HP CQ57-229WM, CQ57-218NR, CQ57-212NR, CQ57-214NR manual

NOTE: The following illustration shows the fan/heat sink assembly removal process on a computer model equipped with an Intel processor, the Intel HM45 chipset, and a graphics subsystem with UMA memory.

The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the base enclosure, fan/heat sink assembly, processor, and system board spare part kits. Replacement thermal material is also available in the Thermal Material Kit, spare part numbers 650277-001 (for use only with computer models equipped with an AMD processor) and 646135-001 (for use only with computer models equipped with an Intel processor).

NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an AMD processor.

76 Chapter 4 Removal and replacement procedures