Chapter 1 23
Thermal Design
Item Description
Thermal Design TThermal solutin should cover Intel (R) 2006 FMB (65W)
requirement
T2 4-pin smart fan for system
T1 2-pin fan for north bridge
TProvision for optional secondary fan
TAdequate venting in the front of chassis
TAdequate venting in the rear of chassis
Memory Address Map
Address Size Function
0000000 - 009FFFF 640 KB System Memory Onboard DRAM
00A0000-00BFFFF 128 KB Video RAM Reserved for Graphics Display
Buffer
Non-Cacheable
00C0000-00CFFFF 32 KB I/O Expansion ROM Reserved for ROM on I/O
Adapters
00D0000-00D3FFF 16 KB I/O Expansion ROM Reserved for ROM on I/O
Adapters
00D4000-00D7FFF 16 KB I/O Expansion ROM Reserved for ROM on I/O
Adapters
00D8000-00DBFFF 16 KB I/O Expansion ROM Reserved for ROM on I/O
Adapters
00DC000-00DFFFF 16 KB I/O Expansion ROM Reserved for ROM on I/O
Adapters
00E0000-00E7FFF 32 KB for SCSI BIOS Reserved for SCSI BIOS
00E8000-00EFFFF 32 KB Reserved Onboard
00F0000-00FFFFF 64 KB BIOS System ROM BIOS (ROM)
System RAM BIOS (DRAM)
0100000-0F9FFFF System Memory Onboard DRAM
0FA0000-0FFFFFF 384 KB I/O Card Memory Reserved for Memory Map
I/O Card
Non-Cacheable
1000000-FFFFFFF System Memory Onboard DRAM
PCI INTx# and IDSEL Assignment Map
PCI INTx # PCI Devices Device IDSEL: ADxx
INTA# ADIMM-slot N
INTB# PCI-Slot1 AD16
INTC# PCI-Slot2 AD17