Sony MDS-S50 specifications Electrical Parts List, Coils

Page 63

 

 

 

 

SECTION 8

 

 

 

ELECTRICAL PARTS LIST

NOTE:

 

 

 

• Due to standardization, replacements in the

COILS

 

 

parts list may be different from the parts

 

uH: H

 

 

specified in the diagrams or the components

SEMICONDUCTORS

 

used on the set.

 

In each case, u: , for example:

-XX, -X mean standardized parts, so they

 

uA...: A... , uPA... , PA... ,

 

may have some difference from the original

 

uPB... , PB... , uPC... , PC... ,

 

one.

 

uPD..., PD...

• Items marked “*” are not stocked since they

Abbreviation

 

are seldom required for routine service.

 

CND

: Canadian model

 

Some delay should be anticipated when

 

SP

: Singapore model

 

ordering these items.

 

HK

: Hong Kong model

CAPACITORS:

 

AUS

: Australian model

 

uF: F

 

 

 

RESISTORS

 

 

 

 

All resistors are in ohms.

 

 

 

 

METAL: metal-film resistor

 

 

 

 

METAL OXIDE: Metal Oxide-film resistor

 

 

 

 

F: nonflammable

 

 

 

MDS-JE470

BD

When indicating parts by reference number, please include the board name.

The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.

Les composants identifiés par une marque

0sont critiques pour la sécurité.

Ne les remplacer que par une pièce portant le numéro spécifié.

Ref. No.

Part No.

Description

 

 

Remarks

Ref. No.

Part No.

Description

 

 

Remarks

 

A-4725-471-A

BD BOARD, COMPLETE

 

 

C160

1-162-927-11

CERAMIC CHIP

100PF

5%

50V

 

 

***************

 

 

C161

1-162-970-11

CERAMIC CHIP

0.01uF

10%

25V

 

 

 

 

 

 

C162

1-162-970-11

CERAMIC CHIP

0.01uF

10%

25V

 

 

<CAPACITOR>

 

 

 

C163

1-125-891-11

CERAMIC CHIP

0.47uF

10%

10V

 

 

 

 

 

 

C164

1-162-927-11

CERAMIC CHIP

100PF

5%

50V

C101

1-135-259-11

TANTAL.CHIP

10uF

20%

6.3V

 

 

 

 

 

 

 

 

C102

1-135-259-11

TANTAL.CHIP

10uF

20%

6.3V

C165

1-162-968-11

CERAMIC CHIP

0.0047uF

10%

50V

C103

1-162-970-11

CERAMIC CHIP

0.01uF

10%

25V

C166

1-125-891-11

CERAMIC CHIP

0.47uF

10%

10V

C104

1-164-227-11

CERAMIC CHIP

0.022uF

10%

25V

C167

1-164-245-11

CERAMIC CHIP

0.015uF

10%

25V

C105

1-115-416-11

CERAMIC CHIP

0.001uF

5%

25V

C169

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

 

 

 

 

 

 

C171

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C106

1-162-970-11

CERAMIC CHIP

0.01uF

10%

25V

 

 

 

 

 

 

 

 

C107

1-162-970-11

CERAMIC CHIP

0.01uF

10%

25V

C172

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C108

1-162-969-11

CERAMIC CHIP

0.0068uF

10%

25V

C180

1-117-370-11

CERAMIC CHIP

10uF

 

10V

C109

1-164-677-11

CERAMIC CHIP

0.033uF

10%

16V

C181

1-126-206-11

ELECT CHIP

100uF

20%

6.3V

C110

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

C182

1-163-038-00

CERAMIC CHIP

0.1uF

 

25V

 

 

 

 

 

 

C183

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C111

1-117-720-11

CERAMIC CHIP

4.7uF

 

10V

 

 

 

 

 

 

 

 

C112

1-110-563-11

CERAMIC CHIP

0.068uF

10%

16V

C184

1-117-970-11

ELECT CHIP

22uF

20%

10V

C113

1-162-968-11

CERAMIC CHIP

0.0047uF

10%

50V

C185

1-131-872-11

CERAMIC CHIP

1000PF

10%

630V

C114

1-125-837-11

CERAMIC CHIP

1uF

10%

6.3V

C191

1-126-206-11

ELECT CHIP

100uF

20%

6.3V

C115

1-162-966-11

CERAMIC CHIP

0.0022uF

10%

50V

C192

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

 

 

 

 

 

 

C193

1-126-206-11

ELECT CHIP

100uF

20%

6.3V

C116

1-164-227-11

CERAMIC CHIP

0.022uF

10%

25V

 

 

 

 

 

 

 

 

C117

1-162-970-11

CERAMIC CHIP

0.01uF

10%

25V

C194

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C118

1-165-176-11

CERAMIC CHIP

0.047uF

10%

16V

C195

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C119

1-165-176-11

CERAMIC CHIP

0.047uF

10%

16V

C196

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C120

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

C1401

1-117-720-11

CERAMIC CHIP

4.7uF

 

10V

C121

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

 

 

<CONNECTOR>

 

 

 

C125

1-117-720-11

CERAMIC CHIP

4.7uF

 

10V

 

 

 

 

 

 

 

 

C128

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

CN101

1-766-833-21 CONNECTOR, FFC/FPC (ZIF) 21P

 

C131

1-117-720-11

CERAMIC CHIP

4.7uF

 

10V

CN102

1-784-835-21

CONNECTOR, FFC(LIF(NON-ZIF))27P

 

C132

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

CN103

1-784-834-21

CONNECTOR, FFC(LIF(NON-ZIF))23P

 

 

 

 

 

 

 

* CN104

1-580-055-21 PIN, CONNECTOR (SMD) 2P

 

 

C133

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

CN105

1-784-859-21

CONNECTOR, FFC(LIF(NON-ZIF))7P

 

C141

1-126-206-11

ELECT CHIP

100uF

20%

6.3V

 

 

 

 

 

 

 

 

C142

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

 

 

<DIODE>

 

 

 

C143

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

 

 

 

 

 

 

 

 

C144

1-162-970-11

CERAMIC CHIP

0.01uF

10%

25V

D101

8-719-988-61

DIODE

1SS355TE-17

 

 

 

 

 

 

 

 

D181

8-719-080-81

DIODE

FS1J6

 

 

 

C145

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

D183

8-719-080-81

DIODE

FS1J6

 

 

 

C151

1-117-370-11

CERAMIC CHIP

10uF

 

10V

 

 

 

 

 

 

 

 

C152

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

 

 

<IC>

 

 

 

 

C153

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

 

 

 

 

 

 

 

 

C154

1-126-206-11

ELECT CHIP

100uF

20%

6.3V

IC101

8-752-080-95

IC

CXA2523AR

 

 

 

 

 

 

 

 

 

IC102

8-759-473-51

IC

TLV2361CDBV

 

 

 

C155

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

IC141

8-759-836-79

IC

BH6519FS-E2

 

 

 

C156

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

IC151

8-752-404-64

IC

CXD2662R

 

 

 

C157

1-164-156-11

CERAMIC CHIP

0.1uF

 

25V

IC153

8-759-671-27

IC

MSM51V4400E-70TS-K

 

 

C158

1-162-927-11

CERAMIC CHIP

100PF

5%

50V

 

 

 

 

 

 

 

 

C159

1-162-927-11

CERAMIC CHIP

100PF

5%

50V

IC171

8-759-096-87

IC

TC7WU04FU(TE12R)

 

 

 

 

 

 

 

 

IC181

8-759-481-17

IC

MC74ACT08DTR2

 

 

63

Image 63
Contents 873-891-11 SpecificationsMDS-JE470 SELF-DIAGNOSIS FunctionThree- or five Digit code Cause/Remedy Message Items of Error History Mode Items and Contents Exploded Views Table of ContentsDisassembly DiagramsLeakage MDS-JE470 Section Service NotesSafety CHECK-OUT Flexible Circuit Board RepairingIOP JIG for Checking BD Board WaveformRecord Precedure Optical PICK-UP Block Type Discrimination KSN-260EChecks Prior to Parts Replacement and Adjustments Forced ResetMain Board Component Side Bit Binary Retry Cause Display ModeBit When Binary Higher Bits Lower Bits Hexa DetailsHexadecimal Binary Button Descriptions MDS-JE470 Section GeneralDisassembly Flow MDS-JE470 Section DisassemblyFront Panel Section PT BOARD, VOL-SEL Board SP model Main BoardOver Light Head HR901, BD Board Mechanism Deck Section MDM-7ALoading Motor Assy M103 Holder AssyOptical PICK-UP Sled Motor Assy M102, SliderSpindle Moter Assy M101 Exiting the Test Mode MDS-JE470 Section Test ModePrecautions for USE of Test Mode Setting the Test ModeDisplay Selecting the Test ModeMENU/NO Operating the Continuous Playback ModeFunctions of Other Buttons Test Mode DisplaysMode display Error rate displayInformation When Memory NG is DisplayedMeanings of Other Displays Automatic SELF-DIAGNOSIS FunctionMDS-JE470 Section Electrical Adjustments Parts Replacement and AdjustmentCheck before replacement Adjustment flow Precautions for Checking Laser Diode Emission Precautions for USE of Optical PICK- UP KMS-260B/260EPrecautions for Adjustments Checks Prior to Repairs Using the Continuously Recorded DiscTraverse Waveform Auto CheckOther Checks Traverse CheckSelf-Recording/playback Check Play Check MO Error Rate CheckCD Error Rate Check Focus Bias CheckInitial Setting of Adjustment Value Temperature Compensation Offset AdjutmentLaser Power Adjustment Iop NV Save Traverse AdjustmentFocus Bias Adjustment MO Auto Gain Control Output Level Adjustment Error Rate CheckAuto Gain Control Output Level Adjustment CD Auto Gain Control Output Level AdjustmentAdjusting Points and Connecting Points Circuit Boards Location MDS-JE470 Section DiagramsMain Board For schematic diagramsFor printed wiring boards BD BoardBlock Diagrams BD Section IC171IC190 Main Section IC360 2/2IC1 2/2 Semiconductor SemiconductorOVERBoard Board Main Display Board See page 51 for IC Block Diagrams Schematic Diagram Main /2IC1 KEY-SW Board Indicator Tube Schematic Diagram Display Section230V PT BoardSchematic Diagram Power Section IC101 CXA2523AR BD Board IC Block DiagramsIC500 AK4524 Main Board IC PIN Function Description IC101 CXA2523AR RF Amplifier BD BoardPin No Pin Name Description Sqsy Pin No Pin Name DesriptionMvci Abbreviation EFM Eight to Fourteen Modulation IC1 M30803MG-107FP System Control Main Board ADA. Latch STB Chassis Section Section Exploded ViewsFL750 Mechanism MDM-7A M101 Coils Electrical Parts ListMetal Chip MDS-JE470 KEY-SW Main DisplayCN2 MDS-JE470 MainTC7WHU04FUTE12R Screw +KTP 2X6 TYPE2 NON-SLIT MDS-JE470 Main VOL-SELMDS-JE470 MDS-JE470 Revision History

MDS-S50 specifications

The Sony MDS-S50 is a pinnacle of MiniDisc technology, offering audiophiles a compact and reliable way to enjoy high-quality audio. Launched in the early 2000s, it epitomizes the innovation that Sony was known for during this period, combining functionality with sleek design.

One of the primary features of the MDS-S50 is its ability to record in SP (Standard Play) mode, which delivers high-resolution audio at 64 kbps, and LP (Long Play) mode for extended recording times. This flexibility makes it suitable for various listening preferences, whether for critical listening or casual playback during everyday activities. The device harnesses the precision of digital audio encoding, ensuring minimal loss of sound quality.

The MDS-S50 stands out with its direct digital recording capabilities. By connecting to external audio sources via optical or coaxial digital inputs, users can preserve the integrity of the original sound. This feature is particularly appealing for those who want to capture live recordings or transfer vinyl records and CDs to the MiniDisc format without degradation.

The inclusion of a user-friendly interface, with an intuitive remote control and well-organized menu systems, enhances the experience for users. The display panel gives clear information on track titles, remaining recording time, and other essential details, allowing for seamless navigation through complex playlists or recording options.

Another notable technology in the MDS-S50 is the ATRAC (Adaptive Transform Acoustic Coding) compression algorithm, developed by Sony. This proprietary encoding format optimizes sound quality while significantly reducing file sizes. The result is a perfect balance between audio fidelity and efficient storage, which was a major advantage during the era of burgeoning digital music.

Furthermore, the MDS-S50 boasts a durable build quality, designed to withstand transport and everyday use. Its compact size, combined with lightweight materials, allows users to take it on the go while not compromising on audio quality.

Ultimately, the Sony MDS-S50 remains a beloved device among music enthusiasts. With its combination of high-quality recording capabilities, advanced digital encoding technology, and user-friendly features, it represents a unique chapter in the evolution of portable audio. Whether used as a standalone player or part of a larger audio setup, it delivers a level of performance that still resonates with those who appreciate the art of music.