Chip
● Embossed Carrier Taping |
|
|
|
| ||||
t1 | Sprocket hole |
| Compartment |
|
| |||
|
|
|
| |||||
|
|
|
|
|
|
| ||
|
| fD0 |
|
|
|
|
|
|
| A |
|
|
|
| E |
| |
|
|
|
|
| F W |
| ||
|
| B |
|
|
|
|
| |
|
|
|
|
|
|
|
| |
t2 | fD1 | P1 | P2 | P0 | Tape running direction | |||
|
|
| ||||||
Chip component |
|
|
|
|
|
|
| |
Type | A | B |
| W |
| F | E | P0 |
EZASC | 2.50±0.20 | 4.40±0.20 |
|
|
|
|
| |
Dimensions |
|
|
| 12.00±0.30 | 5.50±0.20 | 1.75±0.20 | 4.00±0.10 | |
(mm) EZANC | 3.50±0.20 | 6.80±0.20 |
|
|
|
|
| |
| Type | P1 | P2 | fD0 | t1 | t2 | fD1 | |||
|
|
|
|
|
|
|
|
|
|
|
Dimensions | EZASC |
| ±0.10 |
| ±0.05 | +0.10 |
| ±0.05 | 1.15±0.20 | +0.10 |
(mm) | EZANC | 4.00 |
| 2.00 |
| 1.50−0 | 0.25 |
| 1.30±0.20 | 1.50−0 |
|
|
|
|
|
|
|
| |||
|
|
|
|
|
|
|
|
|
|
|
●Taping Reel
T
fC
fB
fA |
|
| W | |
|
| |||
|
|
|
|
|
|
|
|
|
|
Dimensions | fA | fB | fC | |
|
|
|
| |
(mm) | +0 | 60 min. | ±1.0 | |
| 180−3.0 | 13.0 | ||
|
|
|
|
|
|
|
|
|
|
Dimensions | W |
|
| T |
|
|
|
| |
(mm) | 13.0±1.0 |
|
| 15.4±2.0 |
■Recommended Land Pattern Design
Chip
(EZANC/EZASC)
f2
c
f1 | a | e | GND |
d
b
Land pattern
P
Solder resistant
| Type | a | b | c | d | e | f1 |
| f2 |
| P |
|
|
|
|
|
|
|
|
|
| ||
Dimensions | EZASC | 1.2 to 1.4 | 0.4 | 3.1 to 3.3 | 0.4 to 0.5 | 0.8 | 2.9 to 3.3 | 4.8 to 5.2 | 0.8 | ||
(mm) | EZANC | 2.2 to 2.4 | 0.4 to 0.6 | 5.7 to 5.9 | 0.4 to 0.8 | 1.8 | 4.2 to | 4.6 | 7.5 to | 7.9 | 1.27 |
|
|
|
|
|
|
|
|
|
|
|
|
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. |
|
Should a safety concern arise regarding this product, please be sure to contact us immediately. | Feb. 2006 |
|
