HP 315EU Material Usage, Packaging, End-of-life, Management Recycling, Hewlett-Packard, Corporate

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QuickSpecs

Compaq 315eu MT PC (EMEA only)

Technical Specifications - Environmental Data

 

regulations, including the European Union Restriction of Hazardous Substances (RoHS) Directive.

 

HP's goal is to exceed compliance obligations by meeting the requirements of the RoHS Directive

 

on a worldwide basis. By July 1, 2006, RoHS substances will be virtually eliminated (virtually = to

 

levels below legal limits) for all HP electronic products subject to the RoHS Directive, except

 

where it is widely recognized that there is no technically feasible alternative (as indicated by an

 

exemption under the EU RoHS Directive).

Material Usage

This product does not contain any of the following substances in excess of regulatory limits (refer

 

to the HP General Specification for the Environment at:

 

http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specifications.html):

 

Asbestos

 

Certain Azo Colorants

 

Certain Brominated Flame Retardants – may not be used as flame retardants in plastics

 

Cadmium

 

Chlorinated Hydrocarbons

 

Chlorinated Paraffins

 

Formaldehyde

 

Halogenated Diphenyl Methanes

 

Lead carbonates and sulfates

 

Lead and Lead compounds

 

Mercuric Oxide Batteries

 

Ozone Depleting Substances

 

Polybrominated Biphenyls (PBBs)

 

Polybrominated Biphenyl Ethers (PBBEs)

 

Polybrominated Biphenyl Oxides (PBBOs)

 

Polychlorinated Biphenyl (PCB)

 

Polychlorinated Terphenyls (PCT)

 

Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has

 

been voluntarily removed from most applications.

 

Radioactive Substances

 

Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

 

Nickel finishes that release greater than 0.5 micro-grams/cm2/week, measured according to

 

EN 1811:1998, are not used on any product surface designed to be frequently handled or

 

touched by users.

Packaging

HP follows these guidelines to decrease the environmental impact of product packaging:

 

Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in

 

packaging materials.

 

Eliminate the use of ozone-depleting substances (ODS) in packaging materials.

 

Design packaging materials for ease of disassembly.

 

Maximize the use of post-consumer recycled content materials in packaging materials.

 

Use readily recyclable packaging materials such as paper and corrugated materials.

 

Reduce size and weight of packages to improve transportation fuel efficiency.

 

Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.

End-of-life

Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic

Management and

areas. To recycle your product, please go to: http://www.hp.com/go/reuse-recycleor contact your

Recycling

nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a

 

responsible manner.

 

The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for

 

each product type for use by treatment facilities. This information (product disassembly

 

instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These

 

instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM

 

customers who integrate and re-sell HP equipment.

Hewlett-Packard

For more information about HP's commitment to the environment:

Corporate

Global Citizenship Report

Environmental

http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html

DA - 13686 Worldwide QuickSpecs — Version 3 — 7.23.2010

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Contents Overview QuickSpecsSystem Memory Operating Systems and PreinstalledApplication Software Hard DrivesCommunication AudioGraphics PCI System DetailsChassis Front Panel Cooling SolutionsPower Supply Temperature Range OperatingPWM BiosLOM System Environmental Power ConservationTemperature Energy SaverRandom vibration at 5Hz@0.00025G²/Hz Standard Memory Optional Memory UpgradesMemory DDR Synch Dram NON-ECC MemoryMaximum Quantity Supported Controller StorageTechnical Specifications Audio Technical Specifications Communications ESD Technical Specifications Input DevicesEMI RFI EMI-RFI MtbfTechnical Specifications Hard Drives QuickSpecs Technical Specifications Optical Storage Technical Specifications Environmental Data Management Recycling Material UsagePackaging End-of-lifeInformation