Texas Instruments SLOU025 manual Description, TPA122 Msop EVM Specifications

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Description

1.2 Description

The TPA122 MSOP Audio Power Amplifier Evaluation Module is a complete, low-power stereo audio power amplifier for high-fidelity line-level output, headphone, and small speaker applications. It consists of the TI TPA122 150-mW Stereo Audio Power Amplifier IC in a very small MSOP package, along with a small number of other parts mounted on a circuit board that is approximately one and a quarter inches square (Figure 1±1).

Figure 1±1. The TI TPA122 Audio Amplifier Evaluation Module

Shutdown

VDD

GND

 

 

 

S1

+

 

 

R1

C5

 

IN1

R2

 

GND

C1

R3

 

 

 

 

 

 

 

Vo1

 

C2

U1²

GND

TEXAS

 

 

INSTRUMENTS

 

C4

 

C3

R5

 

 

R4

GND

 

 

 

IN2

SLOP127

Vo2

GND

 

TPA122 MSOP EVM

 

² Due to the very small size of the MSOP IC package, the standard part number TPA122 is replaced with the code TIAAE

Single in-line header pins are mounted to the underside of the module circuit board to allow the EVM to be plugged into the TI Plug-N-Play Audio Amplifier Evaluation Platform, or to be wired directly into existing circuits and equipment when used stand-alone.

The platform has room for a single TPA122 evaluation module. It is a convenient vehicle for demonstrating TI's audio power amplifier and related evaluation modules. The EVMs simply plug into the platform, which automatically provides power to the modules, interconnects them correctly, and connects them to a versatile array of standard audio input and output jacks and connectors. Easy-to-use configuration controls allow the platform and EVMs to quickly model many possible end-equipment configurations.

There is nothing to build, nothing to solder, and nothing but the speakers included with the platform to ªhook up.º

1.3 TPA122 MSOP EVM Specifications

Supply voltage range, VDD

. . . . . 2.5 V to 5.5 V

Supply current, IDD

. . . . . 160 mA, max

Continuous output power, PO: 8 Ω, VDD =5 V

. . . . . . . . . . 150 mW

Audio input voltage, VI

VDD + 0.3 Vpp, max

Minimum load impedance, RL

. . . . . . . . . . . . . . 8 Ω

Introduction 1-3

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Contents Users Guide Important Notice Related Documentation From Texas Instruments PrefacePage Contents Tables FiguresIntroduction Features Description TPA122 Msop EVM SpecificationsIntroduction EVM JP6 JP7 JP8 Quick StartPower PrecautionsPlatform preparations Quick Start List for PlatformQuick Start List for Stand-Alone Power-upDetails ±1. The TI Plug-N-Play Audio Amplifier Evaluation Platform ±2. TPA122 Msop EVM TPA122 Msop Audio Power Amplifier Evaluation Module±4. TPA122 Amplifier IC 1 TPA122 Audio Amplifier ICShutdown Module GainEVM Insertion Installing and Removing EVM BoardsOff U2 Stereo Power Amplifier EVM Signal Routing±6. Shutdown Polarity Control Power Requirements Inputs Inputs and Outputs1 TPA122 Msop EVM Connected as a Stereo Headphone Amplifier Using The TPA122 Msop EVM Stand-Alone±1. TPA122 Msop EVM Parts List

SLOU025 specifications

Texas Instruments (TI) is renowned for its extensive portfolio of analog and mixed-signal integrated circuits, with the SLOU025 document detailing a very specific product that focuses on precision applications in various electronics. This document, often referred to in the industry, serves as a comprehensive resource for engineers and designers looking to understand the capabilities of TI's offerings.

One of the main features highlighted in SLOU025 is the high level of precision. The products covered in this document are designed for applications requiring low noise and high accuracy. This characteristic is critical in fields like telecommunications, industrial automation, and medical devices, where even minor inaccuracies can lead to significant system errors.

SLOU025 showcases a range of technologies utilized in TI products, including advanced data conversion techniques. These technologies allow for the seamless integration of multiple functions within a single chip, reducing the overall footprint of electronic designs. This integration not only enhances performance but also simplifies the design process for engineers, enabling faster time-to-market for new products.

Another important characteristic mentioned is power efficiency. Many of the devices described in SLOU025 prioritize low power consumption while maintaining high performance levels. This is particularly important in battery-powered and portable applications, where energy efficiency has a direct impact on the overall usability and lifespan of the device.

The document also emphasizes the versatility of Texas Instruments’ products. With various configurations available, engineers can select the most suitable option for their specific applications, whether it be for automotive, communication, or consumer electronics. This adaptability makes TI components highly sought after in the competitive semiconductor market.

Furthermore, SLOU025 illustrates the commitment of Texas Instruments to continuous innovation. The company invests heavily in research and development to stay at the forefront of technology advancements, which is reflected in the superior performance metrics of its devices.

In summary, Texas Instruments SLOU025 functions as an essential guide for stakeholders involved in electronics design and implementation. It underscores the features of high precision, advanced data conversion technologies, power efficiency, versatility, and a commitment to innovation that collectively enhance TI’s offerings in the market. The detailed insights provided in this document empower engineers to make informed decisions that ultimately lead to the creation of superior electronic solutions.