
LEADED (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE
Temperature (°C )
250
200
150
100
50
2nd  210~230°C 5sec.
 210~230°C 5sec.
140~180°C 60~120 sec.
Cooling down rate <3°C /sec.
Over 200°C 40~50sec.
0
| 60 | 
 | 120 | 180 | 
 | 240 | 
 | 300 | 
 | 
| 
 | 
 | Time ( sec. ) | 
 | 
 | 
 | 
 | 
 | 
 | 
Note: The temperature refers to the pin of S48SA, measured on the pin +Vout joint.
LEAD FREE (SAC) PROCESS RECOMMEND TEMP. PROFILE
| . | 
 | 
 | 
| Temp | Peak Temp. 240 ~ 245 ℃ | 
 | 
| 
 | 
 | |
| 217℃ | 
 | Ramp down | 
| 200℃ | 
 | max. 4℃/sec. | 
| 
 | 
 | |
| 150℃ | Preheat time | 
 | 
| 
 | 100~140 sec. | Time Limited 90 sec. | 
| 
 | 
 | |
| 
 | Ramp up | above 217℃ | 
| 
 | 
 | |
| 25℃ | max. 3℃/sec. | 
 | 
| 
 | Time | |
| 
 | 
 | 
Note: The temperature refers to the pin of S48SA, measured on the pin +Vout joint.
11
DS_S48SA1R812_06012006
