BIOS SETUP

Advanced Chipset Features

This Setup menu controls the configuration of the chipset.

Phoenix - AwardBIOS CMOS Setup Utility

Advanced Chipset Features

 

 

 

 

 

 

DRAM Timing Selectable

By SPD

ITEM HELP

 

 

CAS Latency Time

4

Menu Level >

 

 

DRAM RAS# to CAS# Delay

4

 

 

 

DRAM RAS# Precharge

4

 

 

 

Precharge delay (tRAS)

12

 

 

 

System Memory Frequency

533MHZ

 

 

 

SLP_S4# Assertion Width

1 to 2 Sec

 

 

 

System BIOS Cacheable

Enabled

 

 

 

Video BIOS Cacheable

Disabled

 

 

 

Memory Hole at 15M-16M

Disabled

 

 

 

PCI Express Root Port Func

Press Enter

 

 

 

** On-Chip VGA Setting **

 

 

 

 

PEG/On Chip VGA Control

Auto

 

 

 

PEG Force x1

Disabled

 

 

 

On-Chip Frame Buffer Size

8MB

 

 

 

DVMT Mode

DVMT

 

 

 

DVMT/FIXED memory Size

128MB

 

 

 

Onboard PCU-E LAN

Enable

 

 

 

Onchip ICH7 LAN

Enable

 

 

 

 

 

 

 

 

 

 

 

 

DRAM Timing Selectable

This option refers to the method by which the DRAM timing is selected. The default is By SPD.

CAS Latency Time

You can configure CAS latency time in HCLKs as 2 or 2.5 or 3. The system board designer should set the values in this field, depending on the DRAM installed. Do not change the values in this field unless you change specifications of the installed DRAM or the installed CPU.

DRAM RAS# to CAS# Delay

This option allows you to insert a delay between the RAS (Row Address Strobe) and CAS (Column Address Strobe) signals. This delay occurs when the SDRAM is written to, read from or refreshed. Reducing the delay improves the performance of the SDRAM.

 

 

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MB900-R User’s Manual

Page 38
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Intel MB900-R user manual Advanced Chipset Features, Dram Timing Selectable, CAS Latency Time, Dram RAS# to CAS# Delay

MB900-R specifications

The Intel MB900-R is an advanced embedded microcontroller designed for a variety of applications that require high performance, low power consumption, and robust connectivity options. Specifically built to cater to the needs of industrial automation, motor control, and IoT devices, the MB900-R series boasts a range of features that enhance its versatility and usability.

One of the standout characteristics of the MB900-R is its powerful multi-core architecture. It often integrates several cores, enabling it to handle simultaneous tasks efficiently. This feature is particularly beneficial in applications that require real-time processing and quick responsiveness.

The device is built on Intel's modern manufacturing processes, which ensure exceptional energy efficiency. This makes the MB900-R suitable for battery-operated devices and applications where power conservation is critical. Its low thermal output contributes to reliability, even under heavy loads, which is essential for long-term deployment in industrial environments.

In terms of connectivity, the MB900-R offers a variety of interfaces, including SPI, I2C, UART, and Ethernet. Such capabilities facilitate seamless integration with numerous sensors and other peripherals, making it highly adaptable to different use cases. Furthermore, the microcontroller supports various wireless communication protocols, such as Bluetooth and Wi-Fi, enabling developers to create connected applications for the Internet of Things.

Moreover, the MB900-R series includes advanced security features, which are increasingly important in today’s connected landscape. With built-in encryption and secure boot processes, the device ensures data integrity and protection against unauthorized access, catering to sectors where data security is paramount.

The robust toolchain and software compatibility provided by Intel makes it easier for developers to create, debug, and deploy applications quickly. With support for multiple programming languages and development environments, the MB900-R allows for flexibility in coding, ensuring that developers can utilize the best tools for their specific needs.

Overall, the Intel MB900-R microcontroller exemplifies cutting-edge design and technology in embedded systems, making it an ideal choice for a wide range of high-performance, low-power applications across industries, including automotive, industrial, and consumer electronics. Its efficient architecture, extensive connectivity options, security features, and developer-friendly ecosystem position it as a vital component in the smart devices of tomorrow.