HP DX2300 manual Packaging, Recycling, Hewlett-Packard, Information

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QuickSpecs

HP Compaq dx2300 Microtower Business PC

Technical Specifications - Environmental Data

 

Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

Packaging

HP follows these guidelines to decrease the environmental impact of product packaging:

 

Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging

 

materials.

 

Eliminate the use of ozone-depleting substances (ODS) in packaging materials.

 

Design packaging materials for ease of disassembly.

 

Maximize the use of post-consumer recycled content materials in packaging materials.

 

Use readily recyclable packaging materials such as paper and corrugated materials.

 

Reduce size and weight of packages to improve transportation fuel efficiency.

 

Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.

End-of-life Management

Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic areas.

and Recycling

To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP sales

 

office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.

Hewlett-Packard

For more information about HP's commitment to the environment:

Corporate Environmental

Global Citizenship Report

Information

 

http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html

 

Eco-label certifications

 

http://www.hp.com/hpinfo/globalcitizenship/environment/productdesign/ecolabels.html

 

ISO 14001 certificates:

 

http://www.hp.com/hpinfo/globalcitizenship/environment/operations/envmanagement.html

 

 

© Copyright 2007 Hewlett-Packard Development Company, L.P. All rights reserved.

The information contained herein is subject to change without notice.

Intel and Pentium are U.S. registered trademarks of Intel Corporation. Microsoft and Windows are U.S. registered trademarks of Microsoft Corporation. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

DA - 12668 Canada — Version 3 — March 28, 2007

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Contents Overview MicrotowerAt a Glance Standard Features Select Models Smart Buy Promotional Models English French DescriptionStandard Features and Configurable Components Storage Hard DrivesSystem Memory Diskette DriveGraphics MiscellaneousSystem Details PCITemperature Range Cooling SolutionsPower Supply Memory TypeLOM BiosPWM IDEPower Conservation FeaturesWireless Intel PRO/1000 PT Gigabit PCIe AdapterShock Altitude OperatingNon-Operating VibrationAfter-Market Options Cables and Adapters Accessories Monitors CRTsOptical Drives Chassis EnhancementsDDR Synch Dram NON-ECC Memory Optional Memory UpgradesMemory Standard MemoryStorage Drive SupportTechnical Specifications Audio Technical Specifications Communications Upgradeability Error CorrectionData Compression Power Management PowerTelecom EMCHealth Technical Specifications Graphics RamdacCore power Display max resolutionBoard configuration Specification Description Option kit contentsATI Radeon X1300 Pro 256MB DH PCIe Graphics Card Bus Type Maximum Vertical Refresh 85 Hz Rate Display SupportESD Technical Specifications Input DevicesEMI RFI EMI-RFI Technical Specifications Hard Drives 250 GB Capacity DVD-ROM Technical Specifications Optical StorageSATA/ATAPI CD-ROM CD-R CD-RW DVD-ROM DVD-ROM DL DVD-RAM DVD+R DVD+R DLCD-RW CD-RCD-ROM, CD-R DVD-R DL DVD+RDVD+RW DVD-RTechnical Specifications Removable Storage Storage environmental Environmental OperationalExtremes Declarations Technical Specifications Environmental DataBatteries Additional Information 2002/95/ECHewlett-Packard PackagingRecycling Information
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