Sony MDS-PC2 Precautions for Checking Laser Diode Emissinon, Precautions for Adjustments

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5-2. PRECAUTIONS FOR CHECKING LASER DIODE EMISSINON

To check the emission of the laser diode during adjustments, never view directly from the top as this may lose your eye-sight.

5-3. PRECAUTIONS FOR USE OF OPTICAL PICK- UP (KMS-260A)

As the laser diode in the optical pick-up is easily damaged by static electricity, solder the laser tap of the flexible board when using it. Before disconnecting the connector, desolder first. Before connect- ing the connector, be careful not to remove the solder. Also take adequate measures to prevent damage by static electricity. Handle the flexible board with care as it breaks easily.

pick-up

flexible board

 

laser tap

Optical pick-up flexible board

5-4. PRECAUTIONS FOR ADJUSTMENTS

1)When replacing the following parts, perform the adjustments and checks with  in the order shown in the following table.

 

Optical

 

 

BD Board

 

 

Pick-up

IC171

D101

 

IC101, IC121

IC192

 

 

 

 

 

 

 

1. Initial setting of

Â

Â

G

 

Â

G

adjustment value

 

 

 

 

 

 

 

 

2. Recording of IOP

 

 

 

 

 

 

information

Â

Â

G

 

G

G

(Value written in

 

the pick-up)

 

 

 

 

 

 

 

 

 

 

 

 

 

3. Temperature

 

 

 

 

 

 

compensation

G

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Â

 

G

G

offset adjustment

 

 

 

 

 

 

 

 

 

 

 

 

 

4. Laser power

Â

Â

G

 

Â

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adjustment

 

 

 

 

 

 

 

 

 

 

 

 

 

 

5. Traverse

Â

Â

G

 

Â

G

adjustment

 

 

 

 

 

 

 

 

 

 

 

 

 

 

6. Focus bias

Â

Â

G

 

Â

G

adjustment

 

 

 

 

 

 

 

 

 

 

 

 

 

 

7. Error rate check

Â

Â

G

 

Â

G

 

 

 

 

 

 

 

8. Auto gain output

Â

Â

G

 

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G

level adjustment

 

 

 

 

 

 

2)Set the test mode when performing adjustments. After completing the adjustments, exit the test mode.

Perform the adjustments and checks in “group S” of the test mode.

3)Perform the adjustments to be needed in the order shown.

4) Use the following tools and measuring devices.

Check Disc (MD) TDYS-1 (Parts No. 4-963-646-01)

Test Disk (MDW-74/AU-1) (Parts No. 8-892-341-41)

Laser power meter LPM-8001 (Parts No. J-2501-046-A)

or

MD Laser power meter 8010S (Parts No. J-2501-145-A)

Oscilloscope (Measure after performing CAL of prove.)

Digital voltmeter

Thermometer

Jig for checking BD board waveform

(Parts No. : J-2501-149-A)

5)When observing several signals on the oscilloscope, etc., make sure that VC and ground do not connect inside the oscillo- scope.

(VC and ground will become short-circuited.)

6)Using the above jig enables the waveform to be checked without the need to solder.

(Refer to Servicing Note on page 6.)

7)As the disc used will affect the adjustment results, make sure that no dusts nor fingerprints are attached to it.

Note:

When performing laser power checks and adjustment (electrical adjustment), use of the new MD laser power meter 8010S (J-2501- 145-A) instead of the conventional laser power meter is convenient. It sharply reduces the time and trouble to set the laser power meter sensor onto the objective lens of the optical pick-up.

5-5. CREATING CONTINUOUSLY RECORDED DISC

* This disc is used in focus bias adjustment and error rate check. The following describes how to create a continuous recording disc.

1.Insert a disc (blank disc) commercially available.

2.Press the + button and display “CREC MODE”.

3.Press the ^ “PROGRAM” button again to display “CREC MID”.

Display “CREC (0300)” and start to recording.

4.Complete recording within 5 minutes.

5.Press the p“PROGRAM” button and stop recording .

6.Press the 6(EJECT) button and remove the disc.

The above has been how to create a continuous recorded data for the focus bias adjustment and error rate check.

Note : Be careful not to apply vibration during continuous record- ing.

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Contents Specifications MDM-5AInput SELF-DIAGNOSIS FunctionProgram Items of Error History Mode Items and Contents Flexible Circuit Board Repairing Parts NoDiagrams Table of ContentsDisassembly Exploded ViewsIOP Section Servicing NoteJIG for Checking BD Board Waveform TEORecord Precedure Criteria for Determination Measure if unsatisfactory Checks Prior to Parts Replacement and AdjustmentsREC/PLAY Fluorescent Display Tube ALL Lighting and KEY Check Mode Forced ResetPower Board Component Side Cause of Retry Occurring conditions Retry Cause Display ModeHigher Bits Lower Bits Hexa Bit BinaryHigher Bits Lower Bits Hexa Details Bit When BinaryHexadecimal Binary Section General Front PanelCase and Front Panel Section DisassemblyMD Mechanism Slider CAM Base Unit MBU-5A and BD BoardSW Board and Loading Motor M103 Setting the Test Mode Section Test ModePrecautions for USE of Test Mode Exiting the Test ModeSelecting the Test Mode GroupMID Operating the Continuous Playback ModeNon-Volatile Memory Mode EEP Mode OUTTest Mode Displays Functions of Other ButtonsMeanings of Other Displays Section Electrical Adjustments Parts Replacement and AdjustmentPrecautions for Adjustments Precautions for Checking Laser Diode EmissinonPrecautions for USE of Optical PICK- UP KMS-260A Creating Continuously Recorded DiscChecks Prior to Repairs Temperature Compensation Offset CheckLaser Power Check Specified ValueFocus Bias Check Play Checking MO Error Rate CheckCD Error Rate Check EjectLaser Power Adjustment Initial Setting of Adjustment ValueTemperature Compensation Offset Adjutment Recording and Displaying the IOP InformationTraverse Adjustment Focus Bias Adjustment 6EJECTCD Auto Gain Control Output Level Adjustment Error Rate CheckAuto Gain Control Output Level Adjustment MO Auto Gain Control Output Level AdjustmentAdjusting Points and Connecting Points BD Board Side BSection Diagrams Circuit Boards LocationPB Digital out Block Diagram BD SectionMDS-PC2 REC DigitalMain Section LD-LOVOWaveforms Panel SectionPrinted Wiring Board BD Section See page 30 for Circuit Boards LocationSchematic Diagram BD 1/2 Section Schematic Diagram BD 2/2 Section Schematic Diagram Main 1/2 Section Panel Schematic Diagram Main 2/2 SectionBoard Power Printed Wiring Board Main SectionBD Board Panel Schematic Diagram Panel Section Printed Wiring Board Panel Section Main BoardSchematic Diagram Power Section Printed Wiring Board Power Section Main Board BD BoardPrinted Wiring Board BD Switch Section Schematic Diagram BD Switch Section IC Block DiagramBD section IC101 CXA2523AR IC121 CXD2654R IC152 BH6511FS-E2Main section IC301 UDA1341TS/N2 IC441 LB1830MIC101 RF Amplifier CXA2523AR BD board IC PIN FunctionsPin No Pin Name Function MNT2 Xbusy MNT0 FOKMNT1 Shck MNT3 SlocAsyi MvciAsyo AvddFrdr TfdrFfdr FS4IC501 System Control M30620MC-406FP Main board REC/PB OPT SEL Mode SELPB-P SDASection Exploded Views CORD, Power UKCabinet Section 509 4-988-466-21 Spring ELECTROSTATIC, Leaf Mechanism Section MDM-5AInsulator F 526 A-4680-417-A Holder Complete AssyHEAD, Over Light Base Unit Section MBU-5AMotor ASSY, Sled Back UP Section Electrical Parts List Main Ground Terminal CONNECTOR, FFC 15PElect Ferrite BeadMain Panel PLUG, Connector 6PPIN, Connector 2P VibratorPanel Power Power SW 928-916-11

MDS-PC2 specifications

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