HP XW9400 Packaging Materials External, Internal, Recycling, Hewlett-Packard, Information

Page 19

QuickSpecs

HP xw9400 Workstation

System Technical Specifications

 

 

Halogenated Diphenyl Methanes

 

 

Lead carbonates and sulfates

 

 

Lead and Lead compounds

 

 

Mercuric Oxide Batteries

 

 

Nickel - finishes must not be used on the external surface designed to be frequently handled or

 

 

carried by the user.

 

 

Ozone Depleting Substances

 

 

Polybrominated Biphenyls (PBBs)

 

 

Polybrominated Diphenyl Ethers (PBBEs)

 

 

Polybrominated Biphenyl Oxides (PBBOs)

 

 

Polychlorinated Biphenyl (PCB)

 

 

Polychlorinated Terphenyls (PCT)

 

 

Polyvinyl Chloride (PVC), except for wires and cables and certain retail packaging, has been

 

 

voluntarily removed from most applications.

 

 

Radioactive Substances

 

 

Tributyl Tinches (TBT), Triphenyl Tinches (TPT), Tributyl Tin Oxide (TBTO)

Packaging

HP follows these guidelines to decrease the environmental impact of product packaging:

 

 

Eliminate the use of heavy metals such as lead, chromium, mercury, and cadmium in packaging

 

 

materials.

 

 

Eliminate the use of ozone-depleting substances (ODS) in packaging materials.

 

 

Design packaging materials for ease of disassembly.

 

 

Maximize the use of post-consumer recycled content materials in packaging materials.

 

 

Use readily recyclable packaging materials such as paper and corrugated materials.

 

 

Reduce size and weight of packages to improve transportation fuel efficiency.

 

 

Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.

Longevity and Upgrading

This product is designed to be upgraded, possibly extending its useful life by several years. Spare parts

 

 

are available throughout the warranty period and for up to 5 years after the end of production.

 

 

Upgradeability features contained in the product include:

 

 

Dual AMD socket F (aka L1, 1207 pins)

 

 

8 USB ports

 

 

1 PCI slot, 2 PCI-X slots and 4 PCI Express slots

 

 

8 expansion bays

 

 

8 memory slots

Packaging Materials

 

External

Cardboard carton and insert: 2.70 kg

Internal

LDPE Foam: 0.35 kg

End-of-Life Management

Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic areas.

and Recycling

To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP sales

 

 

office. Products returned to HP will be recycled, recovered, or disposed of in a responsible manner.

Hewlett-Packard

For more information about HP's commitment to the environment:

Corporate Environmental

[link to new HP white paper now in progress]

Information

Global Citizenship Report: http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html

 

 

Eco-label certifications:

 

 

http://www.hp.com/hpinfo/globalcitizenship/environment/productdesign/ecolabels.html

 

 

ISO 14001 certificates:

 

 

http://www.hp.com/hpinfo/globalcitizenship/environment/operations/envmanagement.html

Service, Support and

On-site Warranty and Service (Note 1): This three-year, limited warranty and service offering delivers three

Warranty

years of on-site, next business-day (Note 2) service for parts and labor and includes free telephone support

 

 

(Note 3) 8am - 5pm. Global coverage (Note 2) ensures that any product purchased in one country and

 

 

 

DA - 12594 Worldwide — Version 27 — May 8, 2009

Page 19

Image 19
Contents Overview QuickSpecsAvailable Processors Form FactorCompatible Operating SystemsProcessors Option Memory Configure To Order CTOPC2-5300 DDR2-667 MHz Memory Configurations Supported ComponentsProfessional 2D PC2-4200 DDR2-533 MHz Memory ConfigurationsPC2-4200 DDR2-533 MHz Memory Modules PCI Express GraphicsKit Part SAS Hard Drives OptionOption Kit Hard Drive ControllersLSI MegaRAID SAS 8888ELP Host Bus Adapter HBA Storage Multimedia and AudioDevices Optical and RemovableMonitors Input DevicesRacking and Physical SecurityApplies HP Installer CD for RedSoftware Operating Systems Support NotesSystem Technical Specifications Energy Star SataLED Reads System ConfigurationOff S5 Heat Dissipation IdleChassis Environmental Requirements TemperatureHumidity Maximum AltitudeFlash Recovery OS CD Restore OS CD Setup PasswordPower Button Power LEDAtapi SmbiosBBS EDD AcpiASF ATA IDEDeclarations ResponsibilityBatteries Packaging Materials External Service, SupportWarranty PackagingISO1043 Additional Information2002/95/EC Directive 2002/96/ECProcessors Technical Specifications ProcessorsSSE, SSE2, SSE3, SSE4A Maximum Virtual Memory Limited by OS Simd ExtensionsSpeeds System Bus Frequency Cache Type Ramdac Technical Specifications GraphicsShading Architecture Power consumption256MB Graphics Card Graphics Controller Nvidia Quadro FX Form Factor512MB Graphics Card Graphics Controller Nvidia Quadro FX 580 Form FactorLanguages Cuda Parallel Processor Cores Power consumptionConnector High-level ShaderNvidia Quadro FX 1700 Form Factor Nvidia Quadro FX 1800 Graphics Board Nvidia Quadro FX 1800 Form FactorInches H x 7.8 inches L 768MB Graphics Card Graphics ControllerGraphics Card Graphics Controller Nvidia Quadro FX 3700 Form FactorNvidia Quadro FX Graphics Controller Processor Cores Power consumption0GB Graphics Card Cuda ParallelPlatform 5GB PCIe Graphics Nvidia Quadro FX 4800 Form FactorCard Graphics Controller 4GB Graphics Card Graphics Controller Nvidia Quadro FX 5800 Form Factor400MHz Nvidia Quadro CX Form FactorNvidia Quadro CX 1.5GB Graphics Card Two DisplayPort to DVI-D adapters included300GB SAS Technical Specifications Hard DrivesHDD SAS300GB Sata GB SASInterface Synchronous Transfer 3.5 Frame WidthWidth Interface Synchronous Transfer Operating Temperature 500GB Sata Capacity Rpm Height 3Gb/sWidth Media Diameter Technical Specifications Hard Drive Controllers Technical Specifications Multimedia and Audio Devices DVD-ROM Technical Specifications Optical and Removable StorageKit Contents Supported Media Types MicroSD T-Flash, including MicroSD HC No power appliedUSB 2.0 High-speed device X 5.86 x 1.68 in 145 x 148.9 x 42.7 mmAdvance Protocol WeightSupport Technical Specifications Networking and Communications Technical Specifications Controller Cards