HP 450 G1 Tools Required, Tool Description, Product Disassembly Process Tool Size if applicable

refractory ceramic fibers
Components, parts and materials containing	NO
radioactive substances
2.0 Tools Required

0

List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.

Tool Description

Description #1 Cross screwdriver

Description #2 P1 screwdriver

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

Tool Size (if applicable)

#1

#1

3.1List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1.Take off the battery package from system bottom side.

2.Release DIMM/HDD door knob and take off DIMM/HDD door.

3.Loose HDD & ODD module screws and take off HDD & ODD module from system.

4.Loose WLAN/WWAN screws and take off WLAN/WWAN,DIMM module from system.

5.Loose KB module screw, and then take off KB module.

6.Loose L-case to U-case screws on bottom side & U-case to L-case screw on top side, and take off U-case from system.

7.Loose the screw of the speaker ,power board, function board, touchpad module, FPR, SD board ,and USB board then take off them.

8.Loose screw of hinge to L-case, take off LCD module from L-case.

9.Loose screw of MB to U-case, take off MB. Loose screw of thermal module from MB, take off thermal module

10.Loose screw and screw mylar, take off hinge cover and lcd bezel.

11.Loose LCD & Hinge screw, take off LCD , hinge and panel.

3.2Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00	Page 2
Template Revision B
	PSG instructions for this template are available at EL-MF877-01