Fairchild BSS84 Electrical Characteristics, On Characteristics Note, Dynamic Characteristics

Electrical Characteristics		TA = 25°C unless otherwise noted
Symbol	Parameter	Test Conditions			Min	Typ	Max	Units
Off Characteristics
BVDSS	Drain–Source Breakdown Voltage	VGS = 0 V,	ID = –250 µ A		–50			V
∆ BVDSS	Breakdown Voltage Temperature	ID = –250 µ A,Referenced to 25° C				–48		mV/° C
∆ TJ	Coefficient
IDSS	Zero Gate Voltage Drain Current	VDS = –50 V,	VGS = 0 V				–15	µ	A
		VDS = –50 V,VGS = 0 V TJ = 125° C					–60	µ	A
IGSS	Gate–Body Leakage.	VGS = ± 20 V,	VDS = 0 V				± 10	nA
On Characteristics (Note 2)
VGS(th)	Gate Threshold Voltage	VDS = VGS,	ID = –1 mA		–0.8	–1.7	–2	V
∆ VGS(th)	Gate Threshold Voltage	ID = –1 mA,Referenced to 25° C				3		mV/° C
∆ TJ	Temperature Coefficient
RDS(on)	Static Drain–Source	VGS = –5 V,	ID = –0.10 A			1.2	10	Ω
	On–Resistance	VGS = –5 V,ID = –0.10 A,TJ=125° C				1.9	17
ID(on)	On–State Drain Current	VGS = –5 V,	VDS = – 10 V		–0.6			A
gFS	Forward Transconductance	VDS = –25V,	ID = – 0.10 A		0.05	0.6		S
Dynamic Characteristics
Ciss	Input Capacitance	VDS = –25 V,	V GS = 0 V,			73		pF
Coss	Output Capacitance	f = 1.0 MHz				10		pF
Crss	Reverse Transfer Capacitance					5		pF
RG	Gate Resistance	VGS = –15 mV, f = 1.0 MHz				9		Ω
Switching Characteristics (Note 2)
td(on)	Turn–On Delay Time	VDD = –30 V,	ID = – 0.27A,			2.5	5	ns
tr	Turn–On Rise Time	VGS = –10 V,	RGEN = 6 Ω			6.3	13	ns
td(off)	Turn–Off Delay Time					10	20	ns
tf	Turn–Off Fall Time					4.8	9.6	ns
Qg	Total Gate Charge	VDS = –25 V,	ID = –0.10 A,			0.9	1.3	nC
Qgs	Gate–Source Charge	VGS = –5 V				0.2		nC
Qgd	Gate–Drain Charge					0.3		nC
Drain–Source Diode Characteristics and Maximum Ratings
IS	Maximum Continuous Drain–Source Diode Forward Current						–0.13	A
VSD	Drain–Source Diode Forward	VGS = 0 V,	IS = –0.26 A(Note 2)			–0.8	–1.2	V
	Voltage
trr	Diode Reverse Recovery Time	IF = –0.10A				10		nS
Qrr	Diode Reverse Recovery Charge	diF/dt = 100 A/µs		(Note 2)		3		nC

Notes:

1.Rθ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. Rθ JC is guaranteed by design while Rθ CA is determined by the user's board design.

a) 350°C/W when mounted on a minimum pad..

Scale 1 : 1 on letter size paper

2. Pulse Test: Pulse Width ≤ 300 ∝ s, Duty Cycle ≤ 2.0%

BSS84

BSS84 Rev B(W)