Henkel 3609TM manual Typical Performance of Cured Material, General Information

TDS LOCTITE® 3609™, March 2008

Electrical Properties:
Surface Resistivity, IEC 60093, Ω	2×1015
Volume Resistivity, IEC 60093, Ω·cm	2×1015
Surface Insulation Resistance, Ω:
SN 59651:
Initial	0.1×109
Aged for 4 days @ 40 °C, 93 % RH	10×109
Aged for 21 days @ 40 °C, 93 % RH	1×109
Electrolytic Corrosion, DIN 53489	AN-1.2
Dielectric Constant / Dissipation Factor, IEC 60250:
1 kHz	3.7	/ 0.009
10 kHz	3.3	/ 0.03
1,000 kHz	3.2	/ 0.03
10,000 kHz	3.1	/ 0.03

Chemical/Solvent Resistance

Aged under conditions indicated and tested @ 22 °C.

		% of initial strength
Environment	°C	100 h	500 h	1000 h
Air	22	100	100	95
Air	150	85	70	70
Heat/humidity 98% RH	40	110	110	100

Resistance to Hot Solder Dip

Cured for 90 seconds @ 150 °C

Hot Solder Dip, IPC SM817, TM-650 Method 2.4.42.1, Pass/Fail:

R-1206 on bare FR4 board:
Supported 60 seconds above solder	Pass
bath @ 260°C and dipped for 10
seconds

TYPICAL PERFORMANCE OF CURED MATERIAL

Adhesive Properties

Cured for 10 minutes @ 110 °C
Push-off Strength:
C-1206 on bare FR4 board	N	≥20LMS
	(lb)	(≥4.5)
Cured for 5 minutes @ 125 °C
Pull-off Strength, Siemens norm SN59651:
C-1206 on bare FR4 board	N	40 to 80
	(lb)	(9 to 18)
Torque Strength, IPC SM817 , TM-650 Method 2.4.42:
C-1206 on bare FR4 board	N·mm	30 to 70
	(in.oz)	(4 to 10)

Cured for 30 minutes @ 150 °C

Lap Shear Strength, ISO 4587:

Steel (grit blasted)N/mm² ≥10LMS

(psi) (≥1,450)

Bond strength achieved in practice will vary considerably depending on the SMD component type, adhesive dot size and the type, grade and degree of cure of the solder mask/resist.

Resistance to Process Conditions

Cured for 90 seconds @ 150 °C

Torque Strength, IPC SM817 , TM-650 Method 2.4.42, % of initial strength retained:

C-1206 on bare FR4 board:
Aged 30 seconds preheat to 100°C	100
and 3 seconds @ 260°C with flux and
wave solder

Resistance to Lead Free Solder

LOCTITE® 3609™ can be used in lead free wave solder with both water based and alcohol based fluxes

Lead Free Solder Test Conditions

Flux Types	Multicore MF200 (alcohol based) and
	Multicore MF300 (water based)
Wave Condition	100°C pre-heat with dual wave at 260°C
Components	C1608 bonded with twin dot 0.8mm
	SOD 80 bonded with single dot 1.1mm
Result	No component loss in the wave

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet (MSDS).

Directions for use

1.LOCTITE® 3609™ is supplied de-aerated in a range of

TYPICAL ENVIRONMENTAL RESISTANCE

Cured for 30 minutes @ 150 °C

Lap Shear Strength, ISO 4587:

Mild steel (grit blasted)

Hot Strength

Tested at temperature

at22°C	100
	75
Strength	50
Initial%	25
	0

0	25	50	75	100	125	150	175
			Temperature, °C

ready-to-use syringes which fit straight into a variety of air pressure/time dispensing systems commonly available.

2.After storage in a refrigerator the adhesive must be allowed to equilibrate to room temperature before use, typically 2 to 4 hours.

3.Avoid cross contamination with other adhesive residues by ensuring dispense nozzels, adapters etc. are thoroughly cleaned.

4.Do not leave dirty nozzles on dispensing equipment while not in use or soaking in solvents for long periods of time.

5.The quantity of adhesive dispensed will depend on the dispense pressure, time, nozzle size and temperature.

6.These parameters will vary depending on the type of dispensing system used and should be optimised accordingly.

7.Dispensing temperature should ideally be controlled at a value between 30 °C to 35 °C for optimum results, however higher dispense temperatures are possible.

8.LOCTITE® 3609™ can also be dispensed using positive displacement pump systems.

9.The product is not recommended for dispensing by pin

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