Circuit Description
- TX Function
The device implements Skyworks Polar Loop transmit architecture. This architecture autonomously splits the amplitude and phase within the device using the traditional analog
5. POWER AMP (PAM400)
The module consists of a EGSM850/900 PA block and a DCS1800/PCS1900 PA block, Both PA blocks share common power supply pins to distribute current. The subsystem consists of two parts : a Power Amplifier Control (PAC) block, and an Integrated Coupler. To select GSM900/850 and GMS1800/1900 as determined from the Band Select (BAND_SEL) signal. SKY77331 contains band select switching circuitry to select GSM (BAND_SEL is low) and DCS/PCS (BAND_SEL is HIGH) as determined from the Band Select (BAND_SEL) signal. The BAND_SEL pad selects the PA output (DPCS_OUT or GSM_OUT) while the Power Control (VPC) controls the level of output power. The integrated power amplifier control (PAC) function provides envelope amplitude control by reducing sensitivity to input drive, temperature, power supply, and process variation.
< Baseband Circuit description of SGH-D407 >
1. CSP2750 (UCD301)
==> The CSP2750 has two major logical components power management and conversion signal processing.
The PSC component is responsible for all
●Power management for RF, BB and ancillary devices within the GSM/GPRS
●
●Reset control
●SIM card
The CSP component is responsible for the following ;
●Intraframe event scheduling
●Voice band processing, including voice band ADC and DAC
●Analog baseband processing, including baseband ADC and DAC
●Providing RF interface for Trident digital baseband device
●Transmitter Power control
●Automatic frequency control
●A5 ciphering
●
The CSP2750 has the following major physical components;
SAMSUNG
This Document can not be used without Samsung's authorization