Important Safety Instructions

(c)Do NOT operate the oven if it is damaged until it has been repaired by a qualified microwave service technician trained by the manufacturer. It is particularly important that the oven door closes properly and that there is no damage to the:

(1)door (bent)

(2)door hinges (broken or loose)

(3)door seals and sealing surfaces

(d)The oven should not be adjusted or repaired by anyone other than a properly

qualified microwave service technician trained by the manufacturer.

This product is a Group 2 Class B ISM equipment. The definition of group 2 which contains all ISM equipment in which radio-frequency energy is intentionally generated and/ or used in the form of electromagnetic radiation for the treatment of material, and EDM and arc welding equipment.

For Class B equipment is equipment suitable for use in domestic establishments and in establishments directly connected to a low voltage power supply network which supplies buildings used for domestic purposes.

Make sure that these safety precautions are obeyed at all times.

WARNING

Only qualified staff should be allowed to modify or repair the microwave oven.

Do not heat liquids and other food in sealed containers for microwave function.

For your safety, do not use high-pressure water cleaners or steam jet cleaners.

Do not install this appliance; near heater, inflammable material; in a humid, oily or dusty location, in a location exposed to direct sunlight and water or where gas may leak; on un level ground.

This appliance must be properly grounded in accordance with local and national codes.

Remove all foreign substances such as dust or water from the power plug terminals and contact points using a dry cloth on a regular basis.

Do not pull or excessively bend or place heavy objecton the power cord.

In the event of a gas leak (such as propane gas, LP gas, etc.), ventilate immediately without touching the power plug.

GS89F-1S_ELE_DE68-03817W_EN.indd 7

Do not touch the power plug with wet hands.

Do not turn the appliance off by unplugging the power plug while an operation is in progress.

Do not insert fingers or foreign substances, If any foreign substance such as water has entered the appliance, unplug the power plug and contact your nearest service centre.

Do not apply excessive pressure or impact to the appliance.

Do not place the oven over a fragile object such as a sink or glass object. (Counter top model only)

Do not use benzene, thinner, alcohol, steam cleaner or high pressure cleaner to clean the appliance.

Ensure that the power voltage, frequency and current are the same as those of the product specifications.

Plug the power plug into the wall socket firmly. Do not use a multiple plug adapter, an extension cord or an electric transformer.

Do not hook the power cord on a metal object, insert the power cord between the objects or behind the oven.

Do not use a damaged power plug, damaged power cord or loose wall socket. When the power plug or power cord is damaged, contact your nearest service centre.

Appliances are not intended to be operated by means of an external timer or separate remote-control system.

Do not pour or directly spray water onto the oven.

Do not place objects on the oven, inside or on the door of the oven.

Do not spray volatile material such as insecticide onto the surface of the oven.

Children should be supervised to ensure that they do not play with the appliance. Keep children away from the door when opening or closing it as they may bump themselves on the door or catch their fingers in the door.

The appliance is not intended for installing in road vehicles, caravans and similar vehicles etc.

Do not store flammable materials in the oven. Take special care when heating dishes or drinks that contain alcohol as alcohol vapours may contact a hot part of the oven.

ENGLISH

2012-06-08 �� 5:57:32

GS89F-1S/ELE specifications

The Samsung GS89F-1S/ELE is a sophisticated system-on-chip (SoC) that showcases the latest advancements in semiconductor technology. Designed for various applications ranging from mobile devices to embedded systems, this chip combines high performance, energy efficiency, and cutting-edge features.

At the heart of the GS89F-1S/ELE is its powerful processor architecture, which typically incorporates multiple cores. This multi-core configuration allows for efficient multitasking and improved performance in computationally intensive applications. The chip leverages advanced manufacturing processes to achieve higher clock speeds while maintaining lower power consumption, which is essential for battery-operated devices.

One of the standout features of the GS89F-1S/ELE is its integrated graphics processing unit (GPU), which enhances the multimedia capabilities of devices. With support for high-definition video playback and advanced graphical rendering, users can enjoy a rich visual experience. This feature is particularly beneficial for gaming applications and high-resolution media consumption.

Moreover, the GS89F-1S/ELE includes built-in artificial intelligence (AI) capabilities. These AI processing units allow for on-device machine learning, enabling functionalities such as voice recognition, image processing, and smart camera features. The inclusion of AI technology enhances user interactions, as devices can adapt and respond to user needs more effectively.

Connectivity is another key attribute of the GS89F-1S/ELE. It typically supports a wide range of wireless communication standards, including 5G, Wi-Fi 6, and Bluetooth. This versatility ensures fast and reliable connections for seamless data transfer and communication between devices.

Security features are integral to the design of the GS89F-1S/ELE as well. The chip often includes hardware-based security mechanisms such as trusted execution environments (TEE) and encryption modules. These features help protect sensitive data and ensure secure transactions, which is particularly important in today's digital landscape.

In summary, the Samsung GS89F-1S/ELE represents a significant leap in SoC technology. With its robust processing power, advanced graphics capabilities, integrated AI functions, and enhanced connectivity, it is well-suited for a variety of applications. Its emphasis on energy efficiency and security further solidifies its status as a top choice for manufacturers looking to deliver cutting-edge devices in an increasingly competitive market.