TACT SwitchTM
Soldering Conditions
Condition for Reflow
Available for Surface Mount Type.
1. | Heating method: Double heating method with infrared heater. |
2. | Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）at solder joints（copper foil surface）. A heat resistive tape |
Detector | should be used to fix thermocouple. |
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3. | Temperature profile |
Push |
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Slide
Rotary
Encoders
Power
Multi Control Devices
TACT SwitchTM
Custom- Products
Temperature (˚C )
180
150
Note
260˚C max. 3 sec max.
230˚C
Time
120 sec max（. | 40s max. |
3 to 4min.
Time inside soldering equipment
1.The above temperature shall be measured on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the material, size, thickness of PC boards and others. The
2.Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
Sharp Feeling
Soft Feeling
Surface Mount Type
Radial
Type
Conditions for Auto-dip
Available for
（Except SKHJ, SKHL, SKQJ, SKQK, SKEG series）
Items | Condition | |
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Flux | Mounting surface | |
should not be exposed to flax | ||
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|
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Preheating temperature | Ambient temperature of the soldered | |
surface of PC board. | ||
| 100℃ max. | |
Preheating time | 60s max. | |
|
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Soldering temperature | 260℃ max. | |
|
| |
Duration of immersion | 5s max. | |
|
| |
Number of soldering | 2times max. | |
|
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Manual Soldering（Except SKRT series）
Items | Condition |
|
|
Soldering temperature | 350℃max. |
|
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Duration of soldering | 3s max. |
|
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Capacity of soldering iron | 60W max. |
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Notes
1.Consult with us for TACT SwitchTM washing conditions.
2.Prevent flux penetration from the top side of the TACT SwitchTM.
3.Switch terminals and a PC board should not be coated with flux prior to soldering.
4.The second soldering should be done after the switch returns to normal temperature.
5.Use the flux with a specific gravity of min 0.81.
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