refractory ceramic fibers

 

 

Components, parts and materials containing

NO

0

radioactive substances

 

 

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.

Tool Description

 

Tool Size (if

 

 

 

applicable)

 

Description #1 Cross screwdriver

#1

 

Description #2 P1 screwdriver

#1

 

Description #3

 

 

 

Description #4

 

 

 

Description #5

 

 

 

 

 

 

 

3.0Product Disassembly Process

3.1List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1.Take off the battery package from system bottom side.

2.Release DIMM/HDD door knob and take off DIMM/HDD door.

3.Loose HDD & ODD module screws and take off HDD & ODD module from system.

4.Loose WLAN/WWAN screws and take off WLAN/WWAN,DIMM module from system.

5.Loose KB module screw, and then take off KB module.

6.Loose L-case to U-case screws on bottom side & U-case to L-case screw on top side, and take off U-case from system.

7.Loose the screw of the speaker ,power board, function board, touchpad module, FPR, SD board ,and USB board then take off them.

8.Loose screw of hinge to L-case, take off LCD module from L-case.

9.Loose screw of MB to U-case, take off MB. Loose screw of thermal module from MB, take off thermal module

10.Loose screw and screw mylar, take off hinge cover and lcd bezel.

11.Loose LCD & Hinge screw, take off LCD , hinge and panel.

3.2Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00

Page 2

Template Revision B

 

 

PSG instructions for this template are available at EL-MF877-01