THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EPHY_TXD1
R5215 3.3K
EPHY_TDN
+3.3V_WOL
C5208
0.1uF
16V
EPHY_MDIO
EPHY_MDC
EPHY_EN
C5207
20pF
50V
ET_RXER
R52173.3K
+3.3V_WOL
R5200
3.3K
ET_RXER
+3.5V_WOL
WOL_CTL
C5211
0.1uF
16V
EPHY_RXD1
ET_COL/SNI
R4318
2.2K
EPHY_ACTIVITY
R5207 33
R521033
EPHY_INT
R4316
3.3K
ET_COL/SNI
+3.5V_WOL
C5206
20pF
50V
WOL/ETH_POWER_ON
+3.3V_WOL
EPHY_ACTIVITY
EPHY_RXD0
C5201
0.1uF
16V
R5203
3.3K
+3.3V_WOL
EPHY_TXD0
R5208 3.3K
LAN_JACK_POWER
Q4301
PMV48XP
G
D
S
C5205
0.1uF
16V
/RST_PHY
EPHY_REFCLK
R5201 33
OPT
R4317
22K
R5205
3.3K
L5200
BLM18PG121SN1D
120-ohm
+3.3V_WOL
EPHY_CRS_DV
+3.3V_WOL
R52021M
OPT
R5206 33
+3.5V_ST
Q4300
MMBT3904(NXP)
E
B
C
C4325
4.7uF
10V
R5212
1.5K
1/16W
1%
R5204
2.49K1%
EPHY_RDP
C5212
0.1uF
OPT
EPHY_RDN
EPHY_TDP
IC5200
RTL8201F-VB-CG
1
RSET
3
MDI+[0]
7
AVDD33_1
9
RXD[0]
10
RXD[1]
11
RXD[2]/INTB
12
RXD[3]/CLK_CTL
13
RXC
14
DVDD33
15
TXC
16
TXD[0]
17 TXD[1]
18 TXD[2]
19 TXD[3]
20 TXEN
21 PHYRSTB
22 MDC
23 MDIO
24 LED0/PHYAD[0]/PMEB
25 LED1/PHYAD[1]
26 CRS/CRS_DV
27 COL
28 RXER/FXEN
29 DVDD10OUT
30 AVDD33_2
31 CKXTAL1
32 CKXTAL2
5
MDI+[1]
8
RXDV
6
MDI-[1]
4
MDI-[0]
2
AVDD10OUT 33
[EP]
C5203
0.1uF
16V
+3.3V_WOL
R5209
51
C5202
5pF
R5218
0
C5209
33pF
X5200
25MHz
4
GND_2 1X-TAL_1
2GND_1
3
X-TAL_2
R5219
10K
1/16W
5%
R522033
R5221
33 OPT EDID_WP
C5200
4.7uF
10V

ETHERNET

WOL POWER ENABLE CONTROL

Place this cap. near IC
Ethernet Block
Route Single 50 Ohm, Differential 100 Ohm
Place this cap. near IC
Place 0.1uF close to each power pins
Place this Res. near IC
Place near IC

BSD-NC4_H052-HD

2012-09-12

(from SOC)
(PHY reset from MICOM)
Copyright © 2013 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only