HP DX2300 Memory Type, Hard Drive Interfaces, Supported Chassis Front Panel, Cooling Solutions

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QuickSpecs

HP Compaq dx2300 Microtower Business PC

System Details

Technology and Features

Memory Type

PC2-5300 DDR2 SDRAM (667-MHz) non-ECC

 

 

Up to 2-GB system memory standard

 

 

Up to 4-GB system memory supported

 

Hard Drive Interfaces

Serial ATA

 

Supported

 

 

 

 

Chassis

Front Panel

Power button

 

 

Power On LED

 

 

HDD Activity LED

 

Cooling Solutions

Power Supply Fan (variable speed)

 

Supported

Active heatsink (variable speed)

 

 

Chassis fan (variable speed)

 

Slots Supported

Four (4) full-height expansion slots

 

Front I/O

Two (2) USB 2.0 ports

 

Rear I/O

Standard Micro ATX I/O connectors, including four (4 ) USB 2.0 ports

 

Drive Bays

Two (2) 5-1/4” external

 

 

One (1) 3-1/2” external

 

 

Two (2) 3-1/2” internal

 

Internal Speaker

Standard

 

Security

Padlock loop

 

 

Kensington Lock Support

 

Power Supply

250-watt ATX Power Supply – PFC/non-PFC with a 115v/230v line switch

 

 

 

Unit Environment and Operating Conditions

General Unit Operating Guidelines

Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit is operated within the specified operating range.

Leave a 4 in (10.2 cm) clearance on all vented sides of the computer to permit the required airflow.

Never restrict airflow into the computer by blocking any vents or air intakes.

Do not stack computers on top of each other or place computers so near each other that they are subject to each other's re-circulated or preheated air.

Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other foreign matter can block the vents and limit the airflow.

If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the enclosure, and the same operating guidelines listed above will still apply.

Temperature Range

Operating: 50° to 95° F (10° to 35° C)

 

Non-operating: -22° to 140° F( -30° to 60° C)

Relative Humidity

Operating: 10% to 90% (non-condensing at ambient)

 

Non-operating: 5% to 95% (non-condensing at ambient)

Maximum Altitude

Operating: 10,000 ft (3048 m)

(unpressurized)

Non-operating: 30,000 ft (9000 m)

NOTE: Operating temperature is de-rated 1.0 deg C per 1000 ft (300 m) to 10,000 ft (3000 m) above sea level, no direct sustained sunlight. Maximum rate of change is 10 deg C/Hr. The upper limit may be limited by the type and number of options installed.

DA - 12668

Canada — Version 3 — March 28, 2007

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Contents Overview MicrotowerAt a Glance Standard Features Select Models Smart Buy Promotional Models English French DescriptionStandard Features and Configurable Components Hard Drives System MemoryStorage Diskette DriveGraphics MiscellaneousSystem Details PCICooling Solutions Power SupplyTemperature Range Memory TypeBios PWMLOM IDEFeatures WirelessPower Conservation Intel PRO/1000 PT Gigabit PCIe AdapterAltitude Operating Non-OperatingShock VibrationAfter-Market Options Accessories Monitors CRTs Optical DrivesCables and Adapters Chassis EnhancementsOptional Memory Upgrades MemoryDDR Synch Dram NON-ECC Memory Standard MemoryStorage Drive SupportTechnical Specifications Audio Technical Specifications Communications Error Correction Data Compression Power ManagementUpgradeability PowerHealth EMCTelecom Technical Specifications Graphics RamdacDisplay max resolution Board configuration Specification DescriptionCore power Option kit contentsATI Radeon X1300 Pro 256MB DH PCIe Graphics Card Bus Type Maximum Vertical Refresh 85 Hz Rate Display SupportEMI RFI Technical Specifications Input DevicesESD EMI-RFI Technical Specifications Hard Drives 250 GB Capacity Technical Specifications Optical Storage SATA/ATAPIDVD-ROM CD-ROM CD-R CD-RW DVD-ROM DVD-ROM DL DVD-RAM DVD+R DVD+R DLCD-ROM, CD-R CD-RCD-RW DVD+R DVD+RWDVD-R DL DVD-RTechnical Specifications Removable Storage Extremes Environmental OperationalStorage environmental Batteries Technical Specifications Environmental DataDeclarations Additional Information 2002/95/ECPackaging RecyclingHewlett-Packard Information
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