Sony HCD-RG40 specifications HCD-DX30/RG40 Section Electrical Parts List Address Sensor

Page 49

HCD-DX30/RG40

SECTION 8

ELECTRICAL PARTS LIST ADDRESS SENSOR

BD

NOTE:

Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set.

-XX, -X mean standardized parts, so they may have some difference from the original one.

Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.

CAPACITORS: uF: F

RESISTORS

All resistors are in ohms. METAL: metal-film resistor

METAL OXIDE: Metal Oxide-film resistor

F: nonflammable

COILS uH: H

Abbreviation

CND

: Canadian model

AUS

: Australian model

SP

: Singapore model

KR

: Korea model

MX

: Mexican model

AR

: Argentina model

TH

: Thai model

E51

: Chilean and Peruvian model

When indicating parts by reference number, please include the board name.

SEMICONDUCTORS

In each case, u: , for example:

uA...: A... , uPA... , PA... , uPB... , PB... , uPC... , PC... , uPD..., PD...

The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.

Les composants identifiés par une marque

0sont critiques pour la sécurité.

Ne les remplacer que par une pièce portant le numéro spécifié.

Ref. No.

Part No.

Description

 

 

Remarks

Ref. No.

Part No.

Description

 

 

Remarks

 

1-675-911-14

ADDRESS SENSOR BOARD

 

 

C133

1-164-346-11

CERAMIC CHIP

1uF

 

16V

 

 

**********************

 

 

C140

1-164-346-11

CERAMIC CHIP

1uF

 

16V

 

 

 

 

 

 

C141

1-164-346-11

CERAMIC CHIP

1uF

 

16V

 

 

< IC >

 

 

 

C143

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

 

 

 

 

 

 

C145

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

IC711

8-749-016-76

IC RPI-321

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C153

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

 

 

< RESISTOR >

 

 

 

C159

1-163-019-00

CERAMIC CHIP

0.0068uF

10%

50V

 

 

 

 

 

 

C162

1-104-665-11

ELECT

100uF

20.00%

10V

R711

1-247-876-11

CARBON

75K

5%

1/4W

C163

1-104-665-11

ELECT

100uF

20.00%

10V

R712

1-249-409-11

CARBON

220

5%

1/4W F

C165

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

R713

1-249-429-11

CARBON

10K

5%

1/4W

 

 

 

 

 

 

 

 

 

 

 

 

 

C167

1-163-237-11

CERAMIC CHIP

27PF

5.00%

50V

 

 

< SWITCH >

 

 

 

C168

1-163-235-11

CERAMIC CHIP

22PF

5.00%

50V

 

 

 

 

 

 

C171

1-163-009-11

CERAMIC CHIP

0.001uF

10.00%

50V

S711

1-771-821-11

SWITCH, PUSH (1 KEY)(UP DOWN SW)

C172

1-163-123-00

CERAMIC CHIP

180PF

5%

50V

************************************************************

C181

1-163-009-11

CERAMIC CHIP

0.001uF

10.00%

50V

 

A-472-4934-A

BD BOARD, COMPLETE

 

 

C182

1-163-123-00

CERAMIC CHIP

180PF

5%

50V

 

 

*******************

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

< CONNECTOR >

 

 

 

 

 

< CAPACITOR >

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CN101

1-784-741-11

CONNECTOR, FFC 19P

 

 

C101

1-163-005-11

CERAMIC CHIP

470PF

10.00%

50V

CN102

1-793-907-11

CONNECTOR, FFC/FPC 16P

 

 

C102

1-164-004-11

CERAMIC CHIP

0.1uF

10%

25V

 

 

 

 

 

 

 

C103

1-163-005-11

CERAMIC CHIP

470PF

10.00%

50V

 

 

< FERRITE BEAD >

 

 

C104

1-163-009-11

CERAMIC CHIP

0.001uF

10.00%

50V

 

 

 

 

 

 

 

C108

1-164-004-11

CERAMIC CHIP

0.1uF

10%

25V

FB101

1-469-731-21

INDUCTOR

0UH

 

 

 

 

 

 

 

 

FB103

1-469-731-21

INDUCTOR

0UH

 

 

C109

1-163-011-11

CERAMIC CHIP

0.0015uF

10%

50V

 

 

 

 

 

 

 

C110

1-164-182-11

CERAMIC CHIP

0.0033uF

10%

50V

 

 

< IC >

 

 

 

C111

1-163-251-11

CERAMIC CHIP

100PF

5.00%

50V

 

 

 

 

 

 

 

C112

1-107-682-11

CERAMIC CHIP

1uF

10.00%

16V

IC101

8-752-386-85

IC

CXD2587Q

 

 

 

C114

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

IC102

8-759-549-28

IC

BA5974FP-E2

 

 

 

 

 

 

 

 

 

IC103

8-752-085-51

IC

CXA2568M-T6

 

 

 

C115

1-104-665-11

ELECT

100uF

20.00%

10V

 

 

 

 

 

 

 

C116

1-104-665-11

ELECT

100uF

20.00%

10V

 

 

< TRANSISTOR >

 

 

 

C117

1-104-665-11

ELECT

100uF

20.00%

10V

 

 

 

 

 

 

 

C118

1-163-009-11

CERAMIC CHIP

0.001uF

10.00%

50V

Q101

8-729-010-08

TRANSISTOR

MSB710-RT1

 

C119

1-163-235-11

CERAMIC CHIP

22PF

5.00%

50V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

< RESISTOR >

 

 

 

C121

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

 

 

 

 

 

 

 

C122

1-104-665-11

ELECT

100uF

20.00%

10V

R101

1-216-077-00

RES-CHIP

15K

5%

1/10W

C123

1-163-021-91

CERAMIC CHIP

0.01uF

10.00%

50V

R102

1-216-097-11

RES-CHIP

100K

5%

1/10W

C124

1-107-823-11

CERAMIC CHIP

0.47uF

10.00%

16V

R103

1-216-077-00

RES-CHIP

15K

5%

1/10W

C125

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

R104

1-216-085-00

RES-CHIP

33K

5%

1/10W

 

 

 

 

 

 

R105

1-216-073-00

RES-CHIP

10K

5%

1/10W

C126

1-163-038-91

CERAMIC CHIP

0.1uF

 

25V

 

 

 

 

 

 

 

C127

1-104-665-11

ELECT

100uF

20.00%

10V

R106

1-216-049-11

RES-CHIP

1K

5%

1/10W

C129

1-163-031-91

CERAMIC CHIP

0.01uF

 

50V

R107

1-216-073-00

RES-CHIP

10K

5%

1/10W

C130

1-164-346-11

CERAMIC CHIP

1uF

 

16V

R108

1-216-061-00

RES-CHIP

3.3K

5%

1/10W

C131

1-126-964-11

ELECT

10uF

20.00%

50V

R109

1-216-121-11

RES-CHIP

1M

5%

1/10W

 

 

 

 

 

 

R110

1-216-025-11

RES-CHIP

100

5%

1/10W

49

Image 49
Contents NEW SpecificationsKSM-213DCP HCD-DX30/RG40 Safety CHECK-OUTLeakage Exploded Views Table of ContentsHCD-DX30/RG40 Section Service Note HCD-DX30/RG40 Section General Main unitRemote Control Case TOP HCD-DX30/RG40 Section DisassemblyFront Panel Section CD DdorPanel Board Tape Mechanism DeckKEY Board Base Unit Main Board and Power BoardDriver BOARD, Motor Board and Address Sensor Board HCD-DX30/RG40 Section Test Mode Microprocessor version display MC Test ModeError display Aging ModeDisplay action Action contents Final timing Function Change ModeCD Section HCD-DX30/RG40 Section Electrical AdjustmentsRF PLL Free-run Frequency Check Balance 1 Track jump Check+ Line HCD-DX30/RG40 Section DiagramsCircuit Board Location IC701 4 Stop ModeKSM-213DCP Block Diagrams TUNER/CD SectionTC Block Main SectionIC B/D IC B/D Schematic Diagram Main /4 HCD-DX30/RG40 Semiconductor Location IC 3Semiconductor Printed Wiring Board BD SectionTPFE0 IC B/D AEP,KR Power AMP BoardSchematic Diagram Power AMP Section Panel Board 3333 KEY Board Schematic Diagram KEY Section IC701 IC B/D AEP US,CND,SP,E,AR,E51AEP,SP,E,AR,E51 US,CND SP,E,AR,E51,AUS Except SP,E,AR,E51Schematic Diagram Trans Section 4040 Sbsy Panel Board IC701 UPD780232GC-031-8BT Display ControlIC101 BA1450 Main Board IC Block DiagramsIC701 BA6956AN Driver Board CXA2568M-T BD Board Exploded Views FLD1 Main Board Section CD Mechanism Deck Section HCD-DX30/RG40 Section Electrical Parts List Address Sensor HCD-DX30/RG40 BD Driver KEY KEY Main Mylar HCD-DX30/RG40 MainPLUG, Connector 3P CONNECTOR, FFC 17P CN5PLUG, Connector 2P Diode FilmTerminal Front ENDTERMINAL, Earth TRANSFORMER, ifPhoto Interrupter TRANSFORMER, Bias OscillationBA1A4M-TP BN1F4M-TPR112 216-829-11 Metal Oxide DX30AR,AUS,E,E51,MX,SP,TH,RG40HCD-DX30/RG40 Main Motor Screw +BVTT HCD-DX30/RG40 PanelDiode LTL77HKYTNNTAPE A/B RG40 Indicator TUBE, Fluorescent Inductor 0UH Fluorescent Indicator FLD1SWITCH, Keyboardmdvideo SWITCH, Keyboardtape A/BHCD-DX30/RG40 Power AMP HCD-DX30/RG40 Power AMP Sensor SUB Trans Trans Video OUT HCD-DX30/RG40 Revision History

HCD-RG40, HCD-DX30 specifications

The Sony HCD-DX30 and HCD-RG40 are both versatile systems that exemplify Sony's commitment to delivering exceptional audio quality within compact designs. These home audio systems combine innovative technologies with user-friendly features to enhance your listening experience.

The HCD-DX30 is designed for users who appreciate powerful sound in a straightforward package. This component system includes a combination of CD player, radio tuner, and cassette deck, catering to various preferences. One of its main features is the Mega Bass technology, which boosts low frequencies, delivering a rich and immersive audio experience for music lovers. Additionally, the system supports multiple audio formats, allowing users to enjoy their favorite tunes from CD, cassette, or radio. The implementation of a built-in equalizer allows listeners to customize the sound to match their preferences, ensuring the best playback for any genre.

On the other hand, the HCD-RG40 takes another step forward with its sleek design and modern features. This system integrates the characteristics of the DX30 but enhances them with additional connectivity options. It includes a USB port that allows users to connect flash drives and play digital music files directly, supporting various formats for flexibility. The presence of Bluetooth technology in the HCD-RG40 opens up wireless music streaming possibilities, enabling users to play music from smartphones, tablets, or laptops without the hassle of cables.

Both systems also offer a variety of output options, including headphone jacks and auxiliary inputs, making them compatible with a range of devices. Another notable feature is their timed shut-off function, which contributes to energy efficiency by automatically turning off the system when not in use.

In summary, the Sony HCD-DX30 and HCD-RG40 represent the advancements in home audio systems, showcasing a blend of classic components with modern technology. The HCD-DX30 shines with its robust sound features tailored for traditional media, while the HCD-RG40 caters to the contemporary user with its wireless connectivity and support for digital formats. Whether you’re a casual listener or an audiophile, these systems offer the audio versatility needed for an exceptional home entertainment experience.