HP DX2250 Memory Type, Hard Drive Interfaces, Supported Chassis Front Panel, Cooling Solutions

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QuickSpecs

HP Compaq dx2250 Microtower Business PC

System Details

Technology and Features

Memory Type

PC2-5300 DDR2 SDRAM (667-MHz) non-ECC

 

 

2 GB maximum system memory

 

Hard Drive Interfaces

Serial ATA 3.0-Gb/s hard drives are supported

 

Supported

 

 

 

 

Chassis

Front Panel

Power button

 

 

Power On LED

 

 

HDD Activity LED

 

Cooling Solutions

Power Supply Fan (variable speed)

 

Supported

Aluminum active heatsink (variable speed)

 

 

Chassis fan (variable speed)

 

Slots Supported

Four (4) full-height expansion slots

 

Front I/O

Two (2) USB 2.0 ports

 

Rear I/O

Standard Micro ATX I/O connectors, including four (4) USB 2.0 ports

 

Drive Bays

Two (2) 5-1/4” external

 

 

One (1) 3-1/2” external

 

 

Two (2) 3-1/2” internal

 

Internal Speaker

Standard

 

Security

Padlock loop

 

Power Supply

250-watt ATX Power Supply – PFC/non-PFC with a 115v/230v line switch

 

 

(varies by country/region)

 

 

 

Unit Environment and Operating Conditions

General Unit Operating Guidelines

Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit is operated within the specified operating range.

Leave a 4 in (10.2 cm) clearance on all vented sides of the computer to permit the required airflow.

Never restrict airflow into the computer by blocking any vents or air intakes.

Do not stack computers on top of each other or place computers so near each other that they are subject to each other's re-circulated or preheated air.

Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other foreign matter can block the vents and limit the airflow.

If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the enclosure, and the same operating guidelines listed above will still apply.

Temperature Range

Operating: 50° to 95° F (10° to 35° C)

 

Non-operating: –22° to 140° F (–30° to 60° C)

Relative Humidity

Operating: 10% to 90% (non-condensing at ambient)

 

Non-operating: 5% to 95% (non-condensing at ambient)

Maximum Altitude

Operating: 10,000 ft (3048 m)

(unpressurized)

Non-operating: 30,000 ft (9000 m)

NOTE: Operating temperature is de-rated 1.0 deg C per 1000 ft (300 m) to 10,000 ft (3000 m) above sea level, no direct sustained sunlight. Maximum rate of change is 10 deg C/Hr. The upper limit may be limited by the type and number of options installed.

System Board

Processor

Socket AM2 industry standard Micro ATX form factor

DA - 12605 Canada — Version 18 — March 24, 2008

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Contents Microtower OverviewModel Key and Example Standard Features Select ModelsAMD Sempron Processors with HyperTransport Technology Standard Features and Configurable ComponentsOperating System Preinstalled Processor and SpeedStorage Application SoftwareHard Drives System MemoryGraphics MouseAudio CommunicationPCI System DetailsMemory Type Cooling SolutionsPower Supply Temperature RangeIDE BiosPWM LOMPower Conservation Additional FeaturesFeatures WirelessHumidity Operating System EnvironmentalSpecs OperatingQuickSpecs After-Market Options BB731UT Optical DrivesBusiness Widescreen LCD Monitor with Integrated Speakers Monitors CRTsBusiness LCD Monitors Business Widescreen LCD MonitorsDimm Size Slot MemoryDDR Synch Dram NON-ECC Memory Maximum MemoryDrive Support StorageTechnical Specifications Audio Technical Specifications Communications Power Error CorrectionData Compression Power Management UpgradeabilityEMC Ramdac Technical Specifications GraphicsCompliance standards EMC Emissions Option kit contentsEMC Immunity ESD Technical Specifications Input/Output DevicesEMI RFI EMI-RFI Technical Specifications Hard Drives 250 GB Capacity Technical Specifications Optical Storage DVD-R CD-ROM, CD-R DVD-R DLDVD+RW, DVD-RW DVD+R DL, DVD-R DL DVD-ROM, DVD+R41 to 122 F 5 to 50 C DVD+R media Technical Specifications Removable Storage Storage environmental Environmental OperationalExtremes Technical Specifications Environmental Data Material Usage BatteriesInformation PackagingHewlett-Packard Corporate EnvironmentalQuickSpecs
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