HP dc7800 manual Installing SODIMMs

Installing SODIMMs

CAUTION: You must disconnect the power cord before adding or removing memory modules. Regardless of the power-on state, voltage is always supplied to the memory modules as long as the computer is plugged into an active AC outlet. Adding or removing memory modules while voltage is present may cause irreparable damage to the memory modules or system board.

The memory module sockets have gold-plated metal contacts. When upgrading the memory, it is important to use memory modules with gold-plated metal contacts to prevent corrosion and/or oxidation resulting from having incompatible metals in contact with each other.

Static electricity can damage the electronic components of the computer or optional cards. Before beginning these procedures, ensure that you are discharged of static electricity by briefly touching a grounded metal object. For more information, refer to Appendix D, Electrostatic Discharge

on page 39.

When handling a memory module, be careful not to touch any of the contacts. Doing so may damage the module.

1.Remove/disengage any security devices that prohibit opening the computer.

2.Remove all removable media, such as a compact disc, from the computer.

3.Turn off the computer properly through the operating system, then turn off any external devices.

4.Disconnect the power cord from the power outlet and disconnect any external devices.

CAUTION: You must disconnect the power cord and wait approximately 30 seconds for the power to drain before adding or removing memory modules. Regardless of the power-on state, voltage is always supplied to the memory modules as long as the computer is plugged into an active AC outlet. Adding or removing memory modules while voltage is present may cause irreparable damage to the memory modules or system board.

5.If the computer is on a stand, remove the computer from the stand and lay the computer down.

6.Remove the computer access panel.

7.Locate the memory module sockets on the system board.

WARNING! To reduce risk of personal injury from hot surfaces, allow the internal system components to cool before touching.

16 Chapter 2 Hardware Upgrades ENWW