Sony NEW, MDM-7A, KMS-2608/J1N Section Electrical Parts List, Description Remarks Ref. No

Page 58

BD

SECTION 8

ELECTRICAL PARTS LIST

Ref.NOTE:No.

Part No.

Description

 

 

Remarks Ref. No.

Part No.

Description

Remarks

• Due to standardization, replacements in the

COILS

 

 

When indicating parts by reference number,

 

parts list may be different from the parts

 

uH: µH

 

 

 

 

 

 

please include the board name.

 

 

specified in the diagrams or the components

SEMICONDUCTORS

 

 

 

 

 

 

 

 

used on the set.

 

 

In each case, u: µ, for example:

 

The components identified by mark 0 or

 

-XX, -X mean standardized parts, so they

 

uA...: µA... , uPA... , µPA... ,

 

dotted line with mark 0 are critical for safety.

 

may have some difference from the original

 

uPB... , µPB... , uPC... , µPC... ,

 

Replace only with part number specified.

 

one.

 

 

 

uPD..., µPD...

 

Les composants identifiés par une marque

 

• Items marked “*” are not stocked since they

Abbreviation

 

0 sont critiques pour la sécurité.

 

 

are seldom required for routine service.

 

CND

: Canadian model

 

Ne les remplacer que par une pièce portant

 

Some delay should be anticipated when

 

SP

: Singapore model

 

le numéro spécifié.

 

 

ordering these items.

 

 

MY

: Malaysia model

 

 

 

 

• CAPACITORS:

 

 

HK

: Hong Kong model

 

 

 

 

uF: µF

 

 

 

AUS

: Australian model

 

 

 

 

RESISTORS

All resistors are in ohms. METAL: metal-film resistor

METAL OXIDE: Metal Oxide-film resistor

F: nonflammable

Ref. No.

Part No.

Description

 

 

Remarks

Ref. No.

Part No.

Description

 

 

Remarks

 

A-4725-054-A

BD BOARD, COMPLETE

 

 

C158

1-162-927-11

CERAMIC CHIP

100PF

5%

50V

 

 

*******************

 

 

C159

1-162-927-11

CERAMIC CHIP

100PF

5%

50V

 

 

 

 

 

 

C160

1-162-927-11

CERAMIC CHIP

100PF

5%

50V

 

 

< CAPACITOR >

 

 

 

C161

1-162-970-11

CERAMIC CHIP

0.01uF

10%

25V

 

 

 

 

 

 

C162

1-162-970-11

CERAMIC CHIP

0.01uF

10%

25V

C101

1-135-259-11

TANTAL. CHIP

10uF

20%

6.3V

 

 

 

 

 

 

C102

1-135-259-11

TANTAL. CHIP

10uF

20%

6.3V

C163

1-125-891-11

CERAMIC CHIP

0.47uF

10%

10V

C103

1-162-970-11

CERAMIC CHIP

0.01uF

10%

25V

C164

1-162-927-11

CERAMIC CHIP

100PF

5%

50V

C104

1-164-227-11

CERAMIC CHIP

0.022uF

10%

25V

C165

1-162-968-11

CERAMIC CHIP

0.0047uF

10%

50V

C105

1-115-416-11

CERAMIC CHIP

1000PF

5%

25V

C166

1-125-891-11

CERAMIC CHIP

0.47uF

10%

10V

 

 

 

 

 

 

C167

1-164-245-11

CERAMIC CHIP

0.015uF

10%

25V

C106

1-162-970-11

CERAMIC CHIP

0.01uF

10%

25V

 

 

 

 

 

 

C107

1-162-970-11

CERAMIC CHIP

0.01uF

10%

25V

C169

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C108

1-162-969-11

CERAMIC CHIP

0.0068uF

10%

25V

C171

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C109

1-164-677-11

CERAMIC CHIP

0.033uF

10%

16V

C172

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C110

1-163-038-91

CERAMIC CHIP

0.1uF

 

25V

C180

1-117-370-11

CERAMIC CHIP

10uF

 

10V

 

 

 

 

 

 

C181

1-126-206-11

ELECT CHIP

100uF

20%

6.3V

C111

1-117-720-11

CERAMIC CHIP

4.7uF

 

10V

 

 

 

 

 

 

C112

1-110-563-11

CERAMIC CHIP

0.068uF

10%

16V

C182

1-163-038-91

CERAMIC CHIP

0.1uF

 

25V

C113

1-162-968-11

CERAMIC CHIP

0.0047uF

10%

50V

C183

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C114

1-125-837-91

CERAMIC CHIP

1uF

10%

6.3V

C184

1-117-970-11

ELECT CHIP

22uF

20%

10V

C115

1-162-966-11

CERAMIC CHIP

0.0022uF

10%

50V

C185

1-131-872-91

CERAMIC CHIP

1000PF

10%

630V

 

 

 

 

 

 

C191

1-126-206-11

ELECT CHIP

100uF

20%

6.3V

C116

1-164-227-11

CERAMIC CHIP

0.022uF

10%

25V

 

 

 

 

 

 

C117

1-162-970-11

CERAMIC CHIP

0.01uF

10%

25V

C192

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C118

1-165-176-11

CERAMIC CHIP

0.047uF

10%

16V

C193

1-126-206-11

ELECT CHIP

100uF

20%

6.3V

C119

1-165-176-11

CERAMIC CHIP

0.047uF

10%

16V

C194

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C120

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C195

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

 

 

 

 

 

 

C196

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C121

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

 

 

 

 

 

 

C125

1-117-720-11

CERAMIC CHIP

4.7uF

 

10V

C1401

1-117-720-11

CERAMIC CHIP

4.7uF

 

10V

C128

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

 

 

 

 

 

 

C131

1-117-720-11

CERAMIC CHIP

4.7uF

 

10V

 

 

< CONNECTOR >

 

 

 

C132

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

 

 

 

 

 

 

 

 

 

 

 

 

CN101

1-766-833-21 CONNECTOR, FFC/FPC (ZIF) 21P

 

C133

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

CN102

1-784-835-21 CONNECTOR, FFC (LIF(NON-ZIF)) 27P

 

C141

1-126-206-11

ELECT CHIP

100uF

20%

6.3V

CN103

1-784-834-21 CONNECTOR, FFC (LIF(NON-ZIF)) 23P

 

C142

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

* CN104

1-580-055-21 PIN, CONNECTOR (SMD) 2P

 

 

C143

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

CN105

1-784-859-21 CONNECTOR, FFC (LIF(NON-ZIF)) 7P

 

C144

1-162-970-11

CERAMIC CHIP

0.01uF

10%

25V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

< DIODE >

 

 

 

C145

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

 

 

 

 

 

 

C146

1-117-720-11

CERAMIC CHIP

4.7uF

 

10V

D101

8-719-988-61

DIODE 1SS355TE-17

 

 

C147

1-117-720-11

CERAMIC CHIP

4.7uF

 

10V

D181

8-719-080-81

DIODE FS1J6

 

 

 

C151

1-117-370-11

CERAMIC CHIP

10uF

 

10V

D183

8-719-080-81

DIODE FS1J6

 

 

 

C152

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

< IC >

 

 

 

C153

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

 

 

 

 

 

 

C154

1-126-206-11

ELECT CHIP

100uF

20%

6.3V

IC101

8-752-080-95

IC CXA2523AR

 

 

 

C155

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

IC102

8-759-473-51

IC TLV2361CDBV

 

 

 

C156

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

IC141

8-759-430-25

IC BH6511FS

 

 

 

C157

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

IC151

8-752-404-64

IC CXD2662R

 

 

 

58

Image 58
Contents Inputs SpecificationsOutputs SELF-DIAGNOSIS Function Where purchased Power requirementsSupplied accessories GeneralItems of Error History Mode Items and Contents Diagrams Table of ContentsDisassembly Exploded ViewsFlexible Circuit Board Repairing Section Service NotesSafety CHECK-OUT LeakageJIG for Checking BD Board Waveform IOPRecord Precedure Forced Reset Checks Prior to Parts Replacement and AdjustmentsMain Board Component Side Retry Cause Display Mode Bit BinaryHigher Bits Lower Bits Hexa Details Bit When BinaryHexadecimal Binary Section General Section Disassembly Front Panel SectionMain Board PT BOARD, VOL-SEL BoardMechanism Deck Section MDM-7A BD BoardSetting the Test Mode Section Test ModePrecautions for USE of Test Mode Exiting the Test ModeSelecting the Test Mode Display Details Mark GroupOUT Operating the Continuous Playback ModeMID MENU/NOError rate display Test Mode DisplaysMode display Functions of Other ButtonsAutomatic SELF-DIAGNOSIS Function When Memory NG is DisplayedMeanings of Other Displays InformationParts Replacement and Adjustment Section Electrical AdjustmentsCheck before replacement Adjustment flow YESPrecautions for USE of Optical PICK- UP KMS-260B Precautions for Checking Laser Diode EmissionPrecautions for Adjustments Using the Continuously Recorded Disc Checks Prior to RepairsTraverse Check Auto CheckOther Checks Traverse WaveformFocus Bias Check Play Check MO Error Rate CheckCD Error Rate Check Self-Recording/playback CheckTemperature Compensation Offset Adjutment Initial Setting of Adjustment ValueLaser Power Adjustment Traverse Adjustment Iop NV SaveFocus Bias Adjustment YESCD Auto Gain Control Output Level Adjustment Error Rate CheckAuto Gain Control Output Level Adjustment MO Auto Gain Control Output Level AdjustmentAdjusting Points and Connecting Points For printed wiring boards Section DiagramsFor schematic diagrams Circuit Boards LocationBlock Diagrams BD Section MDS-JE440Main Section Sclk Cclk Control Generator OSCMain Board BD BoardDisplay Board Printed Wiring Board BD Section SemiconductorPIN PIN Function Printed Wiring Board Main Section Side a Printed Wiring Board Main Section Side B PIN MDS-JE440 Schematic Diagram Main /3 See page 47 for IC Block Diagrams Printed Wiring Board Power Section Printed Wiring Board Display Section Schematic Diagram Display Section See page 34 for Waveforms IC Block Diagrams IC101 CXA2523AR BD BoardIC400 LA5643 Main Board IC PIN Functions Pin No Pin Name FunctionMNT2 Xbusy MNT0 FOKMNT1 Shck MNT3 SlocAsyi MvciAsyo AvddFrdr TfdrFfdr FS4IC1 M30805SGP System Control Main Board HLDA/ALE Section Exploded Views Chassis SectionNot supplied FL771 Mechanism MDM-7A 202 220 201 213 215 216 205 218 207259 Section Electrical Parts List Description Remarks Ref. NoIC TC7WU04FUTE12R SWITCH, Keyboard MENU/NO Display KEY-SWMain CN1Diode MA8047-TX Main VOL-SEL VibratorSony Corporation

KMS-2608/J1N, MDM-7A, NEW specifications

Sony has long been a leader in the realm of electronic innovation, and the introduction of the NEW MDM-7A and KMS-2608/J1N models further solidifies this position. These devices are a testament to Sony's commitment to delivering cutting-edge technology that enhances user experience across various applications.

The MDM-7A, a multi-channel digital mixer, offers advanced audio processing capabilities, ideal for both studio and live sound environments. One of its standout features is its high-resolution 24-bit audio processing, which ensures crystal-clear sound reproduction and fidelity. The MDM-7A supports a wide range of audio formats, making it compatible with various production environments. Moreover, its intuitive user interface facilitates easy navigation and control over numerous audio channels while maintaining flexibility for complex setups.

On the other hand, the KMS-2608/J1N is a multichannel audio management system designed for more extensive sound setups. One of its primary features is the smart signal routing capability, which allows users to manage audio signals efficiently across different outputs. This is especially beneficial in large-scale events or installations where sound management can become challenging. With support for both analog and digital audio inputs, the KMS-2608/J1N caters to a variety of equipment, ensuring seamless integration with existing systems.

In terms of connectivity, both devices are equipped with multiple input and output options, including XLR and TRS connectors, along with digital interfaces such as AES/EBU and S/PDIF. This flexibility allows users to customize their audio setups according to specific needs and preferences.

Another defining characteristic of the MDM-7A and KMS-2608/J1N is their durability and reliability. Built with robust materials and designed for extensive use, these devices are engineered to withstand the rigors of professional use, making them a smart investment for audio professionals.

In conclusion, the Sony MDM-7A and KMS-2608/J1N embody the future of audio technology, combining superior sound performance with user-friendly features. These models are not only designed to meet current industry standards but are also forward-thinking, making them suitable for a wide array of applications, from studio recordings to live events. As Sony continues to innovate, these devices are sure to play a significant role in shaping the audio landscape for years to come.