System Overview

Table 2-1 shows the differences in features between the different PC series based on form factor.

Table 2-1

Feature Differences by Form Factor

 

USDT

SFF

MT

CMT

 

 

 

 

 

Thermal Design Power (TPD)

65 W

95 W

95 W

95 W

(processor)

 

 

 

 

 

 

 

 

 

# and type of memory sockets

2 DDR3

4 DDR3

4 DDR3

4 DDR3

 

SODIMMs

UDIMMs

UDIMMs

UDIMMs

 

 

 

 

 

Serial ports

0

1 std.,

1 std.,

1 std.,

 

 

1 opt. [1]

1 opt. [1]

1 opt. [1]

 

 

 

 

 

Parallel ports

0

optional

optional

optional

 

 

 

 

 

Drive bays:

 

 

 

 

Externally accessible

1 [9]

1 - 5.25”

2 - 5.25” [7]

3 - 5.25” [7]

Internal

 

1 - 3.50”

1 - 3.50”

 

1- 2.50”

1 - 3.50”

2 - 3.50” [8]

3 - 3.50” [8]

 

 

 

 

 

# of SATA/eSATA drives

2

3/1

4

5

supported:

 

 

 

 

 

 

 

 

 

MXM 3.0 slot?

Yes

No

No

No

 

 

 

 

 

PCIe slots:

 

(all low profile)

(all full height)

(all full height)

2.0 x16 (graphics)

 

1 [2]

1 [4]

1 [4]

2.0 x4 (x16 connector)

 

1 [2]

1 [5]

1 [5]

2.0 x1 connector

 

1 [3]

1 [6]

1 [6]

1.2 Mini Card

1

0

0

0

 

 

 

 

 

PCI 2.3 32-bit 5-V slot,

 

1

1 full-height

3 full-height

25-watt maximum

 

 

 

 

 

 

 

 

 

Power Supply Unit:

 

 

 

 

Module type

external

internal

internal

internal

Power rating

135- or180-watt

240-watt

320-watt

320-watt

NOTES:

[1]2nd serial port requires optional cable/bracket assembly.

[2]Low-profile, 25 W maximum.

[3]Low profile, 10-watt maximum

[4]Full-length;

75-watt maximum if PCIe x4 slot is not populated, 35-watt maximum if PCIe x4 slot is populated

[5]35-watt maximum

[6]Half-height, half-length, 10-watt maximum

[7]3.5” devices supported with adapters

[8]2.5” solid state drives supprted with adapter brackets

[9]Slimline bay

Technical Reference Guide

www.hp.com

2-3