Transport / Storage Requirements, Pressure Drop

Specifications continued

Dimensions: (without fittings)

Depth:	4.9 in	(12.5 cm)
Width:	2.3 in	(5.7 cm)
Height:	4.1 in	(10.4 cm)
Weight:	2.9 lbs	(1.3 kg)
Shipping Weight:	3.5 lbs	(1.6 kg)
Operating Temperature Range:	59°F to 104°F (15°C to 40°C)

Transport / Storage Requirements

Temperature Range:	-10°F to 140°F (-23°C to 60°C)
Humidity:	Max 95% Noncondensing
F O Accuracy:*	± 3% of full scale @ 50 psi (3.4 bar)
I 2	± 3% of full scale @ 50 psi (3.4 bar)

Pressure Drop:

Low Flow: ≤ 2 psi (0.14 bar) at inlet pressures from 30-90 psi

(2.1- 6.2 bar) and at 10 lpm flow rate at 60% FIO2.

High Flow: ≤ 3 psi (0.21 bar) at inlet pressures from 30-90 psi

(2.1- 6.2 bar) and at 30 lpm flow rate at 60% FIO2.

The Helium-Oxygen Blender has been cleaned for Oxygen Service prior to delivery.

The Helium-Oxygen Blender reverse gas flow complies with clause 6 of ISO 11195.

The alarmed Oxygen Monitor / Analyzer should comply with ISO 7767 to meet CE requirement.

Dryness and Composition for inlet gases:

Heliox: Medical grade 80/20 or 70/30 is required.

Oxygen: Oxygen supply must meet all requirements of USP Medical Oxygen.

Dew Point:

(ONLY for CE requirements)

Both inlets should remain 10°F (-12.2°C) or more below the lowest temperature to which the air distribution system equipment is exposed. At a temperature of 25°F (-3.9°C) and a pressure of 90 psi (6.33 kg/cm2) this equates to 2000 mg/m3.

* Accuracy of FIO2 will be affected if bleed flow is not engaged at low flows. (At or below 3 lpm for Low Flow and 15 lpm for High Flow).

*When Heliox tank pressure and oxygen outlet pressures are unbalanced, bleed may need to be engaged at a higher liter flow to maintain accuracy.

Specifications are subject to change without prior notice.

HELIO2
Blender	5
HELIUM-Oxygen	5

PM5400, PM5500 specifications

The Helio PM5500 and PM5400 are advanced power management integrated circuits (PMICs) designed to optimize power usage and enhance the efficiency of modern electronic devices. These PMICs incorporate a range of key technologies and features that make them ideal for applications in smartphones, tablets, wearables, and IoT devices.

One of the standout features of the Helio PM5500 and PM5400 is their ability to support multiple output voltage levels, allowing them to power a variety of components within a device. This versatility is crucial for modern applications that require different voltage rails for processors, memory, and peripheral components. The output current capacity of these PMICs is robust, ensuring that even power-hungry modules can be efficiently powered.

Both PMICs are built on advanced power management technologies that enhance efficiency and thermal performance. They incorporate synchronous buck converters, which allow for higher efficiency and reduced thermal dissipation compared to traditional linear regulators. This is critical in portable devices that need to maximize battery life while maintaining performance.

Another key aspect of the Helio PM5500 and PM5400 is their integration of advanced protection features. These include overcurrent protection, thermal shutdown, and undervoltage lockout, which ensure reliability and safety during operation. Such features help safeguard sensitive components from potential damage, thereby extending the lifespan of the device.

The PMICs also support various communication protocols, enabling seamless integration with microcontrollers and application processors. This capability is essential for efficient power management strategies, allowing the PMICs to adjust their output dynamically based on real-time power demands.

Furthermore, the Helio PM5500 and PM5400 are designed with a compact footprint, making them suitable for space-constrained applications. Their small size does not compromise their performance, ensuring that manufacturers can achieve the desired balance between form factor and functionality.

In summary, the Helio PM5500 and PM5400 power management ICs are distinguished by their multi-voltage support, high efficiency, integrated protection mechanisms, and compact design. These features make them an excellent choice for a wide range of applications in the ever-evolving landscape of electronic devices. Their robust capabilities not only enhance the performance of devices but also contribute to energy efficiency, aligning with the growing demand for sustainable technology solutions.