A P P E N D I X B

Specifications

Table B-1. QLA2xxx Board Operating Environment

Environment

Minimum

Maximum

 

 

 

Operating temperature

0° C/32° F

55° C/131° F

Storage temperature

-20°C/-4°F

70° C/158° F

Relative humidity (noncondensing)

10%

90%

Storage humidity (noncondensing)

5%

95%

 

 

 

Table B-2. QLA2xxx Board Specifications

Type

Specification

 

 

 

Host bus

Conforms to PCI Local Bus Specification, revision 2.1

PCI signaling

3.3 V and 5.0 V busses supported

environment

 

 

PCI transfer rate

264 Mbytes/sec maximum burst rate for 33 MHz operation

 

(ISP2200 chip)

 

 

528 Mbytes/sec maximum burst rate for 66 MHz operation

 

(ISP2200A chip)

 

Fibre Channel

Bus type:

copper media, twisted pair (QLA2200)

specifications

 

fibre optic media (QLA2200F)

 

Bus transfer rate: 100 Mbytes/sec maximum

Central process-

Single-chip design that includes a Reduced Instruction Set Com-

ing unit (CPU)

puter (RISC) processor, Fibre Channel protocol manager, Periph-

 

eral Component Interconnect Direct Memory Access (PCI DMA)

 

controller, and 1-gigabit transceivers

Host data trans-

64-bit, bus master DMA data transfers to 264 Mbytes/sec

fer

 

 

RAM

128K bytes of something Random Access Memory (SRAM),

 

optionally expandable to 256K bytes

BIOS ROM

128K bytes of flash Read-Only Memory (ROM) in two 64K-byte,

 

software selectable banks. The flash is field programmable.

 

 

 

Specifications B-1

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Image 17
Dell 2200F, QLA2200 manual Specifications, Table B-1. QLA2xxx Board Operating Environment