AMD 8 manual QuantiSpeed Architecture Summary

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Preliminary Information

AMD Athlon™ XP Processor Model 8 Data Sheet

25175H— March 2003

The features of the AMD Athlon XP processor model 8 are QuantiSpeed™ architecture, a high-performance full-speed cache, an advanced 333 front-side Bus (FSB) with a 2.7-Gigabyte per second system bus, or an advanced 266 FSB with a 2.1-Gigabyte per second system bus, and 3DNow!™ Professional technology. The AMD Athlon system bus combines the latest technological advances, such as point-to-point topology, source-synchronous packet-based transfers, and low-voltage signaling to provide an extremely powerful, scalable bus for an x86 processor.

The AMD Athlon XP processor model 8 is binary-compatible with existing x86 software and backwards compatible with applications optimized for MMX™, SSE, and 3DNow! technology. Using a data format and single-instruction multiple-data (SIMD) operations based on the MMX instruction model, the AMD Athlon XP processor model 8 can produce as many as four, 32-bit, single-precision floating-point results per clock cycle. The 3DNow! Professional technology implemented in the AMD Athlon XP processor model 8 includes new integer multimedia instructions and software-directed data movement instructions for optimizing such applications as digital content creation and streaming video for the internet, as well as new instructions for digital signal processing (DSP) and communications applications.

1.1QuantiSpeed™ Architecture Summary

The following features summarize the AMD Athlon XP processor model 8 QuantiSpeed architecture:

■Advanced 333 FSB technology available

■An advanced nine-issue, superpipelined, superscalar x86 processor microarchitecture designed for increased instructions per cycle (IPC) and high clock frequencies

■Fully pipelined floating-point unit that executes all x87 (floating-point), MMX, SSE and 3DNow! instructions

■Hardware data pre-fetch that increases and optimizes performance on high-end software applications utilizing high- bandwidth system capabilities

■Advanced two-level translation look-aside buffer (TLB) structures for both enhanced data and instruction address translation. The AMD Athlon XP processor model 8 with QuantiSpeed architecture incorporates three TLB optimizations: the L1 DTLB increases from 32 to 40 entries, the L2 ITLB and L2 DTLB both use exclusive architecture, and the TLB entries can be speculatively loaded.

2

Overview

Chapter 1

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Contents AMD AthlonTM XP Processor Model Data Sheet Advanced Micro Devices, Inc. All rights reserved Contents Electrical Data Ordering Information Preliminary Information Typical AMD Athlon XP Processor Model 8 System Block Diagram List of FiguresList of Figures List of Tables List of Tables Revision History , revised , Interface Signal Groupings, on Bus AC Characteristics, onApic Pin AC and DC Characteristics, on , revised wording in OverviewOverview QuantiSpeed Architecture Summary Typical AMD Athlon XP Processor Model 8 System Block Diagram Preliminary Information Overview Interface SignalsSignaling Technology AMD Athlon System Bus Signals Push-Pull PP DriversDiode Logic Symbol DiagramFrequency Control Front-Side Bus Autodetect Legacy Preliminary Information Power Management Power Management StatesWorking State Halt StatePreliminary Information Connect Protocol Connect and Disconnect ProtocolProbe State Preliminary Information Procrdy Exiting the Stop Grant State and Bus Connect Sequence Diagram Connect StateReturn internal clocks to full speed and assert Connect Pending Disconnect Disconnect4/CDisconnect request NorthbridgeClock Control Cpuid Support Preliminary Information Chapter 49.4 W Model NumberMaximum 51.0 W68.3 W 48.5 W62.8 W Duty Cycle Parameter Description Minimum MaximumClock Frequency Advanced 266 FSB AMD Athlon System Bus AC Characteristics AMD Athlon System Bus AC CharacteristicsPreliminary Information Maximum Typical 2083 2600+ Electrical and Thermal SpecificationsThermal Power5 2167 2700+166 Advanced 333 FSB AMD Athlon System Bus AC Characteristics Different clock edge ForwardPreliminary Information Electrical Data Interface Signal GroupingsInterface Signal Groupings ConventionsTest Pins on Signals See Voltage IdentificationPower 73, Ferr Pin onFrequency Identification FID30 Vcca AC and DC CharacteristicsVoltage Identification VID40 Decoupling Vcccore CharacteristicsVcccore AC and DC Characteristics Vcccore Voltage Waveform Absolute Ratings Absolute RatingsSysclk and SYSCLK# DC Characteristics Sysclk and SYSCLK# DC CharacteristicsAMD Athlon System Bus DC Characteristics AMD Athlon System Bus DC CharacteristicsGeneral AC and DC Characteristics General AC and DC CharacteristicsInput Time to Acquire Signal Rise TimeSignal Fall Time Input Time to ReacquireOpen-Drain Test Circuit 50 Ω ±3% Open-Drain Pin IOL = Output Current2Thermal Diode Electrical Characteristics Thermal Diode CharacteristicsThermal Diode Electrical Characteristics Preliminary Information Guidelines for Platform Thermal Protection of the Processor Apic Pins AC and DC CharacteristicsApic Pin AC and DC Characteristics Signal and Power-Up Requirements Power-Up RequirementsPwrok Preliminary Information Selection FID30 Processor Warm Reset RequirementsClock Multiplier Mechanical Loading Mechanical DataDie Loading Location Dynamic MAX Static MAX Units Die Surface 100Letter or Minimum Maximum 45311.33 REF 435 375 Preliminary Information Dimension 49.27 49.78 D1/E1 45.72 BSC 917 REF 47 REF 977 Preliminary Information Pin Diagram and Pin Name Abbreviations Pin DescriptionsAMD Athlon XP Processor Bottomside View Pin Name Abbreviations AC31 Abbreviation Full Name Pin Q31 S31 U31 U37 W31 Y31 Y33AA31 AD30AG37 AE33AJ35 AL33E27 W33J35 E15F32 F24F28 F34AM10 AK34AK36 AM14V34 V30V32 V36Pin List No Pin Cross-Reference by Pin LocationPin Name A35 SDATA40# A37 SDATA30#E33 NC Pin E35 SDATA31# E37 SDATA22# SDATA52# E11 SDATA50# E13 SDATA49# E15E29 SDATA33# E31 SDATA32# Pin Name NC Pin F10NC Pin VID4 J31 J33 SDATA19# J35 NC Pin H10 H12H28 NC Pin H30 H32 H34 J37 SDATA29#S35 SDATA15# S37 Key Pin Q31 NC Pin Q33 SDATA24# Q35 SDATA17# Q37 SDATA16#S31 NC Pin S33 U31 NC Pin U33FID2 FID3 NC Pin Key Pin Y31 Y33 Y35 FID0 FID1NC Pin W31 W33 Y37 SDATA12#NC Pin AF10 AF12 NC Pin AD30 AD32AE31 NC Pin AE33 AF20AJ27 NC Pin AJ29 AH30 FSBSense1 AH32NC Pin AJ11 AJ13 Analog AJ15 AJ17 AJ19 AJ21 NC Pin AK10NC Pin Name AL25 NC Pin AL27 AL29NC Pin AM10 AN11 NC Pin AN13Detailed Pin Descriptions FID30 Pins COREFB# PinsPins Connect PinFID30 Clock Multiplier Encodings FID30IGNNE# Pin Jtag PinsFLUSH# Pin INIT# PinNC Pins K7CLKOUT# PinsKey Pins PGA Orientation PinsThermdc Pins SADDOUT10# PinsScan Pins VID40 PinsVrefsys Pin ZN and ZP PinsVID40 Code to Voltage Definition VID40Ordering Information Standard AMD Athlon XP Processor Model 8 ProductsPreliminary Information Ideal Diode Equation Constants and Variables for the Ideal Diode EquationTemperature Offset Correction --- I-- high------  Preliminary Information Signals and Bits Appendix BData Terminology Abbreviation Meaning Abbreviations and AcronymsAbbreviations Acronyms APINMI VGA Related Publications Preliminary Information

8 specifications

AMD's Ryzen 8000 series, commonly referred to as AMD 8, represents a significant leap in performance and efficiency, leveraging advanced technologies that cater to gamers, content creators, and enterprise users alike. With a continued focus on the Zen architecture, the Ryzen 8000 processors enhance performance per watt, delivering increased efficiency without compromising on power.

One of the standout features of AMD 8 is its adoption of the 5nm process technology. This innovation allows for a higher density of transistors, resulting in improved performance metrics and reduced power consumption. The smaller node size not only enhances clock speeds but also ensures that the chips generate less heat, making thermal management easier for system builders.

AMD has introduced a new architecture with the Ryzen 8000 series known as Zen 5. This architecture brings improved instructions per cycle (IPC) over its predecessors, leading to faster performance in both single-threaded and multi-threaded workloads. Gamers will benefit from higher frame rates, while professionals in fields such as video editing and 3D rendering can expect noticeable improvements in rendering times.

Another key technology in the AMD 8 lineup is the integration of AMD's next-generation RDNA graphics architecture. This allows for enhanced graphics performance in systems without dedicated GPU hardware. The combination of advanced graphics and CPU capabilities provides a more versatile platform for casual gamers and users with less demanding graphical needs.

Support for PCIe 5.0 is a game changer for the AMD 8000 series, offering double the bandwidth of its predecessor, PCIe 4.0. This feature allows for faster data transfer rates with compatible SSDs and graphics cards, ensuring that users can take full advantage of the latest storage technologies.

Additionally, AMD's Infinity Cache has made its way into the Ryzen 8000 series, further enhancing memory bandwidth. This technology reduces latency and increases efficiency by caching frequently accessed data closer to the processor.

In terms of connectivity, the Ryzen 8000 models come equipped with Wi-Fi 7 and Bluetooth 5.2, providing ultra-fast wireless connections that are essential for modern gaming and streaming experiences.

In summary, AMD's Ryzen 8000 series, or AMD 8, is designed for maximum performance and efficiency. With its advanced 5nm technology, enhanced Zen 5 architecture, integrated RDNA graphics, PCIe 5.0 support, Infinity Cache, and state-of-the-art connectivity features, it sets a new standard for processors in its class, making it a top choice for both gamers and professionals.
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