HP xw4600 manual Additional Information Material Usage Packaging

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QuickSpecs

HP xw4600 Workstation

Technical Specifications

Additional Information

Material Usage

Packaging

End-of-Life Management and Recycling

This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive - 2002/95/EC.

This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive – 2002/96/EC.

Plastics parts weighing over 25 grams used in the product are marked per ISO 11469 and ISO1043.

This product contains 0% recycled materials (by wt.)

This product is >90% recycle-able when properly disposed of at end of life.

Packaging Materials

 

 

External

Cardboard carton and insert

2.70 kg

Internal

LDPE Foam

0.35 kg

This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specifications.html):

Asbestos

Certain Azo Colorants

Certain Brominated Flame Retardants – may not be used as flame retardants in plastics Cadmium

Chlorinated Hydrocarbons Chlorinated Paraffins Formaldehyde

Halogenated Diphenyl Methanes Lead carbonates and sulfates Lead and Lead compounds Mercuric Oxide Batteries

Nickel - finishes must not be used on the external surface designed to be frequently handled or carried by the user.

Ozone Depleting Substances Polybrominated Biphenyls (PBBs) Polybrominated Diphenyl Ethers (PBBEs) Polybrominated Biphenyl Oxides (PBBOs) Polychlorinated Biphenyl (PCB) Polychlorinated Terphenyls (PCT)

Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been voluntarily removed from most applications.

Radioactive Substances

Tributyl Tinches; TBT), Triphenyl Tinches; TPT), Tributyl Tin Oxide (TBTO)

HP follows these guidelines to decrease the environmental impact of product packaging:

Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials.

Eliminate the use of ozone-depleting substances (ODS) in packaging materials. Design packaging materials for ease of disassembly.

Maximize the use of post-consumer recycled content materials in packaging materials. Use readily recyclable packaging materials such as paper and corrugated materials. Reduce size and weight of packages to improve transportation fuel efficiency.

Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.

Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.

DA - 12792 Worldwide — Version 1 — October 1, 2007

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Contents QuickSpecs OverviewAt a Glance Processor and Speed Standard Features SpecsAll processors feature Intel 64 Architecture One of the followingSerial Attached Scsi SAS Drives SAS controller required Sata Hard DrivesSata 3.0 Gb/s Hard Drives DDR2-266 ECC Unbuffered RAM DIMMs Drive controllersMemory DDR2-800 ECC Unbuffered RAM DIMMsDVD-ROM FDD Floppy driveOptical drives Input DevicesEntry 3D PCI Express GraphicsProfessional 2D Mid-range 3DStandard SoftwareOS options OptionalPower Supply Chassis DimensionsWeight Temperature Humidity W x DPCI-Express Graphics Professional 2D Multi Display SolutionsAfter-Market Options GN502AAControllers Hard DrivesSAS Hard Drives Scsi ControllersNetworking KeyboardsPointing Devices NICsRemovable Storage Monitors TFTsMultimedia Devices FDD Floppy driveOther Devices SecurityRacking Options Storage Specifications Tower configurationMaximum Memory Possible Memory ConfigurationsMemory Dimm Size SlotSmsc SCH5327 Technical SpecificationsSystem Board Operating Voltage Range Power Supply FanBlue Angel Compliant 5w in S5 Power Off Femp Standby Power Rated Voltage Range 100 240 VACBios Features CoolingRevision Supported by the Bios Industry StandardUhci Serviceability Features of SystemTPM Other Features Other deployment & management featuresSecurity Features System Software UpdatingKey features and benefits Insight DiagnosticsHP Insight Diagnostics Offline Edition Service and SupportExample Configuration #1Example Configuration #2 Energy Consumption Heat DissipationBatteries Additional Information Material Usage Packaging Hewlett-Packard InformationTechnical Specifications Audio SpdifFeatures ConnectorsDimensions Additional product MoviesHardware certifications Power requirement Integrated PCI Express ConnectorData transfer mode Boot ROM supportTechnical Specifications Communications EMC Technical Specifications Controllers MtbfTechnical Specifications Hard Drives 80 GB 7,200 rpm 160 GB 250 GB 500 GB73 GB Serial ATA Hard Drives CapacitySerial Attached Scsi SAS 300 GB Hard Drives SASQuickSpecs Technical Specifications Peripherals ESD EMI RFICable length Feet 1.8 m FCC, CELCD Viewing Area HP SpacePilotMechanical Buttons Active Area W x HTechnical Specifications Optical Devices HP 48X Sata CD DVD+R DL, DVD-R DL DVD-ROM, DVD+R SATA/ATAPIDVD+RW, DVD-RW DVD-R CD-ROM, CD-RStandby mode Technical Specifications Graphics RamdacNView Architecture DVI SupportArchitecture Features Shading Architecture60 W Worldwide Version 1 October 1 3D volumetric texture support Quad-buffered stereo High-level Shader High-resolutionDisplay Resolution AntialiasingTechnical Specifications Monitors Power Power Supply Default ColorTemperature On Screen Display OSD Buttons or Switches Input Power22.29 cm Mechanical Dimensions Unpacked with standW x D 32.91 x 40.39 x 6.1 cmLongevity For flat panel displaysRecycling End-of-lifeManagement CorporateVesa Mounting Other Accessories IncludedWarranty Languages Vesa ExternalText Mode On Screen Display Buttons or SwitchesSignal Interface Horizontal Frequency Mac ModeWeight Unpacked Power Input PowerMechanical Dimensions H x W x D Unpacked with stand Height AdjustableUser Guide Languages 46 to 95 F 10 to 35 CHumidity Non To 85% Operating Altitude Operating Kensington Lock-ReadyService and Warranty LP2465 Viewable Image AreaTemperature Video/Other Inputs Plug and Play Non-operating Other Accessories Included Mechanical Dimensions H x W x D Unpacked w/ standEnvironmental Temperature Non-operating Humidity OperatingContact HP Customer Support Carbonite/silver Yes Standard 4 hole pattern, 100 mm Yes2000, and Microsoft Windows XP Performance Vertical Frequency HP LP3065 Flat Panel TypeColor Gamut Pixel Clock SpeedNormal Operation Pivot Rotation BaseNon-operating Environmental Data Heat Dissipation2 Sleep1Off SleepRoHS Compliance Environmental impact of product packaging Reduce size and weight of packages toHP follows these guidelines to decrease Eliminate the use of heavy metals such asEE418AA OptionsBar Part number QuickSpecs
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