ASRock B75M R2.0 manual Specifications

1.2 Specifications

Platform	- Micro ATX Form Factor: 9.6-in x 8.4-in, 24.4 cm x 21.3 cm
	- All Solid Capacitor design
CPU	- Supports 3rd and 2nd Generation Intel® CoreTM i7 / i5 / i3 in
	LGA1155 Package
	- Supports Intel® Turbo Boost 2.0 Technology
	- Supports Hyper-Threading Technology (see CAUTION 1)
Chipset	- Intel® B75
	- Supports Intel® Small Business Advantage (see CAUTION 2)
	- Supports Intel® Rapid Start Technology and Smart Connect
	Technology
Memory	- Dual Channel DDR3 Memory Technology (see CAUTION 3)
	- 2 x DDR3 DIMM slots
	- Supports DDR3 1600/1333/1066 non-ECC, un-buffered
	memory (DDR3 1600 with Intel® Ivy Bridge CPU, DDR3
	1333 with Intel® Sandy Bridge CPU)
	- Max. capacity of system memory: 16GB (see CAUTION 4)
	- Supports Intel® Extreme Memory Profile (XMP)1.3/1.2
Expansion Slot	- 1 x PCI Express 3.0 x16 slot (PCIE1: x16 mode)
	(see CAUTION 5)
	* PCIE 3.0 is only supported with Intel® Ivy Bridge CPU. With
	Intel® Sandy Bridge CPU, it only supports PCIE 2.0.
	- 1 x PCI Express 2.0 x16 slot (PCIE2: x4 mode)
	- 2 x PCI slots
	- Supports AMD Quad CrossFireXTM and CrossFireXTM
Graphics	* Intel® HD Graphics Built-in Visuals and the VGA outputs can
	be supported only with processors which are GPU
	integrated.
	- Supports Intel® HD Graphics Built-in Visuals: Intel® Quick
	Sync Video 2.0, Intel® InTruTM 3D, Intel® Clear Video HD
	Technology, Intel® InsiderTM, Intel® HD Graphics 2500/4000
	- Pixel Shader 5.0, DirectX 11 with Intel® Ivy Bridge CPU.
	Pixel Shader 4.1, DirectX 10.1 with Intel® Sandy Bridge CPU
	- Max. shared memory 1760MB (see CAUTION 6)
	- Three VGA Output options: D-Sub, DVI-D and HDMI
	(see CAUTION 7)
	- Supports HDMI 1.4a Technology with max. resolution up to
	1920x1200 @ 60Hz
	- Supports DVI with max. resolution up to 1920x1200 @ 60Hz

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