Intel D2700 3.7 Reliability , 3.8 Environmental

Embedded Intel® Atom™ Processor D2700 with Intel® NM10 Express Chipset Development Kit User‘s Manual
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 Back and front panel host-powered USB devices (other than keyboard and mouse)
 Load: continuous read/write activity on external drive/peripheral
 LAN linked at 1000 Mb/s
 Load: continuous read/write benchmark on remote share
 All on board peripherals enabled (serial, parallel, audio, …)
Table 33. Maximum Load Configuration Current and Power Results
Output Voltage
3.3 V
5 V
12 V
-12 V
5 VSB
Maximum Load
4.78 A
6.32 A
2.01 A
0.05 A
0.72 A
3.7 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
sub-assembly random failure rates. The calculation is based on the Telcordia SR-332,
Method I Case 1 50% electrical stress, 55 ºC ambient. The MTBF prediction is used to
estimate repair rates and spare parts requirements.
The MTBF data was calculated from predicted data at 55 ºC. The Intel® Embedded
Board D2700 has an MTBF of at least 314,073 hours.
3.8 Environmental
Table 34 lists the environmental specifications for the board.
Table 34. Intel® Embedded Board D2700 Environmental Specifications
Parameter
Specification
Temperature
Non-Operating
-20 C to +70 C
Operating
0 C to +50 C
Shock
Unpackaged
50 g trapezoidal waveform
Velocity change of 170 inches/second²
Packaged
Half sine 2 millisecond
Product weight (pounds)
Free fall (inches)
Velocity change (inches/s²)
<20
36
167
21-40
30
152
41-80
24
136
81-100
18
118
Vibration
Unpackaged
5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged
10 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz