| APES | Requirement | IT | Blue | TCO '03 | ECMA | ||
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(Apple's Product Environmental Specifications) | Yes | No | Not | ('02) | Desktop | Desktop | (6/99) | |
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| CPUs | Display |
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2.19 | Future recycling and material utilization processes are taken into | X |
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2.20 | Electronic modules containing harmful substances are easily | X |
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| A.2 |
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traceable and removable for recycling |
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2.21 | The case parts are free from electronic modules | X |
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| A.11 |
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2.22 | The product has a modular design and no special tools are needed | X |
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| P6.8 | 4.4, C.1 |
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| to upgrade the product |
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2.23 | Processor, memory and cards of various types can be | X |
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| P6.9 | 4.4, C.2 |
| 5.2 |
| changed/upgraded |
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2.24 | Information on the ability to change/upgrade components is included | X |
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| 4.5 |
| 5.2 |
in the product documentation |
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2.25 | Design allows for installation, expansion exchange, upgrade, or | X |
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| P6.10 | 4.4, C.3 |
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attachment of a mass storage unit |
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3.0 | Banned/restricted materials |
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3.1 | CFCs and HCFCs are not present in the product | X |
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| P1.1 |
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| No substances included in annex A, B or C of the Montreal Protocol |
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3.2 | on Substances that Deplete the Ozone Layer are used in the | X |
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| 5.8 |
manufacture of the printed wiring boards, assembly of the Printed |
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| Wiring Boards and final assembly of the product |
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3.3 | Asbestos, PCB and PCT are not present in the product. | X |
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| 5.8 |
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3.4 | Mercury is not present in the product (with the exception of mercury | X |
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| P1.2 |
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| 5.8 |
| in flat panel backlighting) |
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| Connections to be separated during disassembly of FPD must be |
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3.5 | easy to take apart in order to not damage the mercury lamps. This | X |
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| A.6.3.2 |
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means that gluing and welding must not be used to bond parts and |
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| make removal of the lamps complicated. |
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| Mercury (Hg) in flat panel display backlight bulb(s): |
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| __1.9_ mg (minimum) |
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3.6 | __3.0_ mg (average) | « Values |
| P6.17 |
| A.6.3.2 |
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| __3.5_ mg (maximum) |
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| ___6_ number of backlight bulbs |
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| Brominated and chlorinated flame retardants, PBB and PBDEs are |
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3.7 | not present in mechanical plastic parts heavier than | X |
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| P6.12 |
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| X 25 g / ___ 50 g |
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3.8 | No PCB (polychlorinated biphenyls) or PCT (polychlorinated | X |
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| 5.8 |
terphenyls) are present in product |
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| The base material of Printed Wiring Board must not contain any |
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3.9 | PBB (polybrominated biphenyls), PBDE (polybrominated diphenyl | X |
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| 3.1.2.2 |
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| ethers) or chlorinated paraffins |
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| Plastic components weighing more than 25 grams shall not contain |
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3.10 | flame retardants that contain organically bound chlorine or bromine. | X |
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| A.6.2.3 |
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| The flame retardant threshold value is 0.5 weight percent. |
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| A list of all plastic components in the product that weigh >25 grams |
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| shall be given. The list shall include information regarding use of |
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3.11 | flame retardants. CAS# and FR type must be provided for flame | X |
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| A.6.2.4 |
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retardant concentrations over 0.5 weight percent. Part of the |
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| information can, for secrecy reasons, be sent directly from the |
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| plastic manufacturer to TCO certified lab. |
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| Plastic parts that weight more than 25 grams in the VDU shall not |
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3.12 | contain chlorine or bromine as a part of the polymer; i.e. polyvinyl | X |
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| A.6.2.5 |
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| chloride (PVC) |
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3.13 | No antimony trioxide (Sb2O3) flame retardants are used in plastic | X |
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| enclosure resins |
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3
