36 Chapter 1
Hardware Specifications and Configurations
Item T7600 T7400 T7200 T5600 T5500
CPU speed (GHz) 2.33 2.16 2 1.83 1.66
Bus speed (MHz) 667 667 667 667 667
Bus/Core Ratio 1413121110
L2 cache size (MB) 44422
L2 cache speed (GHz) 2.33 2.16 2 1.83 1.66
Package type (pin) 479/478 479/478 479/478 479/478 479/478
Manufacturing technology (nm) 65 65 65 65 65
Thermal design power 34W 34W 34W 34W 34W
Thermal specification (oC) 100 100 100 100 100
Core voltage (V) 1.0375 ~
1.30
1.0375 ~
1.30
1.0375 ~
1.30
1.0375 ~
1.30
1.0375 ~
1.30
Item T2700 T2600 T2500 T2400 T2300
CPU speed (GHz) 2.33 2.16 2 1.83 1.66
Bus speed (MHz) 667 667 667 667 667
Bus/Core Ratio 1313121110
L2 cache size (MB) 22222
L2 cache speed (GHz) 2.33 2.16 2 1.83 1.66
Package type (pin) 478 478 479/478 478 478
Manufacturing technology (nm) 65 65 65 65 65
Thermal design power 31W 31W 31W 31W 31W
Thermal specification (oC) 100 100 100 100 100
Core voltage (V) 1.0375 ~
1.30
1.0375 ~
1.30
1.0375 ~
1.30
1.0375 ~
1.30
1.0375 ~
1.30
Item Specification
Package Micro-FCBGA 1466-pin
Power 1.05V (core), 1.5V, VCCSM (DDR2 = 1.8V), 2.5V, 3.3V
Feature • Processor host bus support
• Integrated SDRAM controller up to 4GB (2 SODIMM support)
Integrated SDRAM clock buffer to support 2 SODIMM
• External Graphics interface for PCI Express Architecture support
• DMI x 2 and DMI x 4 for connection between GMCH and ICH7M
Item Specification
Package BGA 652-pin
Power 1.05V (core), 1.5V, 3.3V, 5V, CMOS I/O