Dell, How is data input to this memory?, Chipset | Dell R210

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		How is data input to this memory?
		Managed Services Repository: Various partitions are loaded using
		vendor-provided firmware file and loader program just like iDRAC OS.

	TPM ID EEPROM (Plug-	Factory loaded only
	in module only)	Factory loaded only
	in module only)

	TPM Binding EEPROM	BIOS only
	(on China planar only)	BIOS only
	(on China planar only)

	iDRAC6 SDRAM	Embedded iDRAC OS for 108MB and 8MB for VGA frame buffer
		Embedded iDRAC OS for 108MB and 8MB for VGA frame buffer

	iDRAC6 FRU	Factory and iDRAC embedded OS

	iDRAC6 Boot Block	Loading flash memory requires a vendor-provided firmware file and
	Flash	loader program which is executed by booting up the system from a
		floppy or OS-based executable or out of band firmware updates
		across the management network. Bad contents yield the iDRAC
		inoperable and unrecoverable in the customer environment. The
		lifecycle log is automatically updated by the iDRAC as various system
		component firmware, hardware, and software versions change.

	Trusted Platform	Using TPM-enabled operating systems; except in China where TCM is
	Module	used.

Chipset

CMOS

BIOS control only via input such as BIOS F2 menu user configuration settings (such as boot order)

Control Panel

Internal USB

Either read only license key or OS control copies

iDRAC6 Enterprise

vFlash

Preloaded media before installation, or remote out-of-band upload of user data (i.e., ISO images, files) or local server read/write capability to use like a hard disk.

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PowerEdge R210 Technical Guide

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Dell R210 manual Dell, How is data input to this memory?, Chipset, Control Panel, iDRAC6 Enterprise

Contents

Dell PowerEdge R210 Technical Guide Initial Release PowerEdge R210 Technical GuideDell April Table of Contents Dell Tables Figures 1 Product Comparison Comparison of PowerEdge Server Features PowerEdge R210 Technical Guide Dell PowerEdge R210 Technical Guide 2.2 Detailed Information 2 New Technologies2.1 Overview 2.2.1 System Management S100 Feature/SpecComparison Overview PERC S100 and S300 S300 2.2.3 eSATA Table 3. eSATA Modes 3 System Overview Table 4. Product Feature Summary Microsoft Non- Factory Installed OS Option Power SupplyMicrosoft Factory Installed OS Options Factory Installed Linux OS Options 4 Mechanical 4.2 Dimensions and Weight4.1 Chassis Description Figure 1. Server Dimensions 4.3 Front Panel View and FeaturesFigure 2. Front Panel View 4.6 NIC Indicators 4.4 Back Panel View and Features4.5 Power Supply Indicators 4.5.1 Power Button LED 4.7 Side View Figure 5. Side View 4.8 Internal Chassis View Figure 6. Internal Chassis View Figure 7. R210 Static Rails 4.9 RailsFigure 8. R210 Mounted In Four-Post Square-Hole Rack 4.12 Security 4.10 Fans4.11 Control Panel LED 4.12.1 Top Cover Lock Mechanism TPM Pin Signals 4.12.4 Power Switch Security4.12.5 Intrusion Alert Figure 10. Intrusion Switch 4.13 USB Ports 4.14 Battery4.12.6 Secure Mode See the Hardware Owner’s Manual 4.16 User Accessible Jumpers, Sockets, and Connectors4.15 Field Replaceable Units FRU Figure 12. Battery on Motherboard 5.1 Power Supplies 5 Power, Thermal, Acoustic5.2 Power Supply Connectors on the Planar 5.3.2 Relative Humidity 5.3 Environmental Specifications5.3.1 Temperature 5.3.3 Maximum Vibration 5.6 Thermal 5.4 Power Supply Unit PSU Specifications5.5 ENERGY STAR Compliance See the ENERGY STAR Compliance results on Dell.com 5.7 Acoustics Definitions PowerEdge R210 Technical Guide 6.1 Overview 6.3 Processor Configurations6 Processors 6.2 Supported Processors 7.1 Overview 7 Memory7.2 DIMMs Supported 7.5 Sparing 7.3 Slots/Risers7.4 Speed 7.6 Mirroring 8.2 Direct Media Interface 8 Chipset8.1 Overview 8.3 PCI Express Interface 8.9 Compatibility Module 8.7 Low Pin Count LPC Interface8.8 Serial Peripheral Interface SPI 8.10 Advanced Programmable Interrupt Controller APIC 8.15.1 TCO Timer 8.14 Enhanced Power Management8.15 System Management Features 8.15.2 Processor Present Indicator 8.17 Intel Anti-Theft Technology 8.15.4 Function Disable8.16 System Management Bus SMBus 8.18 Intel Virtualization Technology for Directed I/O 8.19 JTAG Boundary-Scan 9 BIOS 9.1 Overview 9.3.1 Dell Active Power Controller 9.3 Power Management Modes9.2 ACPI 9.3.3 Maximum Performance 9.3.2 Power Saving BIOS Setting OS ControlTable 15. Summary of R210 Power Management Features CPU Power and Performance Management Table 16. Power Profiles that R210 BIOS will Expose in BIOS SetupActive Power Controller Memory Power and Performance Management 10 I/O Slots 10.1 Overview 10.2 PCI Devices PCI Express Root Port Matrox G200eW w/ 8MB memory Table 17. I/O Slot Information Table 19. Bandwidth, Quantities, and Priorities Table 18. PCI Card DimensionsPCIe 10.3 Boot Order 10.4 NICs 11.1 Overview 11 Storage11.2 Drives 11.4 Optical Disk Drive ODD 11.3 RAID ConfigurationsTable 21. RAID Configurations 11.5 Tape Drives Table 22. Supported Tape Drives 12.1 Video 12 Video and Audio12.2 Audio 13.2 Rails 13 Rack Information13.1 Overview 13.3 Cable Management Arm CMA Install 14 Operating SystemsInstallation Operating Table 25. Supported Linux Operating Systems InstallationInstall Operating 15 Virtualization Table 26. Supported Virtualization OS 16.1 Overview 16 Systems Management16.2 Server Management 16.4 Lifecycle Controller and Unified Server Configurator 16.3 Embedded Server Management 16.6 iDRAC6 Enterprise 16.5 iDRAC6 ExpressTable 27. Unified Server Configurator Features and Description Features List for BMC, iDRAC6, and vFlash Page 17.1 USB 17 Peripherals17.2 USB Device 17.3 External Storage Table 30. External Storage Table 31. AMF Single Pack Dimensions and Weights 18 Packaging OptionsTable 32. EMF Single Pack Dimensions and Weights Figure 16. Packaging Appendix A. Regulatory Certifications Appendix B. R210 Volatility Tables Table 33. PowerEdge R210 Volatility Dell Table 34. Volatility Data Writing and Purpose Table 35. Methodology for Data Input to Memory Chipset Table 36. Methodology for Memory Protection and Clearing Control Panel DellChipset iDRAC6 Enterprise