4 Chapter

DIGI+ Power Control

DIGI+ Power Control allows you to adjust the VRM voltage and frequency for optimal system efficiency, overall system stability and performance.

CPU Power

You can configure the following CPU Power items:

•CPU Power Duty Control

CPU Power Duty Control adjusts the current of every VRM phase and the thermal conditions of every phase component.

•CPU Load-line Calibration

CPU Load-line Calibration adjusts the voltage range and controls the system temperature. Higher load-line calibration could get higher voltage and good overclocking performance but increases the CPU and VRM thermal conditions.

•CPU Current Capability

CPU Current Capability provides wider total power range for overclocking. A higher value setting gets higher VRM power consumption delivery.

•CPU Power Thermal Control

A higher temperature brings a wider CPU power thermal range, and extends the overclocking tolerance to enlarge overclocking potential.

•CPU Power Phase Control

CPU Power Phase Control allows you to get more transient and better thermal performance by increasing the phase number under heavy system loading. To increase

VRM efficiency, reduce the phase number under light system loading.

*The system automatically sets the default to [Extreme] when using the Intel® iGPU.

•CPU Voltage Frequency

CPU Voltage Frequency affects the VRM transient response and thermal components. Higher VRM frequency gets quicker transient response.

DRAM Power

You can configure the following DRAM items:

•DRAM Power Phase Control

Select Extreme for full phase mode to increase system performance or select

Optimized for ASUS optimized phase tuning profile to increase DRAM power efficiency.

•DRAM Current Capability

A higher value brings a wider total power range and extends the overclocking frequency range simultaneously.

•DRAM Voltage Frequency

Allows you to adjust the DRAM switching frequency for system stability or to increase OC Range.

• The actual performance boost may vary depending on your CPU specification.

• Do not remove the thermal module. The thermal conditions must be monitored.

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Chapter 4: Software support