HP dx2400 HP Wireless A+G PCI Dimensions, Weight, System interface, Network standard, Humidity

Page 17

QuickSpecs

HP Compaq dx2400 Microtower Business PC

Technical Specifications - Communications

HP Wireless A+G PCI Dimensions

4.99 x 2.54 x 0.71 in (126.8 x 64.4 x 18.0 mm)

Weight

0.268 lb (65 g)

 

 

Controller

Atheros AR5414X chipset

 

 

system interface

PCI Spec 2.2

 

 

Network standard

IEEE 802.11a/b/g

 

 

Frequency band

5.1500 to 5.8500 GHz

 

 

 

2.4000 to 2.4835 GHz

 

 

 

2.4465 to 2.4835 GHz (Europe, Middle East, Asia and Asia Pacific –

 

excluding Japan)

 

 

 

2.4000 to 2.4697 GHz (Japan)

 

 

Operating Temperature32° to 140° F (0° to 60° C), operating

Storage temperature

-4° to 176° F (-20° to 80° C), non-operating

Humidity

10% to 85% non-condensing

 

 

Operating voltage

5V ± 5%

 

 

Power consumption

Tx/Rx peak 560/250mA @ 3.3V (max.)

Output power

15 dBM ±2dB

 

 

(approximately)

 

 

 

Receive sensitivity

-90dBm at 11 Mbps (typical)

 

 

Data transfer rate

Standard rates of 1, 2, 5.5, 11, 6, 9, 12, 18, 24, 48, 54 and Super AG

 

Mode108-Mbps

 

 

Spreading

DSSS (Direct Sequence Spread Spectrum)

Security

64(40h) bit, 128(104h) bit, WPA, IEEE802.1X, AES-OCB, AES-CCM,

 

Microsoft PEAP,TKIP, WEP

 

 

Antenna

External 5dBi antenna

 

 

Throughput

108 Mbps (only with Belkin 54G or

200 ft (60.96 m) – Indoor

 

above router that supports 108

 

 

 

Mbps speed)

 

 

 

54 Mbps

200 ft (60.96 m) – Indoor

 

11 Mbps

200 ft (60.96 m) – Indoor

Certifications

Wi-Fi certified

 

 

Certifications for use

North America: United States, Canada

by country

Europe: Austria, Belgium, Cyprus, Denmark, Finland, France, Germany,

 

Greece, Iceland, Ireland, Italy, Liechtenstein, Luxembourg, Netherlands,

 

Norway, Portugal, Spain, Sweden, Switzerland, United Kingdom

 

Australia, New Zealand

 

 

 

 

 

 

DA - 12921 Worldwide QuickSpecs — Version 6 — 5.8.2008

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Contents Microtower OverviewAt a Glance Processor and Speed Standard Features and Configurable ComponentsIntel Celeron Processors Intel Pentium ProcessorsSystem Memory Hard DrivesStorage Diskette DriveMiscellaneous CommunicationGraphics PCI System DetailsCooling Solutions FeaturesPower Supply Temperature Range OperatingLOM BiosPWM Gigabit PCIe Adapter Features 8111C-GR GbE FeaturesWireless Power ConservationVibration ShockAcoustic Noise Fixed Disk RandomAfter-Market Options TFTs Accessories Monitors CRTsGSA Monitors OptionsMemory Optional Memory UpgradesDDR Synch Dram NON-ECC Memory Standard MemoryStorage HP Compaq dx2400 Microtower Business PCTechnical Specifications Audio Capabilities Technical Specifications CommunicationsASF, WOL, PXE, DMI, WFM Weight HP Wireless A+G PCI DimensionsStorage temperature Power consumptionEMC Ramdac Technical Specifications GraphicsInput/Output connectors Display max resolutionBoard configuration Specification Description Core powerResolution Hz LCD 60-Hz 75-Hz 85-Hz DVI-D ConnectorHP ADD2 Sdvo PCIe Models X16 DVI-D Adapter Form Factor640 x 85 Hz 800 x 1024 x 1280 x 1600 x 1920 x 75 Hz 2048 x EMI RFI Technical Specifications Input DevicesESD EMI-RFI MtbfESD EMI-RFI HP PS/2 Optical Scroll MouseTechnical Specifications Hard Drives 500 GB Capacity Technical Specifications Optical Storage SATA/ATAPI DVD+R/-R/+RWPower Environmental all conditions non-condensing Access timesDVD-ROM, DVD+R DVD-R CD-ROM, CD-RTechnical Specifications Removable Storage 10C 10% R.H. ≥ 24 hours Technical Specifications Environmental Data
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