Samsung LTM1555(B) Servicing Precautions, Electrostatically Sensitive Devices ESD Precautions

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1 Precautions

1-2 Servicing Precautions

CONFIDENTIAL

WARNING: An electrolytic capacitor installed with the wrong polarity might explode.

Caution: Before servicing units covered by this service manual, read and follow the Safety Precautions section of this manual.

Note:If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions, always follow the safety precautions.

1-2-1 General Servicing Precautions

1.Always unplug the unit’s AC power cord from the AC power source and disconnect the DC Power Jack before attempting to:

(a)remove or reinstall any component or assembly,

(b)disconnect PCB plugs or connectors, (c) connect a test component in parallel with an electrolytic capacitor.

2.Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used. The internal wiring is sometimes clamped to prevent contact with thermally hot components. Reinstall all such elements to their original position.

3.After servicing, always check that the screws, components and wiring have been correctly reinstalled. Make sure that the area around the serviced part has not been damaged.

4.Check the insulation between the blades of the AC plug and accessible conductive parts (examples: metal panels, input terminals and earphone jacks).

5.Insulation Checking Procedure: Disconnect the power cord from the AC source and turn the power switch ON. Connect an insulation resistance meter (500 V) to the blades of the AC plug.

The insulation resistance between each blade of the AC plug and accessible conductive parts (see above) should be greater than 1 megohm.

6.Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive lead; always remove the instrument’s ground lead last.

1-3 Electrostatically Sensitive Devices (ESD) Precautions

Some semiconductor (solid state) devices can be easily damaged by static electricity. Such components are commonly called Electrostatically Sensitive Devices (ESD). Examples of typical ESD are integrated circuits and some field-effect transistors. The following techniques will reduce the incidence of component damage caused by static electricity.

1.Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from your body by touching a known earth ground. Alternatively, wear a discharging wrist- strap device. To avoid a shock hazard, be sure to remove the wrist strap before applying power to the monitor.

2.After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent accumulation of an electrostatic charge.

3.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESDs.

4.Use only a grounded-tip soldering iron to solder or desolder ESDs.

5.Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static” can generate electrical charges sufficient to damage ESDs.

6.Do not remove a replacement ESD from its protective package until you are ready to install it. Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminum foil or other conductive materials.

7.Immediately before removing the protective material from the leads of a replacement ESD, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution: Be sure no power is applied to the chassis or circuit and observe all other safety precautions.

8.Minimize body motions when handling unpackaged replacement ESDs. Motions such as brushing clothes together, or lifting your foot from a carpeted floor can generate enough static electricity to damage an ESD.

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LTM1555(B)/LTM1755(B)

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Contents TFT-LCD Monitor BN82-00071A-00 Precautions Safety PrecautionsServicing Precautions Electrostatically Sensitive Devices ESD PrecautionsProduct Specifications SpecificationsPin Assignments Sync Type Pin No Separate H/VTiming Chart IBM VesaMemo Disassembly and Reassembly DisassemblyReassembly Alignments and Adjustments General Alignment InstructionAdjustment Instruction Service functionTroubleshooting No PowerNo Video PC Signal No Picture TV, Video, S-Video No Sound Exploded View and Parts List 1 LTM1555B 2 LTM1555B Front 3 LTM1555B Rear 3 LTM1555B Stand 1 LTM1755B 2 LTM1755B Front 3 LTM1755B Rear 3 LTM1755B Stand Electrical Parts List PCB INDUCTOR-AXIAL SCREW-TAPTITER27 ES15UO ES15UO SNALoc. No Code No AL,SMD CERAMIC,CHIPCERAMIC,CHIP AL,SMD Organic CERAMIC,CHIP AL,SMD C43 C533 C619 INDUCTOR-SMD 74F14,INVERTER,SOP,14P,150MILINDUCTOR-SMD Coil CHOKE-SMD PCB Main TR-SMALL Signal Chip R128 R240 R330 R383 R461 R549 STD+C/R +C/RAssy Cover Rear Assy REAR-COVER Bracket Vesa COVER-REAR Assy LCD Assy ChassisLever Bottom Label BAR Code BOX CBF SignalES15UO SNA LXA410TLMU,PE,-,WHITE Gasket ES17UO15P,3R,FEMALE,ANGLE,AUF 2P,-,AU,WHT/REDCORE-FERRITE Bead AL,SMD CERAMIC,CHIP C153 AL,SMD CERAMIC,CHIP CERAMIC,CHIP AL,SMD C510 C610 CN62 IC-CMOS Logic 2007-000132 R15 R2554 R349 R436 R610 R621 Assy LCD Assy Chassis Assy P/MATERIAL GH17LSEOS/NIKE,EGI,T1.2 VIRTUAL,HDTV,ABS V0,GR806PM170MP,PE-LD,PE-HD,-,WHITE M170MP,PE-HD,-,BLUEBlock Diagram Block Diagrams Wiring Diagram CN12 CN11 CN51 CN24 CN25Schematic Diagrams Schematic Diagrams Power Eosventsc Part Schematic Diagram10-2 Micom / Jack Part Schematic Diagram Hpdr10-4 Scalar Eosventsc Part Schematic Diagram JAG10-6 Video Eosventsc Part Schematic Diagram FBL1 FBL2 RIN1 GIN110-8 Audio Part Schematic Diagram OUT GND10-10 Lvds & RAM Eosventsc Part Schematic Diagram VDD4 VSS110-12 Panel Description SECMemo Copyright