HP 8673C/D

contents

Sections I through III and Section IV Part I

GENERAL INFORMATION

INSTALLATION

OPERATION

OPERATION VERlFlCATlON These sections are bound separately with a ate table of contents.

Section IV, Part 2

PERFORMANCE TESTS

Introduction ..... / . , , ......................

Section V

ADJUSTMENTS

Introduction .....................................

Safety Consideration& ...........................

Equipment Required .............................

Identical Circuit Board Assemblies ...............

Automated Adjustment Procedures ...............

Factory Selected Components ....................

Related Adjustments ............................

Power Supply Adjustments .....................

10 MHz Reference OadXlator Adjustment ........

Reference Loop (VCXO) Adjustment ............

M/N Loop Adjustments ........................

20/30 MHz (LFS) Loop Divider Bias

Adjustment ..................................

160-240 MHz (20130 MHz or LFS Loop)

vco Pretune .................................

LFS Loop Notch Filter Adjustment ..............

YTO Pretune Digital-to-Analog Converter

Adjustment ..................................

YTO Driver Adjustment ........................

YTO Loop Sampler Adjustments ................

YTO Loop Offset and FM Overmodulation

Adjustments .................................

YTO Loop Phase Detector Adjustments .........

FM Driver Adjustments ........................

FM Accuracy and Overmodulation

Adjustments .................................

SRD Bias Adjustment ..........................

YTM Tune Adjustment .........................

Clamp Adjustment .............................

YIG Tuned Filter Adjustment ...................

4.2GHz Oscillator Adjustment. .................

cw LO Clamp Adjustment .....................

Flatness and ALC Adjustments .................

AM Bandwidth Adjustment .....................

AM Accuracy and Meter Adjustment. ............

Pulse Modulation Adjustment ...................

Pulse Amplitude Control Adjustment ............

Sweep Out and Blanking/Marker

Adjustments .................................

Section VI

REPLACEABLEPARTS

Introduction ....................................

Restored Assemblies .............................

CONTENTS

 

 

 

 

 

 

Page

 

Abbreviations

...................................

 

.6~1

 

Replaceable

Parts List

...........................

.6.1

 

FactorySelectedPartEi(*)

tt

6-l

 

Parts

List

Backdating

(f)

.6-l

 

Part6

List

Updating

...........................

.6-l

separ-

Ordering

Information

...........................

.6-l

 

Parts Identification

 

.6-2

 

Recommended Spares

List

, ,

.6-2

Page

 

 

 

 

 

Section

VII

 

 

 

 

 

 

 

MANUAL

CHANGES

 

 

.4-l

 

 

 

 

 

 

Introduction

 

 

.7-l

 

 

 

 

Instrument

 

Improvement

Modifications

 

.7-l

.5-l

Improved Key Code Debouncing (Instrumenta

 

 

with serial number prefix 2332A)

 

.7-l

,5-l

Firmware

Update

Kit

 

 

 

.7-l

.5-l

 

 

 

 

 

Section

VIII

 

 

 

.5-l

 

 

 

 

 

 

 

 

.5-l

Introduction

 

 

SERVICE

 

 

.81

,5-Z

.....................................

 

 

 

 

 

.5-2

Failure

Modes

and

Service

Strategy

. ...

.8-I

.5-10

General

 

 

 

 

8

 

 

-1

.5-12

Turn-on

 

Errors

 

 

 

 

.8-l

.5-13

OperatorErrors..

............................

 

..8 .l

.5-16

Instrument

Perforxsance

out of

 

 

Specification

 

 

 

 

 

.8-l

 

 

 

 

 

.5-18

Catastrophic

Failures

 

 

 

.8-l

 

Service

Sheets

...................................

 

 

 

 

.8-l

.5-20

Manual

Backdating

(f)

 

 

 

.8-2

,522

Manual

Updating

 

 

 

 

 

 

(Manual

 

Changes

Supplement)

........ . .......

.8-2

 

 

.5-24

Safety

Considerations

 

 

 

S-2

.5-26

Before

Applying

Power

........................

 

 

.8-2

.5-27

Warnings

and Cautions

.......................

 

 

.8-2

 

After Swvice Safety Checks

 

-8-3

,530

Recommended

Test Equipment

..................

 

.8-3

.5-33

Service Tools, Aids and Information

 

.8-3

.5-36

Service

Accessotiea

+.

 

 

 

,823

 

Service

Functions

......

 

.8-3

,537

Signature

Analysis

 

 

 

.8-3

.6-39

Pozidriv

Screwdrivera

 

 

 

.8.3

.5-42

Tuning

Tools

 

.8-3

.5-44

Heat

Staking

Tools

 

 

 

.8-3

Hardware

 

 

 

 

 

 

 

.8-I2

.5-47

....................................

 

 

 

 

 

.5-52

Assembly

Locations

 

 

 

.a-12

.5-53

Parts

and Cable

Locations

 

 

8-12

,636

Test Points

and Adjustment

Looatiooes

 

.8-13

,540

Service

Aids

on Printed

Circuit

Boards

 

.8-13

5-63

Other

Service Documents

.....................

 

 

.8-13

Repair

and

F&placement

 

 

 

 

.8-13

.8-65

 

 

 

.5-71

After

Repair

Adjustment

Procedure

 

.8-13

 

Disassembly and Reassembly Procedures ..... *S-13

.5-71

Top and

Bottom

Cover Removal

 

.8-13

Front

Panel

Key

Cap Replacement

 

.8-13

 

 

 

Front

Panel

Switch Replacement

 

.8-13

 

Etched Circuits (Printed Circuit Boards)

,814

.,6-l

Electrostatic

Discharge

@SD)

Precautions ....

.8-15

.6-l

Module

Exchange

Program

...................

 

.8.15

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