™ Pairing Information Transmission Send to TV after PairedPairing Information Transmission Sequence ™ Motion Data Transmissionpower mutehome ← ok →3. M4 Block Diagram AA x 2 BatteryPower Management Connector4. Function list 주요 ItemManufacturer FunctionMethod 5. RF Pairing / Un-pairing MethodDescription Introductions of 12Y WIFI built in ass’y WIFI Built in ass’y featureLGIT Block diagramPin map WIFI built in featureWIFI Built in Block-diagramArcadyan WIFI Built in ass’y Specification 12Y Widevine & HDCP 2.0 & NETFLX 1. Widevine? 2. HDCP 2.0 & NETFLIX? 3. DTCP? 4. Changed BOM1. Widevine? 2. HDCP 2.0 & NETFLIX? ‰ Netflix‰ Why HDCP2.0? ‰ HDCP3. DTCP? 4. Changed BOM As-WasCurrent Æ 추가Only for training and service purposes Contents of LCD TV Standard Repair Process Contents of LCD TV Standard Repair Process Detail Technical Manual Error symptomContent PageMain B/D↔ Power B/D, LVDS Cable,Speaker Cable,IR B/D Cable A2 Check Power Board 24v outputCheck Power Board 12v,3.5v etc Replace T-con Board or module And Adjust VCOMCheck various voltages of Power Board Revised date3.5V,12V,20V or 24V… Normal Y voltage?Check Check RF Signal levelS/W Version Check S/W Version Color error? A10/ A11Check color by input -External Input COMPONENT -RGB ※ Check andExternal device screen error-Color error Vertical/Horizontal bar, residual image, light spotReplace Main B/D adjust VCOM External Input error Component error RGB error HDMI DVICheck Power LED Power LED Y On?Check Power On ‘”High” Measure voltage of each output of Power B/DError? Check Power Off ModeIf Power Off mode is not displayed Check Power B/D voltage Power off Listof Power Board Check user menu Speaker offCheck audio B+ NormalIn case of External Input signal error Check and fix external device Check audio B+ VoltageCheck & Repair Cable connection Connector solder Check IR Output signalCheck 3.5v on Power B/D Replace Power B/D or Replace Main B/D Power B/D don’t have problemExternal Input and Recognition erroraccordance Identify nose type Adjust VCOM F. Exterior defectContents of LCD TV Standard Repair Process Detail Technical Manual Standard Repair Process Detail Technical Manual ALL MODELSEdge LED 24 Pin Power Board ↔ Main BoardSMAW200-H24S YEONHO Only for training and service purposes 1. Checking method for remote controller for adjustment Only for training and service purposes Checking method Only for training and service purposes Appendix Exchange T-Con Board Fuse Open, Abnormal power section Abnormal DisplayGRADATION NoiseAppendix Exchange PSULED driver No LightDim Light No picture/Sound OkAppendix Exchange the Module Un-repairable Cases In this case please exchange the moduleAppendix Exchange the Module Un-repairable Cases In this case please exchange the moduleOnly for training and service purposes For ’10 models, there is no voltage out for st-by purpose When st-by, only 3.5V is normally onEdge LED Edge LED Check “power on” pin is high B. Power error Off when on, off whiling viewing Only for training and service purposes Standard Repair Process Detail Technical ManualALL MODELS dateStandard Repair Process Detail Technical Manual ALL MODELSStandard Repair Process Detail Technical Manual LCD module change T-Con board change