Panasonic EZASC, EZANC Recommended Soldering Conditions, Safety Precautions, Temperature

Chip 3-Terminal Capacitor Array

■Recommended Soldering Conditions

Recommendations and precautions are described below.

●Recommended soldering conditions for reflow

·Reflow soldering shall be performed a maximum of two times.

·Please contact us for additional information when used in conditions other than those specified. ·Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use.

Temperature	Peak
	Preheating
	Heating

For soldering (Example : Sn/Pb)

	Temperature	Time
Preheating	140 °C to 160 °C	60 s to 120 s
Main heating	Above 200 °C	30 s to 40 s
Peak	235 ± 5 °C	max. 10 s
For lead-free soldering (Example : Sn/Ag/Cu)
	Temperature	Time
Preheating	150 °C to 180 °C	60 s to 120 s
Main heating	Above 230 °C	30 s to 40 s
Peak	max. 260 °C	max. 10 s

Time

●Flow Soldering

We do not recommend flow soldering to the Chip 3-Terminal Capacitor Array: EZASC, because solder bridging may occur due to the narrow 0.8 mm pitch of EZASC. Please contact us regarding flow soldering of EZANC type.

Safety Precautions

The following are precautions for individual products. Please also refer to the precautions common to EMI Filters, Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog.

1.Take measures against mechanical stress during and after mounting of Chip 3-Terminal Capacitor Array (hereafter called the capacitor arrays) so as not to damage their electrodes and protective coatings.

Be careful not to misplace the capacitor arrays on the land patterns. Otherwise, solder bridging may occur.

2.Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the capacitors arrays' performance and/or reliability.

3.When soldering with a soldering iron, never touch the capacitor arrays' bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 ° C max.).

4.As the amount of applied solder becomes larger, the mechanical stress applied to the capacitor arrays increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.

5.Do not apply shock to the capacitor arrays or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the capacitor arrays' protective coatings and bodies may be chipped, affecting their performance.

6.Avoid excessive bending of printed circuit boards in order to protect the capacitor arrays from abnormal stress.

7.The static capacitance may decrease by a few percent from the time of shipment due to the characteristics peculiar to dielectric materials having a high dielectric constant.

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.	Feb. 2006