Huawei Explore the Ultimate Guide to ME909 Mini PCIe Module Features and Reliability

HUAWEI ME909 Series Mini PCIe Module
Hardware Guide	Electrical and Reliability Features

The above values are the average of some test samples.

LTE test condition: 10 MHz bandwidth, QPSK, 1RB when testing max Tx power and full RB when testing 1 dBm or 10 dBm.

5.7Reliability Features

Table‎ 5-11lists the test conditions and results of the reliability of the ME909 module .

Table 5-11Test conditions and results of the reliability of the ME909 module

Item	Test Condition	Standard
Low-temperature	Temperature: –40ºC±2ºC	IEC60068
storage	Test duration: 24 h
High-temperature	Temperature: 85ºC±2ºC	IEC60068
storage	Test duration: 24 h
Low-temperature	Temperature: –20ºC±2ºC	IEC60068
working	Test duration: 24 h
High-temperature	Temperature: 60ºC±2ºC	IEC60068
working	Test duration: 24 h
Damp heat cycling	High temperature: 55ºC±2ºC	IEC60068
	Low temperature: 25ºC±2ºC
	Humidity: 95%
	Repetition times: 4
	Test duration: 12 h+12 h
Temperature shock	Low temperature: –40ºC±2ºC	IEC60068
	High temperature: 85ºC±2ºC
	Temperature change interval: < 30s
	Test duration: 15 min
	Repetition times: 100
Salty fog test	Temperature: 35°C	IEC60068
	Density of the NaCl solution: 5%±1%
	Spraying interval: 8 h
	Duration of exposing the module to
	the temperature of 35°C: 16 h

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Issue 0.1 (2013-06-09)	Copyright © Huawei Technologies Co., Ltd.