HP DX2250 manual Technical Specifications Input/Output Devices, Esd, Emi Rfi

Page 23

QuickSpecs

HP Compaq dx2250 Microtower Business PC

Technical Specifications - Input/Output Devices

HP PS/2 or USB Standard

Physical

Keys

104, 105, 106, 107, 109 layout (depending

Keyboard

characteristics

 

upon country)

 

 

Dimensions (L x W x H)

18.0 x 6.4 x 0.98 in (45.8 x 16.3 x 2.5 cm)

 

 

Weight

2 lb (0.9 kg) minimum

 

Electrical

Operating voltage

+ 5VDC ± 5%

 

 

Power consumption

50-mA maximum (with three LEDs ON)

 

 

ESD

CE level 4, 15-kV air discharge

 

 

EMI – RFI

Conforms to FCC rules for a Class B computing

 

 

 

device

 

 

MicrosoftPC 99 – 2001

Functionally compliant

 

Mechanical

Languages

38 available

 

 

Keycaps

Low-profile design

 

 

Switch actuation

55-g nominal peak force with tactile feedback

 

 

Switch life

20 million keystrokes (using Hasco modified

 

 

 

tester)

 

 

Switch type

Contamination-resistant switch membrane

 

 

Key-leveling mechanisms

For all double-wide and greater-length keys

 

 

Cable length

6 ft (1.8 m)

 

 

Microsoft PC 99 – 2001

Mechanically compliant

 

 

Acoustics

43-dBA maximum sound pressure level

 

Environmental

Operating temperature

50° to 122° F (10° to 50° C)

 

 

Non-operating

-22° to 140° F (-30° to 60° C)

 

 

temperature

 

 

 

Operating humidity

10% to 90% (non-condensing at ambient)

 

 

Non-operating humidity

20% to 80% (non-condensing at ambient)

 

 

Operating shock

40 g, six surfaces

 

 

Non-operating shock

80 g, six surfaces

 

 

Operating vibration

2-g peak acceleration

 

 

Non-operating vibration

4-g peak acceleration

 

 

Drop (out of box)

26 in (66 cm) on carpet, six-drop sequence

 

 

Drop (in box)

42 in (107 cm) on concrete, 16-drop sequence

 

Approvals

UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC

 

Ergonomic compliance

ANSI HFS 100, ISO 9241-4, and TUVGS

 

 

 

 

DA - 12605 Canada — Version 18 — March 24, 2008

Page 23

Image 23
Contents Microtower OverviewModel Key and Example Standard Features Select ModelsAMD Sempron Processors with HyperTransport Technology Standard Features and Configurable ComponentsOperating System Preinstalled Processor and SpeedStorage Application SoftwareHard Drives System MemoryGraphics MouseAudio CommunicationPCI System DetailsMemory Type Cooling SolutionsPower Supply Temperature RangeIDE BiosPWM LOMPower Conservation Additional FeaturesFeatures WirelessHumidity Operating System EnvironmentalSpecs OperatingQuickSpecs After-Market Options BB731UT Optical DrivesBusiness Widescreen LCD Monitor with Integrated Speakers Monitors CRTsBusiness LCD Monitors Business Widescreen LCD MonitorsDimm Size Slot MemoryDDR Synch Dram NON-ECC Memory Maximum MemoryDrive Support StorageTechnical Specifications Audio Technical Specifications Communications Power Error CorrectionData Compression Power Management UpgradeabilityEMC Ramdac Technical Specifications GraphicsEMC Immunity Option kit contentsCompliance standards EMC Emissions EMI RFI Technical Specifications Input/Output DevicesESD EMI-RFI Technical Specifications Hard Drives 250 GB Capacity Technical Specifications Optical Storage DVD-R CD-ROM, CD-R DVD-R DLDVD+RW, DVD-RW DVD+R DL, DVD-R DL DVD-ROM, DVD+R41 to 122 F 5 to 50 C DVD+R media Technical Specifications Removable Storage Extremes Environmental OperationalStorage environmental Technical Specifications Environmental Data Material Usage BatteriesInformation PackagingHewlett-Packard Corporate EnvironmentalQuickSpecs
Related manuals
Manual 23 pages 45.39 Kb Manual 17 pages 5.48 Kb Manual 29 pages 47.87 Kb Manual 22 pages 40.83 Kb