TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 4 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W

7. Pinning information

7.1 Pinning

The SO32 package has four corner leads. These leads (1, 16, 17, and 32) are internally

connected to the die pad and must be connected to VSSA in the application. Together with

the applied copper area on the Printed Circuit Board (PCB) these leads determine the

ambient temperature, which affects the thermal resistance of the junction.

7.2 Pin description

Fig 2. Pin configuration
TFA9810
SO32
VSSD(HW) VSSD(HW)
IN1P STAB1
IN1N VSSP1
VDDA1 BOOT1N
VSSA1 OUT1N
SO/OL BOOT1P
ENABLE OUT1P
CDELAY VDDP1
n.c. VDDP2
DIAG OUT2P
TEST BOOT2P
VSSA2 OUT2N
VDDA2 BOOT2N
IN2N VSSP2
IN2P STAB2
VSSD(HW) VSSD(HW)
010aaa017
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
18
17
20
19
22
21
24
23
26
25
32
31
30
29
28
27
Table 3. Pin description
Symbol Pin Description
VSSD(HW) 1, 16, 17,
32 Negative digital supply voltage and handle wafer
IN1P 2 Positive input comparator channel 1
IN1N 3 Negative input comparator channel 1
VDDA1 4 Positive analog supply voltage channel 1
VSSA1 5 Negative analog supply voltage channel 1
SO/OL 6 SO/OL input enables self-oscillating / open-loop configuration
ENABLE 7 Enable input to switch between SLEEP and OPERATING
CDELAY 8 CDELAY input determines the switch on/off timing
n.c. 9 Not connected
DIAG 10 Diagnostic output; open drain
TEST 11 Test signal input; for testing purposes only
VSSA2 12 Negative analog supply voltage channel 2
VDDA2 13 Positive analog supply voltage channel 2