Intel® 945GME Express
3.0Theory of Operation
3.1Block Diagram
Figure 1. Intel® 945GME Express Chipset Development Kit Block Diagram
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| Thermal | Intel® CoreTM 2 Duo |
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| XDP |
| Clocking | ||||
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| Sensor |
| processor |
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LVDS/ |
| LVDS |
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ALS/BLI |
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| FSB |
| IMVP 6 |
| Clocking | |
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| VR |
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CRT |
| VGA |
| 533/667 MHz |
| DIMM |
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| DDR VR | ||
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| Mobile Intel® |
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TVO |
| TVOUT |
| 945GME Express |
| Dual Channel DDR2 | SO- | DIMM | |
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| Chipset |
| 400/533/667 MHz |
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| (GMCH) |
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PCIE GFX | PCI Express / SDVO |
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| SO- | |
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| 945GME |
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| VREG |
| 3 | 4 |
7 USB Conn | USB 2.0 |
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| PCI 2.3 |
| Slot | Slot | |
1 Docking Conn |
| x4 DMI |
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| 5V PCI | 5V PCI | |||||
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| IDE |
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40 Pin Conn |
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| SATA Port 2 |
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| SATA Port 0 |
| Intel® 82801GHM |
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Cable Connect |
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Direct Connect |
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| PCIE Slot 0 |
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| PCIE Slot 1 |
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Serial, IrDA/ |
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CIR |
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| PCIe |
| LAN |
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| (82573E) |
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| SIO | LPC |
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2 - PS/2 |
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| Port 80h | LPC |
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Scan Matrix |
| SMC/KBC | FWH |
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AON |
| Decoder | Slot |
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Intel® CoreTM 2 Duo processor with the Mobile Intel® 945GME Express Chipset |
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Manual | May 2007 |
22 | Order Number: |
