HP xw4600 manual Technical Specifications Peripherals

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QuickSpecs

HP xw4600 Workstation

Technical Specifications - Peripherals

	HP IEEE 1394a FireWire	Device Interface Protocol	IEEE-1394a
	4-Port PCI Card	Data Rate	400 Mbps
	(Part# PA997A)	Data Rate	400 Mbps
	(Part# PA997A)	Devices Supported	IEEE-1394 compliant devices
		Devices Supported	IEEE-1394 compliant devices
		Bus Interface	PCI
		Physical	PCI card with brackets for low profile and full height PCI slots.
		Environmental	Operating temperature	50° to 131° F (10° to 55° C)
			Non-operating	-22° to 140° F (-30° to 60° C)
			temperature
			Relative humidity	20% to 80%
		Ports	Two IEEE1394 6-Pin Connector (Rear)
		Connectors	One 10-Pinches; 9 Contacts) Custom Connector (Internal)
		Minimum System	Microsoft Windows Vista Business 32 and 64, Microsoft Windows XP
		Requirements	Professional, Windows XP Home, not supported on Linux
			Pentium II 266 or above
			128-MB RAM
			1-GB Hard Drive
			CD-ROM drive
			Built-in sound system
			Available PCI slot
		Regulatory Agency	FCC Part 15B, cULus 60950, CE Mark EN55022B(1995)/EN55024-1998
		Approval	STD, Taiwan BSMI CNS13438, Korea MIC

	HP IEEE 1394b FireWire	Device Interface Protocol	IEEE-1394
	800 3-Port PCI Card	Data Rate	800 Mbps
	(Windows XP Only)	Data Rate	800 Mbps
	(Windows XP Only)	Devices Supported	IEEE-1394 compliant devices
	(Part# EA327AA)	Devices Supported	IEEE-1394 compliant devices
	(Part# EA327AA)	Bus Interface	PCI
		Bus Interface	PCI
		Physical	PCI card with brackets for low profile and full height PCI slots.
		Environmental	Operating temperature	50° to 131° F (10° to 55° C)
			Non-operating	-22° to 140° F (-30° to 60° C)
			temperature
			Relative humidity	20% to 80%
		Ports	Two IEEE-1394b bilingual 9-Pin Connector (Rear)
		Connectors	One 10-Pin header Custom Connector (Internal)
		Minimum System	Microsoft Windows XP Professional, Windows XP Home, not supported on
		Requirements	Linux
			Pentium III
			128-MB RAM
			1-GB Hard Drive
			CD-ROM drive
			Built-in sound system
			Available PCI slot
		Regulatory Agency	FCC Part 15B, cULus 60950, CE Mark EN55022B(1995)/EN55024-1998
		Approval	STD, Taiwan BSMI CNS13438, Korea MIC

DA - 12792 Worldwide — Version 1 — October 1, 2007

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Contents Overview QuickSpecsAt a Glance One of the following Standard Features SpecsAll processors feature Intel 64 Architecture Processor and SpeedSata Hard Drives Sata 3.0 Gb/s Hard DrivesSerial Attached Scsi SAS Drives SAS controller required DDR2-800 ECC Unbuffered RAM DIMMs Drive controllersMemory DDR2-266 ECC Unbuffered RAM DIMMsInput Devices FDD Floppy driveOptical drives DVD-ROMMid-range 3D PCI Express GraphicsProfessional 2D Entry 3DOptional SoftwareOS options StandardW x D Chassis DimensionsWeight Temperature Humidity Power SupplyGN502AA Professional 2D Multi Display SolutionsAfter-Market Options PCI-Express GraphicsScsi Controllers Hard DrivesSAS Hard Drives ControllersNICs KeyboardsPointing Devices NetworkingDevices FDD Floppy drive Monitors TFTsMultimedia Removable StorageSecurity Racking OptionsOther Devices Tower configuration Storage SpecificationsDimm Size Slot Possible Memory ConfigurationsMemory Maximum MemoryTechnical Specifications System BoardSmsc SCH5327 Rated Voltage Range 100 240 VAC Power Supply FanBlue Angel Compliant 5w in S5 Power Off Femp Standby Power Operating Voltage RangeCooling Bios FeaturesIndustry Standard Revision Supported by the BiosServiceability Features of System TPMUhci System Software Updating Other deployment & management featuresSecurity Features Other FeaturesService and Support Insight DiagnosticsHP Insight Diagnostics Offline Edition Key features and benefitsEnergy Consumption Heat Dissipation Configuration #1Example Configuration #2 ExampleBatteries Additional Information Material Usage Packaging Information Hewlett-PackardSpdif Technical Specifications AudioAdditional product Movies ConnectorsDimensions FeaturesBoot ROM support Integrated PCI Express ConnectorData transfer mode Hardware certifications Power requirementTechnical Specifications Communications EMC Mtbf Technical Specifications ControllersTechnical Specifications Hard Drives 80 GB 7,200 rpm 160 GB 500 GB 250 GBSAS Serial ATA Hard Drives CapacitySerial Attached Scsi SAS 300 GB Hard Drives 73 GBQuickSpecs Technical Specifications Peripherals EMI RFI ESDFCC, CE Cable length Feet 1.8 mActive Area W x H HP SpacePilotMechanical Buttons LCD Viewing AreaTechnical Specifications Optical Devices HP 48X Sata CD DVD-R CD-ROM, CD-R SATA/ATAPIDVD+RW, DVD-RW DVD+R DL, DVD-R DL DVD-ROM, DVD+RStandby mode Ramdac Technical Specifications GraphicsDVI Support NView ArchitectureShading Architecture Architecture Features60 W Worldwide Version 1 October 1 3D volumetric texture support Quad-buffered stereo Antialiasing High-resolutionDisplay Resolution High-level ShaderTechnical Specifications Monitors Input Power Default ColorTemperature On Screen Display OSD Buttons or Switches Power Power Supply32.91 x 40.39 x 6.1 cm Mechanical Dimensions Unpacked with standW x D 22.29 cmFor flat panel displays LongevityCorporate End-of-lifeManagement RecyclingVesa External Other Accessories IncludedWarranty Languages Vesa MountingMac Mode On Screen Display Buttons or SwitchesSignal Interface Horizontal Frequency Text ModeHeight Adjustable Power Input PowerMechanical Dimensions H x W x D Unpacked with stand Weight UnpackedKensington Lock-Ready 46 to 95 F 10 to 35 CHumidity Non To 85% Operating Altitude Operating User Guide LanguagesLP2465 Viewable Image Area Service and WarrantyTemperature Video/Other Inputs Plug and Play Non-operating Humidity Operating Mechanical Dimensions H x W x D Unpacked w/ standEnvironmental Temperature Non-operating Other Accessories IncludedCarbonite/silver Yes Standard 4 hole pattern, 100 mm Yes 2000, and Microsoft Windows XPContact HP Customer Support Pixel Clock Speed HP LP3065 Flat Panel TypeColor Gamut Performance Vertical FrequencyPivot Rotation Base Non-operating Environmental DataNormal Operation Sleep Sleep1Off Heat Dissipation2RoHS Compliance Eliminate the use of heavy metals such as Reduce size and weight of packages toHP follows these guidelines to decrease Environmental impact of product packagingOptions Bar Part numberEE418AA QuickSpecs