HP 500B VS875UT#ABA manual Packaging Materials External, RoHS Compliance, Material Usage

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QuickSpecs

Compaq 500B Microtower PC

Technical Specifications - Environmental Data

Packaging Materials

External

 

 

Corrugated

1680 g

 

Internal

 

 

EPE-Expanded Polyethylene

115 g

 

Polyethylene low density foam

40 g

 

The EPE-Expanded Polyethylene packaging material is made from 0% recycled content.

 

The Polyethylene low density foam packaging material is made from 0% recycled content.

 

The Corrugated packaging materials contains at least 0% recycled content.

RoHS Compliance

Hewlett-Packard is committed to compliance with all applicable environmental laws and regulations,

 

including the European Union Restriction of Hazardous Substances (RoHS) Directive. HP's goal is to

 

exceed compliance obligations by meeting the requirements of the RoHS Directive on a worldwide basis.

 

By July 1, 2006, RoHS substances will be virtually eliminated (virtually = to levels below legal limits) for

 

all HP electronic products subject to the RoHS Directive, except where it is widely recognized that there is

 

no technically feasible alternative (as indicated by an exemption under the EU RoHS Directive).

Material Usage

This product does not contain any of the following substances in excess of regulatory limits (refer to the

 

HP General Specification for the

 

Environment at http://www.hp.com/hpinfo/globalcitizenship/environment/

 

supplychain/gen_specifications.html):

 

Asbestos

 

Certain Azo Colorants

 

Certain Brominated Flame Retardants – may not be used as flame retardants in plastics

 

Cadmium

 

Chlorinated Hydrocarbons

 

Chlorinated Paraffins

 

Formaldehyde

 

Halogenated Diphenyl Methanes

 

Lead carbonates and sulfates

 

Lead and Lead compounds

 

Mercuric Oxide Batteries

 

Nickel – finishes must not be used on the external surface designed to be frequently handled or

 

carried by the user.

 

Ozone Depleting Substances

 

Polybrominated Biphenyls (PBBs)

 

Polybrominated Biphenyl Ethers (PBBEs)

 

Polybrominated Biphenyl Oxides (PBBOs)

 

Polychlorinated Biphenyl (PCB)

 

Polychlorinated Terphenyls (PCT)

 

Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been

 

voluntarily removed from most applications.

 

Radioactive Substances

 

Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

Packaging

HP follows these guidelines to decrease the environmental impact of product packaging:

Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials.

Eliminate the use of ozone-depleting substances (ODS) in packaging materials. Design packaging materials for ease of disassembly.

Maximize the use of post-consumer recycled content materials in packaging materials. Use readily recyclable packaging materials such as paper and corrugated materials.

DA - 13418 North America — Version 2 — October 30, 2009

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Contents Overview Watt power supplyMicrotower PCIe x1 slots, 1 PCIe x16 graphics slotAt a Glance Processor and Speed Operating Systems and PreinstalledIntel Celeron Dual-Core Processors Intel Pentium Dual-Core ProcessorsSystem Memory Hard DrivesStorage Optical Drives Serial ATAPCI System DetailsPower Supply Cooling SolutionsMemory Type Hard Drive InterfacesBios PWMLOM NIC Specs System EnvironmentalHumidity Operating Altitude OperatingQuickSpecs After-Market Options availability may vary by country Monitors Memory Optional Memory UpgradesDDR Synch Dram NON-ECC Memory Standard MemoryOptical Drive StorageSerial ATA Hard Drive USB PortsTechnical Specifications Audio Technical Specifications Communications Storage temperature PCIe WeightPower consumption Receive sensitivity Mode Data rateData transfer rate Data Rate MCS EWC 2.4 GHz MbpsMbps 802.11 b Kbps Mbps 802.11 g Mbps 20 MHz EWC Mbps 20 MHz EWC Mbps 40 MHzData Compression Power Management Error CorrectionUpgradeability PowerSafety Other FeaturesEMC TelecomRamdac Technical Specifications GraphicsBoard configuration Specification Description Hdmi PCIe ConnectorsDisplay max resolution Maximum powerQuickSpecs Technical Specifications Input Devices ESDEMI RFI Characteristics Dimensions L x W x H HP USB Mini-Keyboard Physical KeysCable length EMI-RFI MtbfTechnical Specifications Hard Drives 500 GB Capacity 625,142,448500,107,862,016 bytes 976,773,168Technical Specifications Optical Storage DVD-ROMCD-ROM CD-R CD-RW DVD-ROM DVD-ROM DL DVD-RAM DVD+R DVD+R DL DVD+R DVD-RAMDVD+RW DVD-R DLTechnical Specifications Miscellaneous Technical Specifications Environmental Data RoHS Compliance Packaging Materials ExternalMaterial Usage PackagingRecycling Hewlett-PackardInformation