HTC SM-TP008-1125 Board Level 2.5 Repairs, „ Basic Repair Instructions for Component Replacement

Page 85

 

 

Doc. No.

DOC-00051810

REV.

 

HTC Corporation.

 

 

 

 

Issued Date

2008/12/29

AX02

 

.

 

 

 

Revised Date

2009/01/14

 

 

 

 

 

 

 

 

 

 

Doc. Title

Sapphire Service Manual

Page

85 of 91

8.2 Board Level 2.5 Repairs

„Basic Repair Instructions for Component Replacement:

Step 1 Place the solder-proof tape to cover the surrounding area of the components which being replaced.

Warning：DO NOT overheat the tape and components to avoid the tape melted and the components damaged

Step 2 Use Heater Gun (HAKO850B, set the temperature between 350°C, Air Speed 3~5) to remove the components.

Step 3 Wait till the temperature cool down before removing the solder-proof tape to avoid other components being removed

Step 4 After the damaged or defective components have been replaced; clear the surroundings for solder and flux residues.

Notice:

A.Checking the polarity of CON8, and the position can't be shifted.

B.Checking the polarity of SW8、SW7, and it can't be reversed.

C.All the parts of the PCB should be checked if it is missing or not.

D.The OP must to wear antistatic wrist band .Don't put boards together and avoid hitting them.

E.When you solder and repair that the soldering iron ,temperature must be setup 415℃. (The temperature range is 415℃±5℃),and the solder wire's diameter is 0.4/0.5/0.6mm(SAC 305 (1.1%)

F.Please be noticed to follow below steps for main board repair which is equipped with Golden Capacitor:

1. When replacing level 2.5 components located around the golden capacitor:

I.The temperature of the hot air blower must be under 400°c

II.When apply the hot air to the part / component, the heating time must be under 20

seconds (including the time of removing and soldering)

III.The temperature of the soldering iron must be under 350°c

IV. When apply the solder tip to the part / component, the heating time must be under 5 seconds

V. The solder tip must not contact with the golden capacitor

2.For BGA replacement: The golden capacitor must be removed before perform pre-heating, heating, soldering and de-soldering process, and then it must be replaced with a new one (please refer to 1.c. and 1.d. steps)

3.For main board which failed to pass the function test, the golden capacitor must be replaced with a new one and must follow below soldering criteria: The temperature of the soldering iron must be under 350°c When apply the solder tip to the part / component, the heating time must be under 5 seconds The solder tip must not have a contact with the body of golden capacitor

HTC CONFIDENTIAL

SM-TP008-1125

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Contents Sapphire PSE ROM RE-FLASH Procedure Introduction Product Features HTC Corporation HTC Corporation Product overview Function Install the SIM card Install the SD card To perform a soft reset Disassembling procedure Device Disassembling and Assembling ProcedureHTC Corporation HTC Corporation HTC Corporation HTC Corporation HTC Corporation Unfasten the screws at location indicated blue HTC Corporation HTC Corporation HTC Corporation Assembling procedure HTC Corporation Connect Main FPC with HTC Corporation HTC Corporation Torque 1.0+-0.1kgf-c Screw 72H01266-00M HTC Corporation Fasten the screw as location indicated Connect device to PC ROM upgrade thru RUU Re-flash Upgrade UtilityDownload ROM Image from SDO RUU HTC Corporation HTC Corporation SD Upgrade Rom Image upgrade thru SD cardFormat SD card and copy image file to SD card HTC Corporation List of Diagnostic / WinCE Test Items Diagnostic ProgramHTC Corporation Diagnostic Main Menu/Function Test Menu Test ProcedureAuto Test Vibrator Test SD card TestDisplay Test Color bar / Red pattern Display Test Black / White pattern Display Test Green / Blue patternDisplay Test Gray pattern LED Test Button Test Sliding TestBack Light Test Receiver Audio Test Headset Audio TestSign Android TestUSB Test Bluetooth Test BT headsetCamera Test GPS Test Speaker Test Wlan TestErase all test data RF TestEquipment list Main board leakage current Test ProcedureEquipment set up Start testing Idle current test Measurement parameter ConclusionBattery Test Battery rundown test procedureHTC Corporation Classes definition of inspective area Cosmetic Inspection CriteriaDisplay inspection HTC Corporation Accept Criteria Main unit inspectionGeneric Troubleshooting ．Unusual Vertical / Horizontal lines or partial display ．PC Connection not possible 10．Battery Pack does not recharge 13．Wireless connection WLAN/BT not functioning Generic Labeling Plan „ Main unit HTC Corporation HTC Corporation Size 41 X 39.00mm HTC Corporation HTC Corporation Unit label location explanation Water sensitive label Screen protector Battery label HTC Corporation HTC Corporation HTC Corporation MFG packing label 12 in 1 carton label not confirmed Pallet label Incomplete pallet label SPL for Repair Generic Spare Part List and PhotosPicture for SPL 80H Kernel and Accessories Board Level 2.5 Repairs „ Basic Repair Instructions for Component ReplacementDescription Qty Location Substitute ¾ 51HXXXXXXXX PCBA-MAIN BOARDSide aSide a Photo and Component Location 51HXXXXXXXXX PCBA-MAIN BOARDSide B FRU M/B additional parts location RF Antenna Specification TCH

SM-TP008-1125 specifications

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