AD604
Rev. E | Page 29 of 32
COMPLIANTTO JEDEC STANDARDS MO-150-AG
060106-A
24 13
12
1
8.50
8.20
7.90
8.20
7.80
7.40
5.60
5.30
5.00
SEATING
PLANE
0.05 MIN
0.65 BSC
2.00 MAX
0.38
0.22
COPLANARITY
0.10
1.85
1.75
1.65
0.25
0.09
0.95
0.75
0.55
Figure 64. 24-Lead Shrink Small Outline Package [SSOP]
(RS-24)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD604AN −40°C to +85°C 24-Lead Plastic Dual In-Line Package [PDIP] N-24-1
AD604ANZ1
−40°C to +85°C 24-Lead Plastic Dual In-Line Package [PDIP] N-24-1
AD604AR −40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24
AD604AR-REEL −40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24
AD604ARZ1
−40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24
AD604ARZ-RL1
−40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24
AD604ARS −40°C to +85°C 24-Lead Shrink Small Outline Package [SSOP] RS-24
AD604ARS-REEL −40°C to +85°C 24-Lead Shrink Small Outline Package [SSOP] RS-24
AD604ARS-REEL7 −40°C to +85°C 24-Lead Shrink Small Outline Package [SSOP] RS -24
AD604ARSZ1
−40°C to +85°C 24-Lead Shrink Small Outline Package [SSOP] RS-24
AD604ARSZ-RL1
−40°C to +85°C 24-Lead Shrink Small Outline Package [SSOP] RS-24
AD604ARSZ-R71
−40°C to +85°C 24-Lead Shrink Small Outline Package [SSOP] RS-24
AD604-EVALZ1
Evaluation Board
1 Z = RoHS Compliant Part.