HP dx2400 manual Technical Specifications Input Devices, Esd, Emi Rfi

Page 23

QuickSpecs

HP Compaq dx2400 Microtower Business PC

Technical Specifications - Input Devices

HP PS/2 or USB

Physical

Keys

104, 105, 106, 107, 109 layout (depending

Standard Keyboard

characteristics

 

upon country)

 

 

Dimensions (L x W x H)

18.0 x 6.4 x 0.98 in (45.8 x 16.3 x 2.5 cm)

 

 

Weight

2 lb (0.9 kg) minimum

 

Electrical

Operating voltage

+ 5VDC ± 5%

 

 

Power consumption

50-mA maximum (with three LEDs ON)

 

 

ESD

CE level 4, 15-kV air discharge

 

 

EMI – RFI

Conforms to FCC rules for a Class B

 

 

 

computing device

 

 

MicrosoftPC 99 – 2001

Functionally compliant

 

Mechanical

Languages

38 available

 

 

Keycaps

Low-profile design

 

 

Switch actuation

55-g nominal peak force with tactile feedback

 

 

Switch life

20 million keystrokes (using Hasco modified

 

 

 

tester)

 

 

Switch type

Contamination-resistant switch membrane

 

 

Key-leveling

For all double-wide and greater-length keys

 

 

mechanisms

 

 

 

Cable length

6 ft (1.8 m)

 

 

Microsoft PC 99 – 2001

Mechanically compliant

 

 

Acoustics

43-dBA maximum sound pressure level

 

Environmental

Operating temperature

50° to 122° F (10° to 50° C)

 

 

Non-operating

-22° to 140° F (-30° to 60° C)

 

 

temperature

 

 

 

Operating humidity

10% to 90% (non-condensing at ambient)

 

 

Non-operating humidity20% to 80% (non-condensing at ambient)

 

 

Operating shock

40 g, six surfaces

 

 

Non-operating shock

80 g, six surfaces

 

 

Operating vibration

2-g peak acceleration

 

 

Non-operating

4-g peak acceleration

 

 

vibration

 

 

 

Drop (out of box)

26 in (66 cm) on carpet, six-drop sequence

 

 

Drop (in box)

42 in (107 cm) on concrete, 16-drop

 

 

 

sequence

 

Approvals

UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC

 

Ergonomic compliance ANSI HFS 100, ISO 9241-4, and TUVGS

 

 

 

 

DA - 12921 Worldwide QuickSpecs — Version 6 — 5.8.2008

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Contents Microtower OverviewAt a Glance Intel Pentium Processors Standard Features and Configurable ComponentsProcessor and Speed Intel Celeron ProcessorsDiskette Drive Hard DrivesSystem Memory StorageMiscellaneous CommunicationGraphics PCI System DetailsTemperature Range Operating FeaturesCooling Solutions Power SupplyLOM BiosPWM Power Conservation 8111C-GR GbE FeaturesGigabit PCIe Adapter Features WirelessFixed Disk Random ShockVibration Acoustic NoiseAfter-Market Options Options Accessories Monitors CRTsTFTs GSA MonitorsStandard Memory Optional Memory UpgradesMemory DDR Synch Dram NON-ECC MemoryStorage HP Compaq dx2400 Microtower Business PCTechnical Specifications Audio Capabilities Technical Specifications CommunicationsASF, WOL, PXE, DMI, WFM Power consumption HP Wireless A+G PCI DimensionsWeight Storage temperatureEMC Ramdac Technical Specifications Graphics Core power Display max resolution Input/Output connectors Board configuration Specification DescriptionX16 DVI-D Adapter Form Factor DVI-D ConnectorResolution Hz LCD 60-Hz 75-Hz 85-Hz HP ADD2 Sdvo PCIe Models640 x 85 Hz 800 x 1024 x 1280 x 1600 x 1920 x 75 Hz 2048 x EMI RFI Technical Specifications Input DevicesESD EMI-RFI MtbfESD EMI-RFI HP PS/2 Optical Scroll MouseTechnical Specifications Hard Drives 500 GB Capacity Technical Specifications Optical Storage SATA/ATAPI DVD+R/-R/+RWDVD-R CD-ROM, CD-R Access timesPower Environmental all conditions non-condensing DVD-ROM, DVD+RTechnical Specifications Removable Storage 10C 10% R.H. ≥ 24 hours Technical Specifications Environmental Data
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