ASRock Z77 OC Formula manual Specifications

1.2 Specifications

Platform	- CEB Form Factor: 12.0-in x 10.5-in, 30.5 cm x 26.7 cm
	- Premium Gold Capacitor design (100% Japan-made
	high-quality Conductive Polymer Capacitors)
OC Formula Kit	OC Formula Power Kit
	- Digi Power
	- Dual-Stack MOSFET (DSM) (see CAUTION 1)
	- Multiple Filter Cap (MFC) (Filter different noise by 3 different
	capacitors: DIP solid cap, POSCAP and MLCC)
	- Premium Alloy Choke (Reduce 70% core loss compare to
	iron powder choke)
	OC Formula Connector Kit
	- Hi-Density Power Connector
	- 15μGold Finger (CPU and memory sockets)
	OC Formula Cooling Kit
	- Twin-Power Cooling (Combine active air cooling and water
	cooling)
	- 8 Layer PCB
	- 4 x 2oz copper
	- GELID GC-Extreme Thermal Compound
CPU	- Supports 3rd and 2nd Generation Intel® CoreTM i7 / i5 / i3 in
	LGA1155 Package
	- 12 + 4 Power Phase Design
	- Supports Intel® Turbo Boost 2.0 Technology
	- Supports Intel® K-Series unlocked CPU
	- Supports Hyper-Threading Technology (see CAUTION 2)
Chipset	- Intel® Z77
	- Supports Intel® Rapid Start Technology and Smart Connect
	Technology
Memory	- Dual Channel DDR3 Memory Technology (see CAUTION 3)
	- 4 x DDR3 DIMM slots
	- Supports DDR3 3000+(OC)/2800(OC)/2666(OC)/2400(OC)/
	2133(OC)/1866(OC)/1600/1333/1066 non-ECC, un-buffered
	memory
	- Max. capacity of system memory: 32GB (see CAUTION 4)
	- Supports Intel® Extreme Memory Profile (XMP)1.3/1.2
Expansion Slot	- 2 x PCI Express 3.0 x16 slots (PCIE2/PCIE4: single at x16
	(PCIE2) / x8 (PCIE4) or dual at x8/x8 mode)
	(see CAUTION 5)
	* PCIE 3.0 is only supported with Intel® Ivy Bridge CPU. With

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